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Proceedings Papers

Large Flip Chip Assembly Challenges and Risk Mitigation Process

Jeremy Plunkett, Suresh Subramaniam, Nokibul Islam, Kang KeonTaek, Gu SeonMo, Eric Ouyang

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, August 29–September 1, 2017

Publisher: American Society of Mechanical Engineers

Paper No: IPACK2017-74026

https://doi.org/10.1115/IPACK2017-74026

View Paper titled, Large Flip Chip Assembly Challenges and Risk Mitigation Process

Topics: Ball-Grid-Array packaging, Copper, Cracking (Materials), Delamination, Failure, Flip-chip, Flip-chip assemblies, Flip-chip devices, Flip-chip packages, Fracture (Process)

Proceedings Papers

Lead Free Flip Chip Reliability for Various Package Types

Nokibul Islam, Miguel Jimarez, Ahmer Syed, TaeKyeong Hwang, JaeYun Gim, WonJoon Kang

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 609-615, July 6–8, 2011

Publisher: American Society of Mechanical Engineers

Paper No: IPACK2011-52260

https://doi.org/10.1115/IPACK2011-52260

View Paper titled, Lead Free Flip Chip Reliability for Various Package Types

Topics: Ball-Grid-Array packaging, Flip-chip, Flip-chip devices, Reliability, Warping

Proceedings Papers

Robust Underfill Selection Methodology for Flip Chip

Nokibul Islam, Miguel Jimarez, Robert Darveaux, JoonYeob Lee, JaeYoung Na, KeunSoo Kim

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 533-540, July 8–12, 2007

Publisher: American Society of Mechanical Engineers

Paper No: IPACK2007-33939

https://doi.org/10.1115/IPACK2007-33939

View Paper titled, Robust Underfill Selection Methodology for Flip Chip

Topics: Flip-chip, Flip-chip devices, Warping

Proceedings Papers

Leading Indicators of Failure for Prognostication of Leaded and Lead-Free Electronics in Harsh Environments

Pradeep Lall, Nokibul Islam, Prakriti Choudhary, Jeff Suhling

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1535-1543, July 17–22, 2005

Publisher: American Society of Mechanical Engineers

Paper No: IPACK2005-73426

https://doi.org/10.1115/IPACK2005-73426

View Paper titled, Leading Indicators of Failure for Prognostication of Leaded and Lead-Free Electronics in Harsh Environments

Topics: Electronics, Failure, Damage, Ball-Grid-Array packaging, Design, Electronic components, Intermetallic compounds, Laminates, MEMS packages, Solders

Proceedings Papers

A Chip-on-Beam Calibration Technique for Piezoresistive Stress Sensor Die

Richard C. Jaeger, Jeffrey C. Suhling, Yonggang Chen, Shahan Rahaman, M. Nokibul Islam

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 845-851, July 6–11, 2003

Publisher: American Society of Mechanical Engineers

Paper No: IPACK2003-35276

https://doi.org/10.1115/IPACK2003-35276

View Paper titled, A Chip-on-Beam Calibration Technique for Piezoresistive Stress Sensor Die

Topics: Calibration, Sensors, Stress, Semiconductor wafers, Strips, Design, Dimensions, Finite element analysis, Geometry, Integrated circuit fabrication

Proceedings Papers

BGA Reliability in Automotive Underhood Applications

Pradeep Lall, Nokibul Islam, Jeffrey Suhling, Robert Darveaux

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 823-830, July 6–11, 2003

Publisher: American Society of Mechanical Engineers

Paper No: IPACK2003-35243

https://doi.org/10.1115/IPACK2003-35243

View Paper titled, BGA Reliability in Automotive Underhood Applications

Topics: Ball-Grid-Array packaging, Reliability, Crack propagation, Damage, High temperature, Surface mount devices, Temperature, Errors, Fatigue, Glass transition

Proceedings Papers

Damage Relationships for BGA Reliability in Harsh Environments

Pradeep Lall, Nokibul Islam, Jeff Suhling, Robert Darveaux

Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 363-370, November 15–21, 2003

Publisher: American Society of Mechanical Engineers

Paper No: IMECE2003-42077

https://doi.org/10.1115/IMECE2003-42077

View Paper titled, Damage Relationships for BGA Reliability in Harsh Environments

Topics: Ball-Grid-Array packaging, Damage, Reliability, Crack propagation, High temperature, Surface mount devices, Temperature, Errors, Fatigue, Glass transition

Proceedings Papers

Prognosis Methodologies for Health Management of Electronics and MEMS Packaging

Pradeep Lall, Nokibul Islam, Kaysar Rahim, Jeff Suhling

Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 227-236, November 13–19, 2004

Publisher: American Society of Mechanical Engineers

Paper No: IMECE2004-62319

https://doi.org/10.1115/IMECE2004-62319

View Paper titled, Prognosis Methodologies for Health Management of Electronics and MEMS Packaging

Topics: Electronics, MEMS packaging, Damage, Failure, Complex systems, Computation, Electronic packages, Maintenance, MEMS packages, Metals

Proceedings Papers

Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments

Pradeep Lall, Nokibul Islam, Jeff Suhling

Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 435-443, November 13–19, 2004

Publisher: American Society of Mechanical Engineers

Paper No: IMECE2004-62320

https://doi.org/10.1115/IMECE2004-62320