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Keywords: semiconductor technology
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Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Tribol. April 2007, 129(2): 436–437.
Published Online: November 13, 2006
... bonds (chemical) planarisation semiconductor technology Chemical-mechanical polishing (CMP) is widely used in planarizing semiconductor wafers. Understanding of the fundamental CMP mechanisms may offer insight into the control and optimization of the polishing/planarization processes. One...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Tribol. January 2005, 127(1): 190–197.
Published Online: February 7, 2005
... received December 2, 2003; revision received June 3, 2004. Review conducted by: L. Chang. 02 December 2003 03 June 2004 07 02 2005 chemical mechanical polishing particle size slurries semiconductor technology integrated circuit technology Chemical Mechanical Polishing...