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Journal Articles

Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat Sink

Ammar Osman, Gilberto Moreno, Steve Myers, Joshua Major, Xuhui Feng, Sreekant V. J. Narumanchi, Yogendra Joshi

Publisher: ASME

J. Electron. Packag. June 2024, 146(2): 021007.

Paper No: EP-23-1026

https://doi.org/10.1115/1.4062869

Published Online: December 6, 2023

View Article titled, Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat Sink

Proceedings Papers

Small Heat Source Effects in Sub-Micron Heat Conduction

Sreekant V. J. Narumanchi, Jayathi Y. Murthy, Cristina H. Amon

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 237-238, November 11–16, 2001

Publisher: American Society of Mechanical Engineers

Paper No: IMECE2001/HTD-24399

https://doi.org/10.1115/IMECE2001/HTD-24399

View Paper titled, Small Heat Source Effects in Sub-Micron Heat Conduction

Topics: Heat, Heat conduction, Phonons, Dimensions, Mean free path, Approximation, Electric fields, Electromagnetic scattering, Failure, Finite volume methods

Proceedings Papers

Comparison of Different Single-Phase Liquid Jet Impingement Cooling Configurations in the Context of Thermal Management in Power Electronics

Sreekant V. J. Narumanchi, Desikan Bharathan, Vahab Hassani

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 577-589, July 17–22, 2005

Publisher: American Society of Mechanical Engineers

Paper No: IPACK2005-73407

https://doi.org/10.1115/IPACK2005-73407

View Paper titled, Comparison of Different Single-Phase Liquid Jet Impingement Cooling Configurations in the Context of Thermal Management in Power Electronics

Topics: Computational fluid dynamics, Electronics, Erosion, Impingement cooling, Jets, Pressure drop, Thermal management

Proceedings Papers

Simulations of Heat Transport During Transient Electrostatic Discharge Events in a Sub-Micron Transistor

Sreekant V. J. Narumanchi, Jayathi Y. Murthy, Cristina H. Amon

Proc. ASME. HT-FED2004, Volume 4, 347-359, July 11–15, 2004

Publisher: American Society of Mechanical Engineers

Paper No: HT-FED2004-56252

https://doi.org/10.1115/HT-FED2004-56252

View Paper titled, Simulations of Heat Transport During Transient Electrostatic Discharge Events in a Sub-Micron Transistor

Topics: Engineering simulation, Heat, Simulation, Transients (Dynamics), Transistors, Phonons, Silicon, Diffusion (Physics), Failure, Melting

Proceedings Papers

Computations of Sub-Micron Heat Transport in Silicon Accounting for Phonon Dispersion

Sreekant V. J. Narumanchi, Jayathi Y. Murthy, Cristina H. Amon

Proc. ASME. HT2003, Heat Transfer: Volume 1, 569-578, July 21–23, 2003

Publisher: American Society of Mechanical Engineers

Paper No: HT2003-47490

https://doi.org/10.1115/HT2003-47490

View Paper titled, Computations of Sub-Micron Heat Transport in Silicon Accounting for Phonon Dispersion

Topics: Accounting, Computation, Heat, Phonons, Silicon, Acoustics, Temperature, Dielectric materials, Diffusion (Physics), Electromagnetic spectrum

Proceedings Papers

Simulations of Heat Conduction in Sub-Micron Silicon-on-Insulator Transistors Accounting for Phonon Dispersion and Polarization

Sreekant V. J. Narumanchi, Jayathi Y. Murthy, Cristina H. Amon

Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 329-339, November 15–21, 2003

Publisher: American Society of Mechanical Engineers

Paper No: IMECE2003-42447

https://doi.org/10.1115/IMECE2003-42447

View Paper titled, Simulations of Heat Conduction in Sub-Micron Silicon-on-Insulator Transistors Accounting for Phonon Dispersion and Polarization

Topics: Accounting, Engineering simulation, Heat conduction, Phonons, Polarization (Electricity), Polarization (Light), Polarization (Waves), Silicon-on-insulator, Simulation, Transistors

Proceedings Papers

Modeling Nanoscale Thermal Transport via the Boltzmann Transport Equation

Cristina H. Amon, Jayathi Y. Murthy, Sreekant V. J. Narumanchi

Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 93-103, November 13–19, 2004

Publisher: American Society of Mechanical Engineers

Paper No: IMECE2004-62508

https://doi.org/10.1115/IMECE2004-62508

View Paper titled, Modeling Nanoscale Thermal Transport via the Boltzmann Transport Equation

Topics: Modeling, Nanoscale phenomena, Phonons, Transistors

Journal Articles

Comparison of Different Phonon Transport Models for Predicting Heat Conduction in Silicon-on-Insulator Transistors

Sreekant V. J. Narumanchi, Jayathi Y. Murthy, Cristina H. Amon

Publisher: ASME

J. Heat Mass Transfer. July 2005, 127(7): 713–723.

https://doi.org/10.1115/1.1924571

Published Online: March 1, 2005

View Article titled, Comparison of Different Phonon Transport Models for Predicting Heat Conduction in Silicon-on-Insulator Transistors

Topics: Phonons, Silicon, Silicon-on-insulator, Temperature, Transistors, Acoustics, Thermal conductivity, Relaxation (Physics)

Journal Articles

Submicron Heat Transport Model in Silicon Accounting for Phonon Dispersion and Polarization

Sreekant V. J. Narumanchi, Jayathi Y. Murthy, Cristina H. Amon

Publisher: ASME

J. Heat Mass Transfer. December 2004, 126(6): 946–955.

https://doi.org/10.1115/1.1833367

Published Online: January 26, 2005

View Article titled, Submicron Heat Transport Model in Silicon Accounting for Phonon Dispersion and Polarization

Topics: Acoustics, Phonons, Relaxation (Physics), Silicon, Temperature, Thermal conductivity, Thin films, Diffusion (Physics), Polarization (Electricity), Polarization (Light)

Journal Articles

Simulation of Unsteady Small Heat Source Effects in Sub-Micron Heat Conduction

Sreekant V. J. Narumanchi, Jayathi Y. Murthy, Cristina H. Amon

Publisher: ASME

J. Heat Mass Transfer. October 2003, 125(5): 896–903.

https://doi.org/10.1115/1.1603774

Published Online: September 23, 2003

View Article titled, Simulation of Unsteady Small Heat Source Effects in Sub-Micron Heat Conduction

Topics: Electromagnetic scattering, Heat, Heat conduction, Phonons, Radiation scattering, Scattering (Physics), Temperature, Acoustics

Journal Articles

Influence of Pulsating Submerged Liquid Jets on Chip-Level Thermal Phenomena

Sreekant V. J. Narumanchi, Cristina H. Amon, Fellow ASME, Jayathi Y. Murthy, Mem. ASME

Publisher: ASME

J. Electron. Packag. September 2003, 125(3): 354–361.

https://doi.org/10.1115/1.1572903

Published Online: September 17, 2003

View Article titled, Influence of Pulsating Submerged Liquid Jets on Chip-Level Thermal Phenomena

Topics: Heat transfer, Jets, Temperature, Capacitance, Reynolds number

Journal citation

NARROW

Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat Sink

Small Heat Source Effects in Sub-Micron Heat Conduction

Comparison of Different Single-Phase Liquid Jet Impingement Cooling Configurations in the Context of Thermal Management in Power Electronics

Simulations of Heat Transport During Transient Electrostatic Discharge Events in a Sub-Micron Transistor

Computations of Sub-Micron Heat Transport in Silicon Accounting for Phonon Dispersion

Simulations of Heat Conduction in Sub-Micron Silicon-on-Insulator Transistors Accounting for Phonon Dispersion and Polarization

Modeling Nanoscale Thermal Transport via the Boltzmann Transport Equation

Comparison of Different Phonon Transport Models for Predicting Heat Conduction in Silicon-on-Insulator Transistors

Submicron Heat Transport Model in Silicon Accounting for Phonon Dispersion and Polarization

Simulation of Unsteady Small Heat Source Effects in Sub-Micron Heat Conduction

Influence of Pulsating Submerged Liquid Jets on Chip-Level Thermal Phenomena

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