Microelectromechanical systems (MEMS) are often used in portable electronic devices that are vulnerable to mechanical shock or impact, such as that induced due to accidental drops on the ground. This work presents a modeling and simulation effort to investigate the effect of the vibration of a printed circuit board (PCB) on the dynamics of MEMS microstructures when subjected to shock. Two models are investigated. In the first model, the PCB is modeled as an Euler-Bernoulli beam to which a lumped model of a MEMS device is attached. In the second model, a special case of a cantilever microbeam is studied and modeled as a distributed-parameter system, which is attached to the PCB. These lumped-distributed and distributed-distributed models are discretized into ordinary differential equations, using the Galerkin method, which are then integrated numerically over time to simulate the dynamic response. Results of the two models are compared against each other for the case of a cantilever microbeam and also compared to the predictions of a finite-element model using the software ANSYS. The influence of the higher order vibration modes of the PCB, the location of the MEMS device on the PCB, the electrostatic forces, damping, and shock pulse duration are presented. It is found that neglecting the effects of the higher order modes of the PCB and the location of the MEMS device can cause incorrect predictions of the response of the microstructure and may lead to failure of the device. It is noted also that, for some PCB designs, the response of the microstructure can be amplified significantly causing early dynamic pull-in and hence possibly failure of the device.
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December 2011
Research Papers
Modeling the Effects of the PCB Motion on the Response of Microstructures Under Mechanical Shock
Abdallah H. Ramini,
Abdallah H. Ramini
Department of Mechanical Engineering,
State University of New York at Binghamton
, Binghamton, NY 13902
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Mohammad I. Younis,
Mohammad I. Younis
Department of Mechanical Engineering,
e-mail: myounis@binghamton.edu
State University of New York at Binghamton
, Binghamton, NY 13902
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Ronald Miles
Ronald Miles
Department of Mechanical Engineering,
State University of New York at Binghamton
, Binghamton, NY 13902
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Abdallah H. Ramini
Department of Mechanical Engineering,
State University of New York at Binghamton
, Binghamton, NY 13902
Mohammad I. Younis
Department of Mechanical Engineering,
State University of New York at Binghamton
, Binghamton, NY 13902e-mail: myounis@binghamton.edu
Ronald Miles
Department of Mechanical Engineering,
State University of New York at Binghamton
, Binghamton, NY 13902J. Vib. Acoust. Dec 2011, 133(6): 061019 (9 pages)
Published Online: November 28, 2011
Article history
Received:
April 13, 2010
Revised:
September 18, 2011
Online:
November 28, 2011
Published:
November 28, 2011
Citation
Ramini, A. H., Younis, M. I., and Miles, R. (November 28, 2011). "Modeling the Effects of the PCB Motion on the Response of Microstructures Under Mechanical Shock." ASME. J. Vib. Acoust. December 2011; 133(6): 061019. https://doi.org/10.1115/1.4005219
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