A design method for the thermoelectric cooling system is improved in this work based on a graphical approach. It is used to select an appropriate thermoelectric cooler (TEC) and determine the value of optimum input current. Theoretical analysis has been conducted to investigate the cooling performance of the system using the design method. Numerical simulation and experimental tests for the entire cooling system validate the calculation result, which indicates the high reliability of the theoretical design method. The temperature dependence of the heat sink resistance and the contact resistance are the major reasons for the small discrepancy. Research is then conducted based on the design method to investigate how a thermoelectric cooling system under natural convection performs, where the optimization of heat sinks at hot side of TEC is done by using the generalized correlations in the previous studies. Comparison is made between the thermoelectric cooling system and the bare-heat-sink system under natural convection. Results show that the thermal resistance of the heat sink attached to TEC is critical to the cooling performance of the whole system. Besides, TEC under natural convection can perform better than the passive cooling if the heat load is not very high (). The design process and results can provide a useful guidance for other thermal engineers.
Skip Nav Destination
Article navigation
October 2018
Research-Article
Design and Optimization of Thermoelectric Cooling System Under Natural Convection Condition
Xiaoyuan Ying,
Xiaoyuan Ying
University of Michigan-Shanghai Jiao Tong
University Joint Institute,
Shanghai Jiao Tong University,
No.800 Dongchuan Road,
Shanghai 200240, China
e-mail: Jessica.Ying@sjtu.edu.cn
University Joint Institute,
Shanghai Jiao Tong University,
No.800 Dongchuan Road,
Shanghai 200240, China
e-mail: Jessica.Ying@sjtu.edu.cn
Search for other works by this author on:
Fangming Ye,
Fangming Ye
GE Grid Solution Technology Center Co., Ltd.,
Shanghai 201114, China
e-mail: Fangming.ye@ge.com
No.500 Jiangyue Road
,Shanghai 201114, China
e-mail: Fangming.ye@ge.com
Search for other works by this author on:
Ruitao Liu,
Ruitao Liu
GE Grid Solution Technology Center Co., Ltd.,
Shanghai 201114, China
e-mail: Raymond.liu@ge.com
No.500 Jiangyue Road
,Shanghai 201114, China
e-mail: Raymond.liu@ge.com
Search for other works by this author on:
Hua Bao
Hua Bao
University of Michigan-Shanghai Jiao Tong
University Joint Institute,
Shanghai Jiao Tong University,
Shanghai 200240, China
e-mail: Hua.bao@sjtu.edu.cn
University Joint Institute,
Shanghai Jiao Tong University,
No.800 Dongchuan Road
,Shanghai 200240, China
e-mail: Hua.bao@sjtu.edu.cn
Search for other works by this author on:
Xiaoyuan Ying
University of Michigan-Shanghai Jiao Tong
University Joint Institute,
Shanghai Jiao Tong University,
No.800 Dongchuan Road,
Shanghai 200240, China
e-mail: Jessica.Ying@sjtu.edu.cn
University Joint Institute,
Shanghai Jiao Tong University,
No.800 Dongchuan Road,
Shanghai 200240, China
e-mail: Jessica.Ying@sjtu.edu.cn
Fangming Ye
GE Grid Solution Technology Center Co., Ltd.,
Shanghai 201114, China
e-mail: Fangming.ye@ge.com
No.500 Jiangyue Road
,Shanghai 201114, China
e-mail: Fangming.ye@ge.com
Ruitao Liu
GE Grid Solution Technology Center Co., Ltd.,
Shanghai 201114, China
e-mail: Raymond.liu@ge.com
No.500 Jiangyue Road
,Shanghai 201114, China
e-mail: Raymond.liu@ge.com
Hua Bao
University of Michigan-Shanghai Jiao Tong
University Joint Institute,
Shanghai Jiao Tong University,
Shanghai 200240, China
e-mail: Hua.bao@sjtu.edu.cn
University Joint Institute,
Shanghai Jiao Tong University,
No.800 Dongchuan Road
,Shanghai 200240, China
e-mail: Hua.bao@sjtu.edu.cn
1Corresponding author.
Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF THERMAL SCIENCE AND ENGINEERING APPLICATIONS. Manuscript received December 3, 2017; final manuscript received February 23, 2018; published online May 21, 2018. Assoc. Editor: Wei Li.
J. Thermal Sci. Eng. Appl. Oct 2018, 10(5): 051008 (9 pages)
Published Online: May 21, 2018
Article history
Received:
December 3, 2017
Revised:
February 23, 2018
Citation
Ying, X., Ye, F., Liu, R., and Bao, H. (May 21, 2018). "Design and Optimization of Thermoelectric Cooling System Under Natural Convection Condition." ASME. J. Thermal Sci. Eng. Appl. October 2018; 10(5): 051008. https://doi.org/10.1115/1.4039926
Download citation file:
Get Email Alerts
Research on thermal comfort of human body under localized automotive air conditioning
J. Thermal Sci. Eng. Appl
Temperature Analysis of Waveform Water Channel for High-Power Permanent Magnet Synchronous Motor
J. Thermal Sci. Eng. Appl
Related Articles
Increasing Life Span by Cooling the Laminated Core Segment of Motors to Reduce Material and Energy Costs Over the Lifecycle of Motors
J. Thermal Sci. Eng. Appl (December,2021)
Micro-Channel Cooling of Hot Spots Through Non-Uniform Aspect Ratio Designs
J. Thermal Sci. Eng. Appl (January,0001)
Thermoelectric Cooling Analysis Using Modified-Graphical-Method for Multidimensional-Heat-Transfer-System
J. Electron. Packag (September,2011)
Thermo-economic Limitations of Ambient Heat Rejection in Vertical Fin Arrays With Buoyancy-Driven Flow Enhancement Through the Chimney Effect
J. Thermal Sci. Eng. Appl (March,2017)
Related Proceedings Papers
Related Chapters
Thermoelectric Coolers Are Hot
Hot Air Rises and Heat Sinks: Everything You Know about Cooling Electronics Is Wrong
Thermoelectric Coolers
Thermal Management of Microelectronic Equipment
Outlook
Closed-Cycle Gas Turbines: Operating Experience and Future Potential