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Keywords: permeability
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Tribol. January 2011, 133(1): 011703.
Published Online: December 21, 2010
... as well as the heat conduction equations in the bounding solids are properly formulated to determine the temperature fields corresponding to the domains between grooves. Roughness, centrifugal force, deformability, and permeability of the friction material with grooves are taken into account. The effects...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Tribol. January 2011, 133(1): 011701.
Published Online: December 3, 2010
... to cause pneumatic hammer instability. Therefore, to avoid this instability, a surface-restricted layer that has permeability smaller than the bulk of the porous material is usually formed on the bearing surface. In this paper, the dynamic characteristics of aerostatic porous journal bearings that have...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Tribol. July 2009, 131(3): 031701.
Published Online: May 27, 2009
... length, the electroviscosity, the charge density, the stress jump parameter, and the porous parameters (permeability, porosity, and porous film thickness). The considerations of EDL near the interface and the charge density of the flow in the porous media increase the apparent viscosity. The existence...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Tribol. October 2007, 129(4): 705–711.
Published Online: April 18, 2007
... resistance’s permeability. For gas bearings, the pressure difference is normally higher, and it is known experimentally that the mass flow rates are lower than would result from Darcy’s law. Forchheimer’s law adds an inertial term to Darcy’s law and, when an appropriate coefficient is selected for this term...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Tribol. July 2003, 125(3): 582–586.
Published Online: June 19, 2003
... phenomena pressure measurement elastic moduli permeability Chemical mechanical polishing (CMP) is used as one of the critical processes in integrated circuit (IC) chip fabrication. The process is a micromachining technology whereby a silicon wafer surface is pressed against a compliant surface...