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Journal Articles

Mechanical Structure Design of Pressure Sensors With Temperature Self-Compensation for Invasive Blood Pressure Monitoring

Lianqiao Zhou, Qinlan Li, Xinkai Xu, Shuang Wei, Shugang Wang, Jingqiang Cui, Guosheng Wang, Chong Liu, Yewang Su
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. November 2024, 91(11): 111003.
Paper No: JAM-24-1180
https://doi.org/10.1115/1.4066087
Published Online: August 21, 2024
View Article titled, Mechanical Structure Design of Pressure Sensors With Temperature Self-Compensation for Invasive Blood Pressure Monitoring
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Topics: Blood, Design, Diaphragms (Mechanical devices), Diaphragms (Structural), Pressure, Pressure sensors, Temperature, Manufacturing, Elastic moduli
Journal Articles

One-Step Patterned Contact-Resistance-Free Stretchable Strain Sensors With High Linearity and Repeatability for Body-Motion Detection

Yuqun Lan, Guodong Liu, Shizhen Yin, Yang Zhao, Chong Liu, Lijuan Sun, Shuang Li, Yewang Su
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. July 2023, 90(7): 071004.
Paper No: JAM-22-1397
https://doi.org/10.1115/1.4056766
Published Online: March 16, 2023
View Article titled, One-Step Patterned Contact-Resistance-Free Stretchable Strain Sensors With High Linearity and Repeatability for Body-Motion Detection
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Topics: Design, Strain sensors, Deformation, Sensors, Finite element analysis
Includes: Supplementary data
Journal Articles

Optimal Design Towards High Performance of Sandwich Flexible Piezoelectric Energy Harvesters

Qinlan Li, Shuang Li, Lianqiao Zhou, Xinfang Cao, Yuqun Lan, Xinkai Xu, YongAn Huang, Yuli Chen, Yong Zhao, Chengjun Huang, Yanpeng Wei, Ya Yang, Yewang Su
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. June 2023, 90(6): 061007.
Paper No: JAM-22-1402
https://doi.org/10.1115/1.4056818
Published Online: March 3, 2023
View Article titled, Optimal Design Towards High Performance of Sandwich Flexible Piezoelectric Energy Harvesters
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Topics: Deformation, Density, Design, Displacement, Energy efficiency, Energy harvesting, Membranes, Stiffness, Theoretical analysis, Young's modulus
Includes: Supplementary data
Journal Articles

Buckling of Bulk Structures With Finite Prebuckling Deformation

Hongyu Zhao, Yewang Su
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. May 2022, 89(5): 051006.
Paper No: JAM-21-1446
https://doi.org/10.1115/1.4053726
Published Online: February 15, 2022
View Article titled, Buckling of Bulk Structures With Finite Prebuckling Deformation
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Topics: Buckling, Deformation, Stress, Constitutive equations
Journal Articles

Scaling Effects in the Mechanical System of the Flexible Epidermal Electronics and the Human Skin

Guodong Liu, Lijuan Sun, Yewang Su
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. August 2020, 87(8): 081007.
Paper No: JAM-20-1125
https://doi.org/10.1115/1.4047039
Published Online: May 29, 2020
View Article titled, Scaling Effects in the Mechanical System of the Flexible Epidermal Electronics and the Human Skin
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Topics: Electronics, Pressure, Skin, Plane strain
Journal Articles

A Spectral Microplane Model for the Anisotropic Damage Behavior of Shales

Mingyao Li, Xin Chen, Dong Zhou, Yewang Su
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. August 2020, 87(8): 081001.
Paper No: JAM-20-1089
https://doi.org/10.1115/1.4047005
Published Online: May 14, 2020
View Article titled, A Spectral Microplane Model for the Anisotropic Damage Behavior of Shales
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Topics: Anisotropy, Damage, Shales, Constitutive equations, Modeling
Journal Articles

A Traction-Free Model for the Tensile Stiffness and Bending Stiffness of Laminated Ribbons of Flexible Electronics

Shizhen Yin, Yewang Su
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research-Article
J. Appl. Mech. May 2019, 86(5): 051011.
Paper No: JAM-19-1043
https://doi.org/10.1115/1.4042920
Published Online: March 16, 2019
View Article titled, A Traction-Free Model for the Tensile Stiffness and Bending Stiffness of Laminated Ribbons of Flexible Electronics
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Topics: Flexible electronics, Plane strain, Stiffness, Stress, Traction, Poisson ratio
Journal Articles

New Analytic Free Vibration Solutions of Rectangular Thick Plates With a Free Corner by the Symplectic Superposition Method

Rui Li, Pengcheng Wang, Bo Wang, Chunyu Zhao, Yewang Su
Journal: Journal of Vibration and Acoustics
Publisher: ASME
Article Type: Research-Article
J. Vib. Acoust. June 2018, 140(3): 031016.
Paper No: VIB-17-1411
https://doi.org/10.1115/1.4038951
Published Online: February 9, 2018
View Article titled, New Analytic Free Vibration Solutions of Rectangular Thick Plates With a Free Corner by the Symplectic Superposition Method
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Topics: Corners (Structural elements), Free vibrations, Mode shapes, Plates (structures), Finite element methods, Boundary-value problems
Journal Articles

Strain-Limiting Substrates Based on Nonbuckling, Prestrain-Free Mechanics for Robust Stretchable Electronics

Maoyi Zhang, Hao Liu, Peng Cao, Bin Chen, Jianqiao Hu, Yuli Chen, Bing Pan, Jonathan A. Fan, Rui Li, Lijuan Zhang, Yewang Su
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research-Article
J. Appl. Mech. December 2017, 84(12): 121010.
Paper No: JAM-17-1460
https://doi.org/10.1115/1.4038173
Published Online: October 26, 2017
View Article titled, Strain-Limiting Substrates Based on Nonbuckling, Prestrain-Free Mechanics for Robust Stretchable Electronics
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Topics: Computer simulation, Deformation, Design, Electrodes, Electronics, Finite element analysis, Mechanical behavior, Skin, Stress-strain curves, Stress
Journal Articles

Post-Buckling Analysis of Curved Beams

Zhichao Fan, Jian Wu, Qiang Ma, Yuan Liu, Yewang Su, Keh-Chih Hwang
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research-Article
J. Appl. Mech. March 2017, 84(3): 031007.
Paper No: JAM-16-1561
https://doi.org/10.1115/1.4035534
Published Online: January 24, 2017
View Article titled, Post-Buckling Analysis of Curved Beams
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Topics: Buckling, Stress, Displacement, Deformation, Boundary-value problems, Elongation, Equilibrium (Physics)
Journal Articles

Buckling Behaviors of Staggered Nanostructure of Biological Materials

Zhiling Bai, Yewang Su, Baohua Ji
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research-Article
J. Appl. Mech. March 2016, 83(3): 031011.
Paper No: JAM-15-1586
https://doi.org/10.1115/1.4032116
Published Online: December 16, 2015
View Article titled, Buckling Behaviors of Staggered Nanostructure of Biological Materials
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Topics: Buckling, Crystals, Minerals, Proteins, Stress
Journal Articles

Impact Comminution of Solids Due to Progressive Crack Growth Driven by Kinetic Energy of High-Rate Shear

Zdeněk P. Bažant, Yewang Su
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research-Article
J. Appl. Mech. March 2015, 82(3): 031007.
Paper No: JAM-14-1593
https://doi.org/10.1115/1.4029636
Published Online: March 1, 2015
View Article titled, Impact Comminution of Solids Due to Progressive Crack Growth Driven by Kinetic Energy of High-Rate Shear
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Topics: Fracture (Materials), Kinetic energy, Shear (Mechanics), Size reduction (Materials), Particulate matter, Viscosity, Concretes, Damage
Journal Articles

Lateral Buckling of Interconnects in a Noncoplanar Mesh Design for Stretchable Electronics

Chi Chen, Weiming Tao, Yewang Su, Jian Wu, Jizhou Song
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research-Article
J. Appl. Mech. July 2013, 80(4): 041031.
Paper No: JAM-12-1497
https://doi.org/10.1115/1.4023036
Published Online: May 23, 2013
View Article titled, Lateral Buckling of Interconnects in a Noncoplanar Mesh Design for Stretchable Electronics
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Topics: Buckling
Journal Articles

Mechanics of Epidermal Electronics

Shuodao Wang, Ming Li, Jian Wu, Dae-Hyeong Kim, Nanshu Lu, Yewang Su, Zhan Kang, Yonggang Huang, John A. Rogers
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. May 2012, 79(3): 031022.
https://doi.org/10.1115/1.4005963
Published Online: April 5, 2012
View Article titled, Mechanics of Epidermal Electronics
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Topics: Electronics, Skin, Surface roughness, Silicones, Adhesion, Finite element analysis