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X. H. Zhang
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Journal Articles

Region-Reaching Control of a Flexible-Joint Manipulator

J. W. Yu, X. H. Zhang, J. C. Ji, J. Y. Tian, J. Zhou
Journal: Journal of Dynamic Systems, Measurement, and Control
Publisher: ASME
Article Type: Technical Briefs
J. Dyn. Sys., Meas., Control. November 2020, 142(11): 114503.
Paper No: DS-19-1543
https://doi.org/10.1115/1.4047697
Published Online: July 23, 2020
View Article titled, Region-Reaching Control of a Flexible-Joint Manipulator
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Topics: Manipulators, Control equipment
Journal Articles

Heat-Induced Evolution of Phase Transformations in Tetrahydrofuran Hydrate-Bearing Sediment

X. H. Zhang, X. B. Lu, Z. M. Zheng, L. M. Zhang
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. May 2014, 136(5): 052002.
Paper No: HT-12-1280
https://doi.org/10.1115/1.4026454
Published Online: March 6, 2014
View Article titled, Heat-Induced Evolution of Phase Transformations in Tetrahydrofuran Hydrate-Bearing Sediment
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Topics: Bearings, Heat, Phase transitions, Sediments, Temperature, Water, Heat conduction
Proceedings Papers

Finite Element Modeling of Pad Deformation due to Diamond Disc Conditioning in Chemical Mechanical Polishing (CMP)

Emmanuel A. Baisie, Z. C. Li, X. H. Zhang
Proc. ASME. MSEC2012, ASME 2012 International Manufacturing Science and Engineering Conference, 209-215, June 4–8, 2012
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2012-7364
https://doi.org/10.1115/MSEC2012-7364
View Paper titled, Finite Element Modeling of Pad Deformation due to Diamond Disc Conditioning in Chemical Mechanical Polishing (CMP)
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Topics: Deformation, Diamonds, Disks, Finite element analysis, Image processing, Modeling, Polishing
Proceedings Papers

Diamond Disc Pad Conditioning in Chemical Mechanical Planarization (CMP): A Mathematical Model to Predict Pad Surface Shape

Z. C. Li, Emmanuel A. Baisie, X. H. Zhang
Proc. ASME. MSEC2011, ASME 2011 International Manufacturing Science and Engineering Conference, Volume 1, 175-184, June 13–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2011-50149
https://doi.org/10.1115/MSEC2011-50149
View Paper titled, Diamond Disc Pad Conditioning in Chemical Mechanical Planarization (CMP): A Mathematical Model to Predict Pad Surface Shape
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Topics: Diamonds, Disks, Shapes, Semiconductor wafers, Abrasives, Kinematic analysis, Polishing, Semiconductors (Materials)
Proceedings Papers

Simulation of Diamond Disc Conditioning in Chemical Mechanical Polishing: Effects of Conditioning Parameters on Pad Surface Shape

Emmanuel A. Baisie, Z. C. Li, X. H. Zhang
Proc. ASME. MSEC2010, ASME 2010 International Manufacturing Science and Engineering Conference, Volume 2, 169-177, October 12–15, 2010
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2010-34264
https://doi.org/10.1115/MSEC2010-34264
View Paper titled, Simulation of Diamond Disc Conditioning in Chemical Mechanical Polishing: Effects of Conditioning Parameters on Pad Surface Shape
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Topics: Diamonds, Disks, Polishing, Shapes, Simulation
Proceedings Papers

Diamond Disc Pad Conditioning in Chemical Mechanical Polishing: A Literature Review of Process Modeling

Emmanuel A. Baisie, Z. C. Li, X. H. Zhang
Proc. ASME. MSEC2009, ASME 2009 International Manufacturing Science and Engineering Conference, Volume 1, 661-670, October 4–7, 2009
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2009-84033
https://doi.org/10.1115/MSEC2009-84033
View Paper titled, Diamond Disc Pad Conditioning in Chemical Mechanical Polishing: A Literature Review of Process Modeling
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Topics: Diamonds, Disks, Modeling, Polishing, Manufacturing, Process control, Semiconductor wafers
Proceedings Papers

An Economic Study on Chemical Mechanical Polishing of Silicon Wafers

Emmanuel A. Baisie, Man Yang, Ravindra Kaware, Maria Hooker, Z. C. Li, Wangping Sun, X. H. Zhang
Proc. ASME. MSEC2009, ASME 2009 International Manufacturing Science and Engineering Conference, Volume 1, 691-697, October 4–7, 2009
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2009-84072
https://doi.org/10.1115/MSEC2009-84072
View Paper titled, An Economic Study on Chemical Mechanical Polishing of Silicon Wafers
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Topics: Polishing, Semiconductor wafers, Flow charts, Sensitivity analysis
Proceedings Papers

Measurement Methods of Pad Properties for Chemical Mechanical Polishing

X. H. Zhang, Z. J. Pei, Graham R. Fisher
Proc. ASME. IMECE2007, Volume 3: Design and Manufacturing, 517-522, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-44013
https://doi.org/10.1115/IMECE2007-44013
View Paper titled, Measurement Methods of Pad Properties for Chemical Mechanical Polishing
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Topics: Polishing, Semiconductor wafers
Proceedings Papers

Chemical Mechanical Polishing of Silicon Wafers: Finite Element Analysis of Wafer Flatness

X. H. Zhang, Z. J. Pei, Graham R. Fisher
Proc. ASME. IMECE2005, Manufacturing Engineering and Materials Handling, Parts A and B, 893-900, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-80271
https://doi.org/10.1115/IMECE2005-80271
View Paper titled, Chemical Mechanical Polishing of Silicon Wafers: Finite Element Analysis of Wafer Flatness
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Topics: Finite element analysis, Polishing, Pressure, Semiconductor wafers
Journal Articles

A Mode III Crack in a Functionally Graded Piezoelectric Material Strip

B. L. Wang, X. H. Zhang
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Papers
J. Appl. Mech. May 2004, 71(3): 327–333.
https://doi.org/10.1115/1.1755692
Published Online: June 22, 2004
View Article titled, A Mode III Crack in a Functionally Graded Piezoelectric Material Strip
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Topics: Fracture (Materials), Stress, Piezoelectric materials, Strips