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Proceedings Papers

Mechanical and Thermal Board Level Reliability Comparison Between Electroless Ni Im. Au and Solder on Pad Surface Finishes for Large Flip Chip BGA Packages

Gnyaneshwar Ramakrishna, Donghyun Kim, Mudasir Ahamad, Lavanya Gopalakrishnan, Mason Hu, Sue Teng, Bill Edwards
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 459-465, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-16074
https://doi.org/10.1115/IMECE2006-16074
View Paper titled, Mechanical and Thermal Board Level Reliability Comparison Between Electroless Ni Im. Au and Solder on Pad Surface Finishes for Large Flip Chip BGA Packages
Open the PDF for Mechanical and Thermal Board Level Reliability Comparison Between Electroless Ni Im. Au and Solder on Pad Surface Finishes for Large Flip Chip BGA Packages in another window
Topics: Ball-Grid-Array packages, Finishes, Flip-chip, Flip-chip devices, Reliability, Solders, Ball-Grid-Array packaging, Design, Robustness, Temperature
Journal Articles

Erratum: “Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model” [ Journal of Electronic Packaging, 2005, 127(3), pp. 290–298 ]

Mudasir Ahmad, Ken Hubbard, Mason Hu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Errata
J. Electron. Packag. March 2006, 128(1): 98.
https://doi.org/10.1115/1.2165648
Published Online: March 1, 2006
View Article titled, Erratum: “Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model” [ Journal of Electronic Packaging, 2005, 127(3), pp. 290–298 ]
Open the PDF for Erratum: “Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model” [ Journal of Electronic Packaging, 2005, 127(3), pp. 290–298 ] in another window
Topics: Electronic packaging, Shapes, Solder joints
Journal Articles

Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model

Mudasir Ahmad, Ken Hubbard, Mason Hu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 290–298.
https://doi.org/10.1115/1.1938985
Published Online: October 5, 2004
View Article titled, Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model
Open the PDF for Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model in another window
Topics: Shapes, Solder joints, Solders, Surface tension, Warping, Finite element analysis, Ball-Grid-Array packaging