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Sushil Bhavnani
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Proceedings Papers

Flow Distribution and Nucleation Suppression in a Small Form Factor Liquid Immersion Cooled Server Model

Sriram Chandrasekaran, Sushil Bhavnani
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A022, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74025
https://doi.org/10.1115/IPACK2017-74025
View Paper titled, Flow Distribution and Nucleation Suppression in a Small Form Factor Liquid Immersion Cooled Server Model
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Topics: Flow (Dynamics), Nucleation (Physics), Cooling, Boiling, Data centers, Fluids, Silicon, Bubbles, Electronics, Energy consumption
Journal Articles

Directional Passive Condensate Film Drainage on a Horizontal Surface With Periodic Asymmetrical Structures

Shashank Natesh, Eric Truong, Vinod Narayanan, Sushil Bhavnani
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. November 2017, 139(11): 111507.
Paper No: HT-16-1662
https://doi.org/10.1115/1.4036708
Published Online: June 21, 2017
View Article titled, Directional Passive Condensate Film Drainage on a Horizontal Surface With Periodic Asymmetrical Structures
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Topics: Condensed matter, Drainage, Liquid films, Subcooling, Condensation, Visualization, Fluids, Temperature, Heat transfer coefficients
Journal Articles

Single- and Two-Phase Particle Image Velocimetry Characterization of Fluid Flow Within a Liquid Immersion Cooled Electronics Module

Joshua Gess, Sushil Bhavnani, R. Wayne Johnson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041007.
Paper No: EP-16-1051
https://doi.org/10.1115/1.4034854
Published Online: October 20, 2016
View Article titled, Single- and Two-Phase Particle Image Velocimetry Characterization of Fluid Flow Within a Liquid Immersion Cooled Electronics Module
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Topics: Coolants, Electronics, Flow (Dynamics), Fluids, Particulate matter, Design, Boiling, Fluid dynamics, Cooling
Journal Articles

Durability of Low Melt Alloys as Thermal Interface Materials

Chandan K. Roy, Sushil Bhavnani, Michael C. Hamilton, R. Wayne Johnson, Roy W. Knight, Daniel K. Harris
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010913.
Paper No: EP-15-1108
https://doi.org/10.1115/1.4032462
Published Online: March 10, 2016
View Article titled, Durability of Low Melt Alloys as Thermal Interface Materials
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Topics: Alloys, Thermal resistance, Disks, Copper, Wetting, Reliability, Cycles
Proceedings Papers

Durability of Low Melt Alloys as Thermal Interface Materials

Chandan K. Roy, Daniel K. Harris, Sushil Bhavnani, Michael C. Hamilton, Wayne Johnson, Roy W. Knight
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A071, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48083
https://doi.org/10.1115/IPACK2015-48083
View Paper titled, Durability of Low Melt Alloys as Thermal Interface Materials
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Topics: Alloys, Durability, Testing, ASTM International, Copper, Cycles, Gallium, Performance evaluation, Surface finishing, Tin
Proceedings Papers

Effect of Flow Guide Integration on the Thermal Performance of High Performance Liquid Cooled Immersion Server Modules

Joshua Gess, Tyler Dreher, Sushil Bhavnani, Wayne Johnson
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A047, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48771
https://doi.org/10.1115/IPACK2015-48771
View Paper titled, Effect of Flow Guide Integration on the Thermal Performance of High Performance Liquid Cooled Immersion Server Modules
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Topics: Flow (Dynamics), Coolants, Pressure drop, Temperature, Energy dissipation, Fluids, Boiling, Cooling, Data centers, Design