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Pradeep Sharma
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Journal Articles

A Tutorial on the Stability and Bifurcation Analysis of the Electromechanical Behaviour of Soft Materials

Shengyou Yang, Pradeep Sharma
Journal: Applied Mechanics Reviews
Publisher: ASME
Article Type: Tutorial
Appl. Mech. Rev. July 2023, 75(4): 044801.
Paper No: AMR-22-1078
https://doi.org/10.1115/1.4056303
Published Online: January 23, 2023
View Article titled, A Tutorial on the Stability and Bifurcation Analysis of the Electromechanical Behaviour of Soft Materials
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Topics: Bifurcation, Boundary-value problems, Deformation, Dielectric materials, Electric fields, Equilibrium (Physics), Stability, Stress, Elastomers
Journal Articles

Micro-Structural Design of Soft Solid Composite Electrolytes With Enhanced Ionic Conductivity

Nastaran Khodabandehloo, Kosar Mozaffari, Liping Liu, Pradeep Sharma
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. May 2022, 89(5): 051004.
Paper No: JAM-22-1002
https://doi.org/10.1115/1.4053498
Published Online: February 11, 2022
View Article titled, Micro-Structural Design of Soft Solid Composite Electrolytes With Enhanced Ionic Conductivity
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Topics: Composite materials, Electrolytes, Ionic conductivity, Deformation, Polymers, Finite element analysis, Design, Fillers (Materials)
Proceedings Papers

Micro-Mechanics of Creep-Fatigue Damage in Pb-Sn Solder Due to Thermal Cycling

Pradeep Sharma, Abhijit Dasgupta
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 173-179, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2260
https://doi.org/10.1115/IMECE2000-2260
View Paper titled, Micro-Mechanics of Creep-Fatigue Damage in Pb-Sn Solder Due to Thermal Cycling
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Topics: Creep, Damage, Fatigue, Micromechanics (Engineering), Solders, Tin, Stress, Aeroelasticity, Damage mechanics, Fatigue damage
Journal Articles

Tuning Crumpled Sheets for An Enhanced Flexoelectric Response

Yang Liu, Lingling Chen, Binglei Wang, Shengyou Yang, Pradeep Sharma
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. January 2022, 89(1): 011011.
Paper No: JAM-21-1346
https://doi.org/10.1115/1.4052575
Published Online: October 13, 2021
View Article titled, Tuning Crumpled Sheets for An Enhanced Flexoelectric Response
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Topics: Deflection, Dielectric materials, Strain gradient, Thin films, Young's modulus, Polarization (Electricity), Tensors, Displacement, Boundary-value problems, Energy harvesting
Journal Articles

An Atomistic Perspective on the Effect of Strain Rate and Lithium Fraction on the Mechanical Behavior of Silicon Electrodes

Faezeh Darbaniyan, Xin Yan, Pradeep Sharma
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. March 2020, 87(3): 031011.
Paper No: JAM-19-1547
https://doi.org/10.1115/1.4045545
Published Online: December 11, 2019
View Article titled, An Atomistic Perspective on the Effect of Strain Rate and Lithium Fraction on the Mechanical Behavior of Silicon Electrodes
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Proceedings Papers

Optimal Energy Management in a Range Extender PHEV Using a Cascaded Dynamic Programming Approach

Pradeep Sharma Oruganti, Daniel Jung, Mukilan Arasu, Qadeer Ahmed, Giorgio Rizzoni
Proc. ASME. DSCC2018, Volume 2: Control and Optimization of Connected and Automated Ground Vehicles; Dynamic Systems and Control Education; Dynamics and Control of Renewable Energy Systems; Energy Harvesting; Energy Systems; Estimation and Identification; Intelligent Transportation and Vehicles; Manufacturing; Mechatronics; Modeling and Control of IC Engines and Aftertreatment Systems; Modeling and Control of IC Engines and Powertrain Systems; Modeling and Management of Power Systems, V002T27A003, September 30–October 3, 2018
Publisher: American Society of Mechanical Engineers
Paper No: DSCC2018-9043
https://doi.org/10.1115/DSCC2018-9043
View Paper titled, Optimal Energy Management in a Range Extender PHEV Using a Cascaded Dynamic Programming Approach
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Topics: Dynamic programming, Energy management, Hybrid electric vehicles, Batteries, Computation, Engines, Vehicles
Journal Articles

Revisiting the Instability and Bifurcation Behavior of Soft Dielectrics

Shengyou Yang, Xuanhe Zhao, Pradeep Sharma
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research-Article
J. Appl. Mech. March 2017, 84(3): 031008.
Paper No: JAM-16-1595
https://doi.org/10.1115/1.4035499
Published Online: January 24, 2017
View Article titled, Revisiting the Instability and Bifurcation Behavior of Soft Dielectrics
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Topics: Bifurcation, Boundary-value problems, Buckling, Deformation, Electric fields, Polarization (Electricity), Polarization (Light), Polarization (Waves), Stress, Dielectric materials
Journal Articles

Flexoelectricity: A Perspective on an Unusual Electromechanical Coupling

Sana Krichen, Pradeep Sharma
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Review Articles
J. Appl. Mech. March 2016, 83(3): 030801.
Paper No: JAM-15-1701
https://doi.org/10.1115/1.4032378
Published Online: January 20, 2016
View Article titled, Flexoelectricity: A Perspective on an Unusual Electromechanical Coupling
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Topics: Deformation, Design, Energy harvesting, Multifunctional materials, Piezoelectric materials, Piezoelectricity, Polarization (Electricity), Polarization (Light), Polarization (Waves), Strain gradient
Proceedings Papers

Prediction of Rate-Independent Constitutive Behavior of Pb-Free Solders Based on First Principles

Pradeep Sharma, Abhijit Dasgupta, Surya Ganti, James Loman
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 125-134, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39254
https://doi.org/10.1115/IMECE2002-39254
View Paper titled, Prediction of Rate-Independent Constitutive Behavior of Pb-Free Solders Based on First Principles
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Topics: Lead-free solders, Particulate matter, Alloys, Calibration, Design, Grain size, Micromechanics (Engineering), Particle size, Physics
Proceedings Papers

Improved Analytical and Semi-Analytical Durability Models (Constrained Models) for Various Surface-Mount Configurations

Pradeep Sharma, James Loman
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 159-164, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39634
https://doi.org/10.1115/IMECE2002-39634
View Paper titled, Improved Analytical and Semi-Analytical Durability Models (Constrained Models) for Various Surface-Mount Configurations
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Topics: Durability, Surface mount packaging, Calibration, Deformation, Finite element analysis, Physics, Resistors, Solder joints
Proceedings Papers

The Connection Between Microstructural Damage Modeling and Continuum Damage Modeling for Eutectic Sn-Pb Solder Alloys

Pradeep Sharma, Abhijit Dasgupta
Proc. ASME. IMECE2002, Applied Mechanics and Biomedical Technology, 79-88, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39185
https://doi.org/10.1115/IMECE2002-39185
View Paper titled, The Connection Between Microstructural Damage Modeling and Continuum Damage Modeling for Eutectic Sn-Pb Solder Alloys
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Topics: Alloys, Damage, Modeling, Solders, Tin, Creep, Cycles, Energy dissipation, Grain boundaries, Plasticity
Proceedings Papers

Prediction of Rate-Dependent Constitutive Behavior of Pb-Free Solders

Qian Zhang, Pradeep Sharma, Abhijit Dasgupta
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 209-214, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41774
https://doi.org/10.1115/IMECE2003-41774
View Paper titled, Prediction of Rate-Dependent Constitutive Behavior of Pb-Free Solders
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Topics: Lead-free solders, Creep, Stress, Dislocations, Particulate matter, Steady state, Temperature, Tin, Constitutive equations, Dislocation density
Journal Articles

Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part II: Mechanistic Insights and Cyclic Durability Predictions From Monotonic Data

Pradeep Sharma, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 298–304.
https://doi.org/10.1115/1.1493203
Published Online: July 26, 2002
View Article titled, Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part II: Mechanistic Insights and Cyclic Durability Predictions From Monotonic Data
Open the PDF for Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part II: Mechanistic Insights and Cyclic Durability Predictions From Monotonic Data in another window
Topics: Creep, Cycles, Damage, Durability, Failure, Fatigue, Grain size, Hydrostatics, Micromechanics (Engineering), Solders
Journal Articles

Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part I: Formulation

Pradeep Sharma, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 292–297.
https://doi.org/10.1115/1.1493202
Published Online: July 26, 2002
View Article titled, Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part I: Formulation
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Topics: Creep, Damage, Fatigue, Grain boundaries, Nucleation (Physics), Solders, Stress, Particulate matter, Micromechanics (Engineering)