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Mudasir Ahmad
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Proceedings Papers

Inverse Derivation of Constants for the Constitutive Equation and Fatigue Model of Pb-Free Solder Joints Based on Experiment Results, Finite Element Simulation and Virtual Optimization Methodology

Weidong Xie, Mudasir Ahmad
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 1011-1021, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-87734
https://doi.org/10.1115/IMECE2012-87734
View Paper titled, Inverse Derivation of Constants for the Constitutive Equation and Fatigue Model of Pb-Free Solder Joints Based on Experiment Results, Finite Element Simulation and Virtual Optimization Methodology
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Topics: Fatigue, Finite element analysis, Lead-free solders, Optimization, Simulation, Solders, Ball-Grid-Array packaging, Creep, Fatigue life, Reliability
Proceedings Papers

Reverse Mount Packages and Their Cooling

Mudasir Ahmad, Susheela Narasimhan
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 461-466, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35231
https://doi.org/10.1115/IPACK2003-35231
View Paper titled, Reverse Mount Packages and Their Cooling
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Topics: Air flow, Cooling, Density, Design, Flat heat pipes, Heat, Heat conduction, Lumber, Packaging, Sheet metal
Journal Articles

Erratum: “Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model” [ Journal of Electronic Packaging, 2005, 127(3), pp. 290–298 ]

Mudasir Ahmad, Ken Hubbard, Mason Hu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Errata
J. Electron. Packag. March 2006, 128(1): 98.
https://doi.org/10.1115/1.2165648
Published Online: March 1, 2006
View Article titled, Erratum: “Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model” [ Journal of Electronic Packaging, 2005, 127(3), pp. 290–298 ]
Open the PDF for Erratum: “Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model” [ Journal of Electronic Packaging, 2005, 127(3), pp. 290–298 ] in another window
Topics: Electronic packaging, Shapes, Solder joints
Journal Articles

Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model

Mudasir Ahmad, Ken Hubbard, Mason Hu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 290–298.
https://doi.org/10.1115/1.1938985
Published Online: October 5, 2004
View Article titled, Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model
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Topics: Shapes, Solder joints, Solders, Surface tension, Warping, Finite element analysis, Ball-Grid-Array packaging
Journal Articles

Study of Mechanical Behavior of Compliant Micro-Springs for Next Generation Probing Applications

Mudasir Ahmad, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 411–418.
https://doi.org/10.1115/1.1512296
Published Online: December 12, 2002
View Article titled, Study of Mechanical Behavior of Compliant Micro-Springs for Next Generation Probing Applications
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Topics: Springs, Stress