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Wenming Li
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. April 2023, 145(4): 041603.
Paper No: HT-22-1470
Published Online: February 3, 2023
Proceedings Papers
Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T15A015, July 10–14, 2016
Publisher: American Society of Mechanical Engineers
Paper No: HT2016-7438
Proceedings Papers
Tamanna Alam, Wenming Li, Fanghao Yang, Ahmed Shehab Khan, Yan Tong, Jamil Khan, Jing Li, Zuankai Wang, Chen Li
Proc. ASME. MNHMT2016, Volume 1: Micro/Nanofluidics and Lab-on-a-Chip; Nanofluids; Micro/Nanoscale Interfacial Transport Phenomena; Micro/Nanoscale Boiling and Condensation Heat Transfer; Micro/Nanoscale Thermal Radiation; Micro/Nanoscale Energy Devices and Systems, V001T03A009, January 4–6, 2016
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2016-6714
Proceedings Papers
Proc. ASME. MNHMT2016, Volume 1: Micro/Nanofluidics and Lab-on-a-Chip; Nanofluids; Micro/Nanoscale Interfacial Transport Phenomena; Micro/Nanoscale Boiling and Condensation Heat Transfer; Micro/Nanoscale Thermal Radiation; Micro/Nanoscale Energy Devices and Systems, V001T04A010, January 4–6, 2016
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2016-6712
Proceedings Papers
Proc. ASME. MNHMT2016, Volume 1: Micro/Nanofluidics and Lab-on-a-Chip; Nanofluids; Micro/Nanoscale Interfacial Transport Phenomena; Micro/Nanoscale Boiling and Condensation Heat Transfer; Micro/Nanoscale Thermal Radiation; Micro/Nanoscale Energy Devices and Systems, V001T04A011, January 4–6, 2016
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2016-6713
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A006, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48737