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Robert J. Moffat
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Proceedings Papers
Proc. ASME. IMECE97, Heat Transfer: Volume 3, 187-189, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0908
Proceedings Papers
Proc. ASME. IMECE98, Heat Transfer: Volume 5 — Numerical and Experimental Methods in Heat Transfer, 631-636, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0785
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 2009, 131(8): 082201.
Published Online: June 4, 2009
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. January 2009, 131(1): 011603.
Published Online: October 22, 2008
Proceedings Papers
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 565-575, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42176
Proceedings Papers
Proc. ASME. IMECE2006, Heat Transfer, Volume 1, 277-283, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-13237
Journal Articles
Publisher: ASME
Article Type: Research Papers: Special Issue On Boiling And Interfacial Phenomena
J. Heat Mass Transfer. August 2006, 128(8): 811–818.
Published Online: January 17, 2006
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 501–509.
Published Online: January 24, 2005
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. April 2004, 126(2): 202–210.
Published Online: May 4, 2004
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1992, 114(1): 14–21.
Published Online: March 1, 1992