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Yanwei Dai
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Journal Articles

An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging

Fei Qin, Qi He, Yanpeng Gong, Chuantao Hou, Hao Cheng, Tong An, Yanwei Dai, Pei Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021003.
Paper No: EP-22-1036
https://doi.org/10.1115/1.4055125
Published Online: August 18, 2022
View Article titled, An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging
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Topics: Boundary element methods, Finite element methods, Finite element model, Stiffness, Electronic packaging, Finite element analysis, Displacement, Traction
Journal Articles

Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling

Fei Qin, Shuai Zhao, Yanwei Dai, Lingyun Liu, Tong An, Pei Chen, Yanpeng Gong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031012.
Paper No: EP-21-1125
https://doi.org/10.1115/1.4053028
Published Online: December 27, 2021
View Article titled, Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling
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Topics: Cycles, Nanoindentation, Silver, Stress, Young's modulus, Stress-strain curves
Proceedings Papers

Mismatch Effect on the Mode II Type Crack Tip Field in Power-Law Creeping Materials

Yanwei Dai, Yinghua Liu, Yuh J. Chao
Proc. ASME. PVP2018, Volume 6A: Materials and Fabrication, V06AT06A036, July 15–20, 2018
Publisher: American Society of Mechanical Engineers
Paper No: PVP2018-84623
https://doi.org/10.1115/PVP2018-84623
View Paper titled, Mismatch Effect on the Mode II Type Crack Tip Field in Power-Law Creeping Materials
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Topics: Fracture (Materials), Creep, Heat, Stress
Proceedings Papers

Theoretical Analysis and Engineering Implications for the High Order Term Solutions of the Mode II Type Creep Crack

Yanwei Dai, Yinghua Liu, Yuh J. Chao
Proc. ASME. PVP2017, Volume 6A: Materials and Fabrication, V06AT06A047, July 16–20, 2017
Publisher: American Society of Mechanical Engineers
Paper No: PVP2017-65672
https://doi.org/10.1115/PVP2017-65672
View Paper titled, Theoretical Analysis and Engineering Implications for the High Order Term Solutions of the Mode II Type Creep Crack
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Topics: Creep, Fracture (Materials), Theoretical analysis, Plane strain, Engineering systems and industry applications, Failure, Finite element analysis, Fracture toughness
Proceedings Papers

Influences of T -Stress on Constraint Effect in Mismatched Modified Boundary Layer Model for Creep Crack

Yanwei Dai, Yinghua Liu, Haofeng Chen
Proc. ASME. PVP2016, Volume 3: Design and Analysis, V003T03A072, July 17–21, 2016
Publisher: American Society of Mechanical Engineers
Paper No: PVP2016-63220
https://doi.org/10.1115/PVP2016-63220
View Paper titled, Influences of T -Stress on Constraint Effect in Mismatched Modified Boundary Layer Model for Creep Crack
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Topics: Boundary layers, Creep, Fracture (Materials), Stress, High temperature
Journal Articles

The Interacting Effect for Collinear Cracks Near Mismatching Bimaterial Interface Under Elastic Creep

Yanwei Dai, Yinghua Liu, Haofeng Chen, Donghuan Liu
Journal: Journal of Pressure Vessel Technology
Publisher: ASME
Article Type: Research-Article
J. Pressure Vessel Technol. August 2016, 138(4): 041404.
Paper No: PVT-15-1137
https://doi.org/10.1115/1.4031725
Published Online: April 28, 2016
View Article titled, The Interacting Effect for Collinear Cracks Near Mismatching Bimaterial Interface Under Elastic Creep
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Topics: Creep, Fracture (Materials), Stress
Journal Articles

Mismatch Constraint Effect of Creep Crack With Modified Boundary Layer Model

Yanwei Dai, Donghuan Liu, Yinghua Liu
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research-Article
J. Appl. Mech. March 2016, 83(3): 031008.
Paper No: JAM-15-1548
https://doi.org/10.1115/1.4032025
Published Online: December 11, 2015
View Article titled, Mismatch Constraint Effect of Creep Crack With Modified Boundary Layer Model
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Topics: Creep, Fracture (Materials), Stress