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Journal Articles

Solar Irradiance Fluctuation Prediction Methodology Using Artificial Neural Networks

Jane Oktavia Kamadinata, Tan Lit Ken, Tohru Suwa
Journal: Journal of Solar Energy Engineering
Publisher: ASME
Article Type: Research Papers
J. Sol. Energy Eng. June 2020, 142(3): 031003.
Paper No: SOL-19-1206
https://doi.org/10.1115/1.4045315
Published Online: November 26, 2019
View Article titled, Solar Irradiance Fluctuation Prediction Methodology Using Artificial Neural Networks
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Topics: Artificial neural networks, Solar radiation, Errors, Solar energy
Journal Articles

Thermal Modeling Technique for Multiple Transistors Within Silicon Chip

Tohru Suwa, Hamid Hadim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041015.
https://doi.org/10.1115/1.4005291
Published Online: December 23, 2011
View Article titled, Thermal Modeling Technique for Multiple Transistors Within Silicon Chip
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Topics: Finite element analysis, Heat, Modeling, Silicon chips, Temperature, Temperature distribution, Transistors
Proceedings Papers

Multi-Packaging-Level Thermal Modeling Technique for Silicon Chip Transistors

Tohru Suwa, Hamid Hadim
Proc. ASME. IMECE2009, Volume 9: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B and C, 1365-1372, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-11815
https://doi.org/10.1115/IMECE2009-11815
View Paper titled, Multi-Packaging-Level Thermal Modeling Technique for Silicon Chip Transistors
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Topics: Integrated circuits, Modeling, Packaging, Silicon chips, Transistors
Proceedings Papers

Multidisciplinary Design and Optimization for Oscillating Flow Polymerase Chain Reaction Microfluidics Device

Tohru Suwa, Hamid Hadim, Yong Shi
Proc. ASME. IMECE2009, Volume 2: Biomedical and Biotechnology Engineering, 187-193, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-11820
https://doi.org/10.1115/IMECE2009-11820
View Paper titled, Multidisciplinary Design and Optimization for Oscillating Flow Polymerase Chain Reaction Microfluidics Device
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Topics: Chain, Design, Flow (Dynamics), Microfluidics, Optimization, Transients (Dynamics)
Proceedings Papers

Optimal Placement of Heat Generating Components at Various Levels of Electronics Packaging

Tohru Suwa, Hamid Hadim
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 185-190, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-11795
https://doi.org/10.1115/IMECE2009-11795
View Paper titled, Optimal Placement of Heat Generating Components at Various Levels of Electronics Packaging
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Topics: Artificial neural networks, Electronic packaging, Heat, Optimization
Proceedings Papers

Multidisciplinary Heat Generating Logic Block Placement Optimization Using Genetic Algorithm

Tohru Suwa, Hamid Hadim
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 773-779, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33443
https://doi.org/10.1115/IPACK2007-33443
View Paper titled, Multidisciplinary Heat Generating Logic Block Placement Optimization Using Genetic Algorithm
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Topics: Electrical wires, Genetic algorithms, Heat, Optimization
Proceedings Papers

Multidisciplinary Placement Optimization of Heat Generating Semiconductor Logic Blocks

Tohru Suwa, Hamid Hadim
Proc. ASME. HT2008, Heat Transfer: Volume 2, 779-787, August 10–14, 2008
Publisher: American Society of Mechanical Engineers
Paper No: HT2008-56056
https://doi.org/10.1115/HT2008-56056
View Paper titled, Multidisciplinary Placement Optimization of Heat Generating Semiconductor Logic Blocks
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Topics: Design, Electrical wires, Heat, Optimization, Semiconductors (Materials)
Proceedings Papers

Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Boards Using Artificial Neural Networks

Tohru Suwa, Hamid A. Hadim
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2079-2086, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73178
https://doi.org/10.1115/IPACK2005-73178
View Paper titled, Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Boards Using Artificial Neural Networks
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Topics: Artificial neural networks, Electronic components, Heat, Optimization, Printed circuit boards, Genetic algorithms, Algorithms, Cascades (Fluid dynamics), Density, Electrical wires
Proceedings Papers

Integrated Thermomechanical Design and Optimization of BGA Packages Using Genetic Algorithm

Hamid A. Hadim, Tohru Suwa
Proc. ASME. HT-FED2004, Volume 4, 495-502, July 11–15, 2004
Publisher: American Society of Mechanical Engineers
Paper No: HT-FED2004-56512
https://doi.org/10.1115/HT-FED2004-56512
View Paper titled, Integrated Thermomechanical Design and Optimization of BGA Packages Using Genetic Algorithm
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Topics: Ball-Grid-Array packages, Design, Genetic algorithms, Optimization, Thermomechanics, Ball-Grid-Array packaging, Electronic packages, Electronic packaging, Electronics, Leakage
Proceedings Papers

A Multidisciplinary Design and Optimization Methodology in Electronics Packaging: Application to BGA Design

Hamid Hadim, Tohru Suwa
Proc. ASME. HT2003, Heat Transfer: Volume 3, 557-564, July 21–23, 2003
Publisher: American Society of Mechanical Engineers
Paper No: HT2003-47524
https://doi.org/10.1115/HT2003-47524
View Paper titled, A Multidisciplinary Design and Optimization Methodology in Electronics Packaging: Application to BGA Design
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Topics: Ball-Grid-Array packaging, Design, Electronic packaging, Optimization, Artificial neural networks, Electronic products, Engineering disciplines, Leakage, Packaging, Tradeoffs
Journal Articles

Multidisciplinary Design and Optimization Methodologies in Electronics Packaging: State-of-the-Art Review

Hamid Hadim, Tohru Suwa
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. September 2008, 130(3): 034001.
https://doi.org/10.1115/1.2957459
Published Online: July 30, 2008
View Article titled, Multidisciplinary Design and Optimization Methodologies in Electronics Packaging: State-of-the-Art Review
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Topics: Design, Electronic packaging, Optimization, Optimization algorithms
Proceedings Papers

Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Board in Channel Flow Forced Convection Using Artificial Neural Networks

Tohru Suwa, Hamid Hadim
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 339-347, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-81483
https://doi.org/10.1115/IMECE2005-81483
View Paper titled, Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Board in Channel Flow Forced Convection Using Artificial Neural Networks
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Topics: Artificial neural networks, Channel flow, Electronic components, Forced convection, Heat, Optimization, Printed circuit boards, Temperature, Junctions, Heat flux
Proceedings Papers

Integrated Multidisciplinary Design and Optimization Methodologies in Electronics Packaging: State-of-the-Art Review

Tohru Suwa, Hamid Hadim
Proc. ASME. IMECE2006, Heat Transfer, Volume 3, 275-286, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-15283
https://doi.org/10.1115/IMECE2006-15283
View Paper titled, Integrated Multidisciplinary Design and Optimization Methodologies in Electronics Packaging: State-of-the-Art Review
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Topics: Design, Electronic packaging, Optimization, Artificial neural networks, Experimental design, Modeling, Numerical analysis, Computation, Computer-aided design, Graphical user interfaces
Journal Articles

Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Boards

Tohru Suwa, Hamid Hadim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 90–97.
https://doi.org/10.1115/1.2429715
Published Online: April 19, 2006
View Article titled, Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Boards
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Topics: Genetic algorithms, Heat, Junctions, Optimization, Temperature, Electrical wires, Density, Artificial neural networks, Electronic components
Journal Articles

A Multidisciplinary Design and Optimization Methodology for Ball Grid Array Packages Using Artificial Neural Networks

Hamid Hadim, Tohru Suwa
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 306–313.
https://doi.org/10.1115/1.1997161
Published Online: November 16, 2004
View Article titled, A Multidisciplinary Design and Optimization Methodology for Ball Grid Array Packages Using Artificial Neural Networks
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Topics: Artificial neural networks, Design, Optimization, Ball-Grid-Array packaging, Ball-Grid-Array packages, Solders