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Soon-Bok Lee
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Journal Articles

Statistical Characteristics of Fatigue Failure of Copper Thin Films

Jae-Won Jang, Yun Hwangbo, Jae-Hyun Kim, Hak-Joo Lee, Alexander E. Mag-isa, Soon-Bok Lee
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research-Article
J. Eng. Mater. Technol. October 2013, 135(4): 041007.
Paper No: MATS-13-1074
https://doi.org/10.1115/1.4025319
Published Online: September 17, 2013
View Article titled, Statistical Characteristics of Fatigue Failure of Copper Thin Films
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Topics: Copper, Fatigue, Fatigue failure, Fatigue life, Fatigue testing, Statistical analysis, Statistical distributions, Stress, Thin films
Journal Articles

Measurement and Characterization of the Moisture-Induced Properties of ACF Package

Ji-Young Yoon, Ilho Kim, Soon-Bok Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021012.
https://doi.org/10.1115/1.3111252
Published Online: April 21, 2009
View Article titled, Measurement and Characterization of the Moisture-Induced Properties of ACF Package
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Topics: Diffusion (Physics), Temperature, Finite element analysis
Journal Articles

Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation

Woon-Seong Kwon, Myung-Jin Yim, Kyung-Wook Paik, Suk-Jin Ham, Soon-Bok Lee, Member ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 86–90.
https://doi.org/10.1115/1.1846062
Published Online: June 3, 2005
View Article titled, Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation
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Topics: Acoustics, Adhesives, Anisotropy, Deformation, Delamination, Flip-chip devices, Interferometry, Microscopy, Reliability, Thermal deformation
Journal Articles

Low Cycle Fatigue Testing of Ball Grid Array Solder Joints under Mixed-Mode Loading Conditions

Tae-Sang Park, Soon-Bok Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 237–244.
https://doi.org/10.1115/1.1871192
Published Online: May 26, 2004
View Article titled, Low Cycle Fatigue Testing of Ball Grid Array Solder Joints under Mixed-Mode Loading Conditions
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Topics: Ball-Grid-Array packaging, Displacement, Fatigue life, Fatigue testing, Low cycle fatigue, Solder joints, Solders, Stress, Testing, Tin
Journal Articles

Measurement of Creep and Relaxation Behaviors of Wafer-Level CSP Assembly Using Moire´ Interferometry

Suk-Jin Ham, Soon-Bok Lee, Mem. ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 282–288.
https://doi.org/10.1115/1.1571571
Published Online: June 10, 2003
View Article titled, Measurement of Creep and Relaxation Behaviors of Wafer-Level CSP Assembly Using Moire´ Interferometry
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Topics: Creep, Deformation, Finite element analysis, Interferometry, Manufacturing, Relaxation (Physics), Semiconductor wafers, Shear (Mechanics), Solders, Temperature
Journal Articles

A Phenomenological Model for Intergranular Failure by r-type and Wedge-Type Cavitation

Soon-Bok Lee, Alan K. Miller
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Technical Papers
J. Eng. Mater. Technol. July 1995, 117(3): 311–321.
https://doi.org/10.1115/1.2804545
Published Online: July 1, 1995
View Article titled, A Phenomenological Model for Intergranular Failure by r-type and Wedge-Type Cavitation
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Topics: Cavitation, Failure, Wedges, Creep, Cavities, Grain boundaries, Low cycle fatigue, Temperature, Compression, Diffusion (Physics)