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Editorial Board

Editor-in-Chief

Dr. M. R. Mitchell, Mechanics & Materials, LLC, Flagstaff, AZ, USA

Editorial Board Members

  • Dr. Ali Abolmaali, Wayne State University, Detroit, MI, USA
  • Dr. Aziz Amoozegar, North Carolina State University, Raleigh, NC, USA
  • Dr. Farhad Aslani, University of Western Australia, Crawley, WA, Australia
  • Dr. Nemkumar Banthia, University of British Columbia, Vancouver, BC, Canada
  • Dr. Filippo Berto, University of Padua, Italy, and Norwegian University of Science and Technology, Trondheim
  • Dr. Krishna Prapoorna Biligiri, Indian Institute of Technology, Tirupati, Andhra Pradesh, India
  • Dr. Andrew F. Braham, University of Arkansas, Fayetteville, AR, USA
  • Dr. Andreas J. Brunner, Zürich, Switzerland
  • Professor Andrea Carpinteri, University of Parma, Parma, ITALY
  • Dr. Wen-Ruey Chang, Liberty Mutual Research Institute for Safety, Hopkinton, MA, USA
  • Dr. Dar Hao Chen, Texas A&M University, College Station, TX, USA
  • Dr. Tong Cui, Qualcomm Packaging, San Diego, CA, USA
  • Mr. John S. Dick, Alpha Technologies, Akron, OH, USA
  • Prof. Ying Fang, Xiamen University, Xiamen, China
  • Dr. Tâmara França, Mississippi State University, Starkville, MS, USA
  • Dr. Alessandro Gardi, RMIT University, Bundoora, VIC, Australia
  • Dr. Piotr Gas, AGH University of Science and Technology, Krakow, Poland
  • Dr. Yu-Ning Louis Ge, National Taiwan University, Taipei, Taiwan
  • Dr. Meng Guo, Beijing University of Technology, Beijing, China
  • Dr. Rajeev Kumar Gupta, University of Akron, Akron, OH, USA
  • Prof. Jim Hartman, AZGaitero Engineering, Tempe, AZ, USA
  • Dr. Leila Hashemian, University of Alberta, Edmonton, Alberta, Canada
  • Dr. Maryam Hojati, University of New Mexico, Albuquerque, NM, USA 
  • Mr. Hui-Min (Hui) Huang, National Institute for Standards and Technology (NIST), Gaithersburg, MD, USA
  • Dr. Xiaoming Huang, Southeast University, Nanjing, China
  • Mr. Thomas S. Jones, Howmet Research Corp., Whitehall, MI, USA
  • Dr. Amin Joodaky, Michigan State University, East Lansing, MI, USA
  • Dr. Sreeramesh Kalluri, Ohio Aerospace Institute, Brook Park, OH, USA
  • Dr. Sivakumar Kandasami, Larsen & Toubro Construction, Chennai, India
  • Dr. Xin Kang, Hunan University, Hunan, Changsha, China
  • Dr. Vistasp Karbhari, University of Texas at Arlington, Arlington, TX, USA
  • Dr. Behnoud Kermani, The Transtec Group, Inc., Enola, PA
  • Dr. Yong-Rak Kim, University of Nebraska-Lincoln, Lincoln, NE, USA
  • Dr. Young Hoon Kim, University of Louisville, Louisville, KY, USA
  • Dr. Eva Lantsoght, Delft University of Technology, Delft, Netherlands, and Universidad San Francisco de Quito
  • Dr. Mohammad J. Mahtabi, University of Tennessee at Chattanooga, Chattanooga, TN, USA
  • Dr. Susan M. Marvin, Federal Bureau of Investigation Laboratory, Quantico, VA, USA
  • Douglas C. Meier, National Institute of Standards and Technology, Gaithersburg, MD, USA
  • Dr.-Ing. Miomir Miljković, University of Niš, Niš, Serbia
  • Dr. Xueqian Ni, Central South University, Changsha, Hunan, China 
  • Mr. Thomas F. O’Connor, Milan, MI, USA
  • Dr. Božidar V. Popović, University of Montenegro, Podgorica, Montenegro
  • Dr. Luis Reis, Instituto Superior Técnico, Lisbon, Portugal
  • Dr. Elena Romeo, University of Parma, Parma, Italy
  • Dr. Gourab Saha, National Institute of Technology Rourkela, Sundargarh, India
  • Dr. Rajarshi Saha, Bridgelux, Inc., Livermore, CA
  • Dr. Scott A. Schroeder, Exponent, Los Angeles, CA, USA
  • Dr. Steven J. Shaffer, Shaffer Tribology Consulting, Campbell, CA, USA
  • Dr. Suraj Sharma, University of Georgia, Athens, GA, USA
  • Dr. Ranganath K. Shastri, Plastics Solutions, Midland, MI, USA
  • Dr. Punith V. Shivaprasad, Clemson University, Clemson, SC, USA
  • Dr. Mark Sidebottom, Miami University, Oxford, OH, USA
  • Dr. Cy (Chor-yiu) Sin, National Tsing Hua University, Hsinchu, Taiwan, R.O.C
  • Dr. C. Elizabeth Stokes, Mississippi State University, Starkville, MS, USA
  • Dr. Stein Sture, University of Colorado at Boulder, Boulder, CO, USA
  • Dr. Julian Tao, University of Akron, Akron, OH, USA
  • Dr. Ingrid Tomac, University of California, San Diego, San Diego, CA
  • Dr. Blanka Tomkova, Technical University of Liberec, Liberec, Czech Republic
  • Dr. Sabrina Vantadori, University of Parma, Parma, Italy
  • Dr. Sandra Varnaitė-Žuravliova, Center for Physical Sciences and Technology, Kaunas, Lithuania
  • Dr. Matthieu Vignes, Massey University Manawatu, Palmerston North, New Zealand
  • Dr. Hao Wang, Rutgers, The State University of New Jersey, Piscataway, NJ
  • Dr. Jinfeng Wang, Zhejiang University, Hangzhou, China
  • Dr. Shuying Wang, Central South University, Hunan, China
  • Dr. Shaopeng Wu, Wuhan University of Technology, Wuhan, China
  • Dr. Shenghua Wu, University of South Alabama, Mobile AL, USA
  • Professor Feipeng Xiao, Clemson University, Clemson, SC, USA
  • Dr. Yang Xiao, Chongqing University, Chongqing, China
  • Dr. Fangwei Yu, Chinese Academy of Sciences, Chengdu, China
  • Dr. Xiong Yu, Case Western Reserve University, Cleveland, OH, USA
  • Professor Menglan Zeng, Hunan University, Changsha, P.R. China
  • Dr. Henglong Zhang, Hunan University, Changsha, China
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