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1-11 of 11
Randeep Singh
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Journal Articles
Ashwin Date, Randeep Singh, Tomoki Oridate, Masataka Mochizuki, Abhijit Date, Aliakbar Akbarzadeh, Sarthak Nag
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. October 2024, 146(10): 101601.
Paper No: HT-23-1444
Published Online: May 22, 2024
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2022, 14(6): 061010.
Paper No: TSEA-21-1236
Published Online: October 13, 2021
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. September 2015, 7(3): 031010.
Paper No: TSEA-13-1143
Published Online: September 1, 2015
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. September 2014, 6(3): 031008.
Paper No: TSEA-13-1057
Published Online: March 17, 2014
Proceedings Papers
Masataka Mochizuki, Thang Nguyen, Koichi Mashiko, Yuji Saito, Xiao Ping Wu, Tien Nguyen, Vijit Wuttijumnong, Randeep Singh
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 653-661, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52265
Proceedings Papers
Xiao Ping Wu, Masataka Mochizuki, Koichi Mashiko, Thang Nguyen, Tien Nguyen, Vijit Wuttijumnong, Gerald Cabusao, Randeep Singh, Aliakbar Akbarzadeh
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 701-709, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-23128
Proceedings Papers
Masataka Mochizuki, Yuji Saito, Thang Nguyen, Tien Nguyen, Vijit Wuttijumnong, Yasuhiro Horiuchi, Roj Tacomkang, Randeep Singh, Aliakbar Akbarzadeh
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 969-974, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52088
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 2009, 131(8): 082601.
Published Online: June 4, 2009
Proceedings Papers
Randeep Singh, Aliakbar Akbarzadeh, Mastaka Mochizuki, Yuji Saito, Thang Nguyen, Bob Kao, Tanaphan Sataphan, Eiji Takenaka, Vijit Wuttijumnong
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 409-414, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73278
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 697-702, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73498
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. October 2007, 129(10): 1445–1452.
Published Online: February 9, 2007