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Proceedings Papers

Characterizing High Temperature Thermoelectric Modules

Satchit B. Mahajan, Reginald D. Pierce, Robert J. Stevens

Proc. ASME. IMECE2013, Volume 6A: Energy, V06AT07A094, November 15–21, 2013

Publisher: American Society of Mechanical Engineers

Paper No: IMECE2013-66120

https://doi.org/10.1115/IMECE2013-66120

View Paper titled, Characterizing High Temperature Thermoelectric Modules

Topics: High temperature, Heat, Thermal conductivity, Electrical resistance, Energy generation, Errors, Heat transfer, Manufacturing, Temperature, Testing

Proceedings Papers

Effects of Inelastic Scattering on Thermal Boundary Conductance at Metal-Dielectric Interfaces

Patrick E. Hopkins, Pamela M. Norris, Robert J. Stevens

Proc. ASME. IMECE2007, Volume 11: Micro and Nano Systems, Parts A and B, 647-656, November 11–15, 2007

Publisher: American Society of Mechanical Engineers

Paper No: IMECE2007-42808

https://doi.org/10.1115/IMECE2007-42808

View Paper titled, Effects of Inelastic Scattering on Thermal Boundary Conductance at Metal-Dielectric Interfaces

Topics: Electrical conductance, Electromagnetic scattering, Metals, Radiation scattering, Scattering (Physics), Elastic scattering, High temperature, Phonons, Temperature, Thermoreflectance

Proceedings Papers

Development of a Test Stand for the Characterization of Thermoelectric Modules for Power Generation

Kevin Smith, Emil Sandoz-Rosado, Crisson Jno-Charles, Clement Henry, Erik Herrmann, Robert J. Stevens

Proc. ASME. IMECE2007, Volume 8: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A and B, 591-598, November 11–15, 2007

Publisher: American Society of Mechanical Engineers

Paper No: IMECE2007-41595

https://doi.org/10.1115/IMECE2007-41595

View Paper titled, Development of a Test Stand for the Characterization of Thermoelectric Modules for Power Generation

Topics: Energy generation, Temperature, Design, Control systems, Data acquisition systems, Electricity (Physics), Heat flux, Operating temperature, Undergraduate students

Proceedings Papers

Experimental Determination of the Relationship Between Thermal Boundary Resistance and Non-Abrupt Interfaces and Electron-Phonon Coupling

Robert J. Stevens, Pamela M. Norris, Arthur W. Lichtenberger

Proc. ASME. HT-FED2004, Volume 4, 503-504, July 11–15, 2004

Publisher: American Society of Mechanical Engineers

Paper No: HT-FED2004-56556

https://doi.org/10.1115/HT-FED2004-56556

View Paper titled, Experimental Determination of the Relationship Between Thermal Boundary Resistance and Non-Abrupt Interfaces and Electron-Phonon Coupling

Topics: Electrons, Interfacial thermal resistance, Phonons, Temperature, Electron scattering, Acoustics, Diamonds, Electrical conductance, Electromagnetic scattering, Metals

Proceedings Papers

Thermal Boundary Resistance of Thin Metal Films and Thermally Conductive Dielectric Materials

Robert J. Stevens, Andrew N. Smith, Arthur W. Lichtenberger, Pamela M. Norris

Proc. ASME. IMECE2003, Heat Transfer, Volume 4, 239-245, November 15–21, 2003

Publisher: American Society of Mechanical Engineers

Paper No: IMECE2003-41856

https://doi.org/10.1115/IMECE2003-41856

View Paper titled, Thermal Boundary Resistance of Thin Metal Films and Thermally Conductive Dielectric Materials

Topics: Dielectric materials, Interfacial thermal resistance, Metals, Top-tensioned risers, Electrical conductance, Temperature, Gallium nitride, Metallic films, Sapphire, Signals

Journal Articles

Influence of Interfacial Mixing on Thermal Boundary Conductance Across a Chromium/Silicon Interface

Patrick E. Hopkins, Pamela M. Norris, Robert J. Stevens, Thomas E. Beechem, Samuel Graham

Publisher: ASME

J. Heat Mass Transfer. June 2008, 130(6): 062402.

https://doi.org/10.1115/1.2897344

Published Online: April 23, 2008

View Article titled, Influence of Interfacial Mixing on Thermal Boundary Conductance Across a Chromium/Silicon Interface

Topics: Augers, Electrical conductance, Temperature, Thermoreflectance, Silicon, Electromagnetic scattering, Top-tensioned risers, Electron spectroscopy, Phonons, Crystals

Proceedings Papers

Molecular Dynamics Study of Thermal Boundary Resistance: Evidence of Strong Inelastic Scattering Transport Channels

Robert J. Stevens, Pamela M. Norris, Leonid V. Zhigilei

Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 37-46, November 13–19, 2004

Publisher: American Society of Mechanical Engineers

Paper No: IMECE2004-60334

https://doi.org/10.1115/IMECE2004-60334

View Paper titled, Molecular Dynamics Study of Thermal Boundary Resistance: Evidence of Strong Inelastic Scattering Transport Channels

Topics: Electromagnetic scattering, Interfacial thermal resistance, Molecular dynamics, Radiation scattering, Scattering (Physics), Engineering simulation, Phonons, Simulation, Excitation, Low temperature

Journal Articles

Influence of Inelastic Scattering at Metal-Dielectric Interfaces

Patrick E. Hopkins, Pamela M. Norris, Robert J. Stevens

Publisher: ASME

J. Heat Mass Transfer. February 2008, 130(2): 022401.

https://doi.org/10.1115/1.2787025

Published Online: February 4, 2008

View Article titled, Influence of Inelastic Scattering at Metal-Dielectric Interfaces

Topics: Electrical conductance, Electromagnetic scattering, Phonons, Radiation scattering, Scattering (Physics), Temperature, Elastic scattering, Top-tensioned risers, High temperature, Metals

Proceedings Papers

Dependence of Thermal Boundary Conductance on Interfacial Mixing at the Chromium-Silicon Interface

Patrick E. Hopkins, Richard N. Salaway, Robert J. Stevens, Pamela M. Norris

Proc. ASME. IMECE2006, Heat Transfer, Volume 1, 215-224, November 5–10, 2006

Publisher: American Society of Mechanical Engineers

Paper No: IMECE2006-15288

https://doi.org/10.1115/IMECE2006-15288

View Paper titled, Dependence of Thermal Boundary Conductance on Interfacial Mixing at the Chromium-Silicon Interface

Topics: Electrical conductance, Silicon, Thermal conductivity, Augers, Electron spectroscopy, Thermoreflectance, Transients (Dynamics)

Journal Articles

Measurement of Thermal Boundary Conductance of a Series of Metal-Dielectric Interfaces by the Transient Thermoreflectance Technique

Robert J. Stevens, Andrew N. Smith, Pamela M. Norris

Publisher: ASME

J. Heat Mass Transfer. March 2005, 127(3): 315–322.

https://doi.org/10.1115/1.1857944

Published Online: March 24, 2005

View Article titled, Measurement of Thermal Boundary Conductance of a Series of Metal-Dielectric Interfaces by the Transient Thermoreflectance Technique

Topics: Electrical conductance, Metallic films, Metals, Phonons, Sapphire, Spectra (Spectroscopy), Temperature, Thermal conductivity, Thermoreflectance, Top-tensioned risers

Journal citation

NARROW

Characterizing High Temperature Thermoelectric Modules

Effects of Inelastic Scattering on Thermal Boundary Conductance at Metal-Dielectric Interfaces

Development of a Test Stand for the Characterization of Thermoelectric Modules for Power Generation

Experimental Determination of the Relationship Between Thermal Boundary Resistance and Non-Abrupt Interfaces and Electron-Phonon Coupling

Thermal Boundary Resistance of Thin Metal Films and Thermally Conductive Dielectric Materials

Influence of Interfacial Mixing on Thermal Boundary Conductance Across a Chromium/Silicon Interface

Molecular Dynamics Study of Thermal Boundary Resistance: Evidence of Strong Inelastic Scattering Transport Channels

Influence of Inelastic Scattering at Metal-Dielectric Interfaces

Dependence of Thermal Boundary Conductance on Interfacial Mixing at the Chromium-Silicon Interface

Measurement of Thermal Boundary Conductance of a Series of Metal-Dielectric Interfaces by the Transient Thermoreflectance Technique

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