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Madhusudan Iyengar
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Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices

Sougata Hazra, Ki Wook Jung, Madhusudan Iyengar, Chris Malone, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031119.
Paper No: EP-20-1022
https://doi.org/10.1115/1.4047847
Published Online: August 17, 2020
View Article titled, Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices
Open the PDF for Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices in another window
Topics: Coatings, Lasers, Manufacturing, Microcoolers, Micromachining, Silicon, Protective coatings, Bonding, Coating processes, Etching
Proceedings Papers

Addressing the Challenges in Laser Micro-Machining and Bonding of Silicon Microchannel Cold-Plate and 3D-Manifold for Embedded Cooling Applications: Perfect Debris Removal

Sougata Hazra, Ki Wook Jung, Madhusudan Iyengar, Chris Malone, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6539
https://doi.org/10.1115/IPACK2019-6539
View Paper titled, Addressing the Challenges in Laser Micro-Machining and Bonding of Silicon Microchannel Cold-Plate and 3D-Manifold for Embedded Cooling Applications: Perfect Debris Removal
Open the PDF for Addressing the Challenges in Laser Micro-Machining and Bonding of Silicon Microchannel Cold-Plate and 3D-Manifold for Embedded Cooling Applications: Perfect Debris Removal in another window
Topics: Bonding, Cooling, Lasers, Manifolds, Microchannels, Microfabrication, Micromachining, Silicon
Journal Articles

Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop

Chirag R. Kharangate, Ki Wook Jung, Sangwoo Jung, Daeyoung Kong, Joseph Schaadt, Madhusudan Iyengar, Chris Malone, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 021001.
Paper No: EP-17-1126
https://doi.org/10.1115/1.4039475
Published Online: May 9, 2018
View Article titled, Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop
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Topics: Fins, Flow (Dynamics), Fluids, Friction, Heat transfer, Pressure drop, Reynolds number, Water, Heat, Temperature
Proceedings Papers

System-Level Design for Liquid Cooled Chiller-Less Data Center

Pritish R. Parida, Timothy Chainer, Madhusudan Iyengar, Milnes David, Mark Schultz, Michael Gaynes, Vinod Kamath, Bejoy Kochuparambil, Robert Simons, Roger Schmidt
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 1127-1139, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-88957
https://doi.org/10.1115/IMECE2012-88957
View Paper titled, System-Level Design for Liquid Cooled Chiller-Less Data Center
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Topics: Data centers, Design, Cooling, Energy consumption, Air conditioning, Computer simulation, Computers, Electronics, Refrigeration, Test facilities
Proceedings Papers

Effect of Thermal Characteristics of Electronic Enclosures on Dynamic Data Center Performance

Mahmoud Ibrahim, Siddharth Bhopte, Bahgat Sammakia, Bruce Murray, Madhusudan Iyengar, Roger Schmidt
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 411-420, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-40914
https://doi.org/10.1115/IMECE2010-40914
View Paper titled, Effect of Thermal Characteristics of Electronic Enclosures on Dynamic Data Center Performance
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Topics: Data centers, Temperature, Buoyancy, Computer simulation, Computers, Air conditioning, Boundary-value problems, Computational fluid dynamics, Cooling, Dynamics (Mechanics)
Proceedings Papers

Energy Savings Through Hot and Cold Aisle Containment Configurations for Air Cooled Servers in Data Centers

Roger Schmidt, Aparna Vallury, Madhusudan Iyengar
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 611-616, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52206
https://doi.org/10.1115/IPACK2011-52206
View Paper titled, Energy Savings Through Hot and Cold Aisle Containment Configurations for Air Cooled Servers in Data Centers
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Topics: Containment, Data centers
Proceedings Papers

Experimental Characterization of Server Rack Energy Use at Elevated Ambient Temperatures

Madhusudan Iyengar, Roger Schmidt, Vinod Kamath, Bejoy Kochuparambil
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 617-622, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52207
https://doi.org/10.1115/IPACK2011-52207
View Paper titled, Experimental Characterization of Server Rack Energy Use at Elevated Ambient Temperatures
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Topics: Energy consumption, Experimental characterization, Server racks, Temperature, Doors, Heat exchangers, Data centers, Stress, Algorithms, Cooling
Proceedings Papers

Energy Efficient Data Centers Using Evaporative Cooling and Air Side Economizers

Madhusudan Iyengar, Roger Schmidt
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 623-627, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52210
https://doi.org/10.1115/IPACK2011-52210
View Paper titled, Energy Efficient Data Centers Using Evaporative Cooling and Air Side Economizers
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Topics: Data centers, Evaporative cooling, Cooling, Temperature, Climate, Computers, Energy consumption, Air conditioning, Evaporation, Filtration
Proceedings Papers

Design of Simulated Server Racks for Data Center Research

James F. Smith, Waleed A. Abdelmaksoud, Hamza S. Erden, John F. Dannenhoffer, Thong Q. Dang, H. Ezzat Khalifa, Roger R. Schmidt, Madhusudan Iyengar
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 415-422, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52016
https://doi.org/10.1115/IPACK2011-52016
View Paper titled, Design of Simulated Server Racks for Data Center Research
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Topics: Data centers, Design, Server racks, Computers, Fans, Heating, Temperature, Density, Flow (Dynamics), Pressure drop
Proceedings Papers

Characterization of a Server Thermal Mass Using Experimental Measurements

Mahmoud Ibrahim, Furat Afram, Bahgat Sammakia, Kanad Ghose, Bruce Murray, Madhusudan Iyengar, Roger Schmidt
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 577-583, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52165
https://doi.org/10.1115/IPACK2011-52165
View Paper titled, Characterization of a Server Thermal Mass Using Experimental Measurements
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Topics: Cooling, Data centers, Electronic equipment, Energy dissipation, Energy efficiency, Fans, Heat, Materials properties, Sensors, Steady state
Proceedings Papers

Numerical Study on the Reduction of Recirculation Using Sealed Cold Aisles and its Effect on the Efficiency of the Cooling Infrastructure

Mahmoud Ibrahim, Bahgat Sammakia, Siddharth Bhopte, Bruce Murray, Madhusudan Iyengar, Roger Schmidt
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 585-593, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52166
https://doi.org/10.1115/IPACK2011-52166
View Paper titled, Numerical Study on the Reduction of Recirculation Using Sealed Cold Aisles and its Effect on the Efficiency of the Cooling Infrastructure
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Topics: Cooling, Electronic equipment, Temperature, Ceilings, Data centers, Energy dissipation, Heat, Sealing (Process), Air conditioning, Air flow
Proceedings Papers

Reduced Rack Exhaust Temperature Gradient via Variable Chassis Flow Rate

Thong Dang, Carine Serreli, H. Ezzat Khalifa, Roger R. Schmidt, Madhusudan Iyengar
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 451-459, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52067
https://doi.org/10.1115/IPACK2011-52067
View Paper titled, Reduced Rack Exhaust Temperature Gradient via Variable Chassis Flow Rate
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Topics: Exhaust systems, Flow (Dynamics), Temperature gradient, Temperature, Algorithms, Computational fluid dynamics, Data centers, Engineering simulation, Heat, Simulation
Journal Articles

Numerical and Experimental Study of the Effect of Underfloor Blockages on Data Center Performance

Siddharth Bhopte, Bahgat Sammakia, Madhusudan Iyengar, Roger Schmidt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011007.
https://doi.org/10.1115/1.4003603
Published Online: March 9, 2011
View Article titled, Numerical and Experimental Study of the Effect of Underfloor Blockages on Data Center Performance
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Topics: Data centers, Flow (Dynamics), Pipes, Tiles, Computer simulation, Air flow
Proceedings Papers

Co-Generation: Grid Independent Power and Cooling for a Data Center

Roger Schmidt, Madhusudan Iyengar, James Steffes, Vijay Lund
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1063-1075, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89411
https://doi.org/10.1115/InterPACK2009-89411
View Paper titled, Co-Generation: Grid Independent Power and Cooling for a Data Center
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Topics: Combined heat and power, Cooling, Data centers, Pressure, Reliability
Proceedings Papers

Comparison of Numerical Modeling to Experimental Data in a Small Data Center Test Cell

Ethan Cruz, Yogendra Joshi, Madhusudan Iyengar, Roger Schmidt
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 953-961, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89306
https://doi.org/10.1115/InterPACK2009-89306
View Paper titled, Comparison of Numerical Modeling to Experimental Data in a Small Data Center Test Cell
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Topics: Computer simulation, Data centers, Computational fluid dynamics, Turbulence, Flow (Dynamics), Temperature, Compacting, Cooling, Design, Heat transfer
Proceedings Papers

Server Rack Rear Door Heat Exchanger and the New ASHRAE Recommended Environmental Guidelines

Roger Schmidt, Madhusudan Iyengar
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 851-862, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89212
https://doi.org/10.1115/InterPACK2009-89212
View Paper titled, Server Rack Rear Door Heat Exchanger and the New ASHRAE Recommended Environmental Guidelines
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Topics: Doors, Heat exchangers, Server racks, Water
Proceedings Papers

Minimum Energy Design for Manufacturability of Air Cooled Heat Sinks

Madhusudan Iyengar, Avram Bar-Cohen
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 319-326, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89093
https://doi.org/10.1115/InterPACK2009-89093
View Paper titled, Minimum Energy Design for Manufacturability of Air Cooled Heat Sinks
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Topics: Design for Manufacturing, Heat sinks, Aluminum, Cooling, Copper, Magnesium (Metal), Manufacturing, Computers, Cycles, Design
Proceedings Papers

Comparison of Numerical Modeling to Experimental Data in a Small, Low Power Data Center Test Cell

Ethan Cruz, Yogendra Joshi, Madhusudan Iyengar, Roger Schmidt
Proc. ASME. IMECE2009, Volume 9: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B and C, 1437-1445, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-12860
https://doi.org/10.1115/IMECE2009-12860
View Paper titled, Comparison of Numerical Modeling to Experimental Data in a Small, Low Power Data Center Test Cell
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Topics: Computer simulation, Data centers, Computational fluid dynamics, Turbulence, Laminar flow, Cooling, Design, Energy dissipation, Flow (Dynamics), Heat transfer
Journal Articles

Data Center Housing High Performance Supercomputer Cluster: Above Floor Thermal Measurements Compared To CFD Analysis

Roger Schmidt, Madhusudan Iyengar, Joe Caricari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021009.
https://doi.org/10.1115/1.4001871
Published Online: June 25, 2010
View Article titled, Data Center Housing High Performance Supercomputer Cluster: Above Floor Thermal Measurements Compared To CFD Analysis
Open the PDF for Data Center Housing High Performance Supercomputer Cluster: Above Floor Thermal Measurements Compared To CFD Analysis in another window
Topics: Computational fluid dynamics, Data centers, Temperature, Cooling, Air flow
Proceedings Papers

Data Center Housing the World’s 3rd Fastest Supercomputer: Above Floor Thermal Measurements Compared to CFD Analysis

Roger Schmidt, Madhusudan Iyengar, Joe Caricari
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 803-818, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33507
https://doi.org/10.1115/IPACK2007-33507
View Paper titled, Data Center Housing the World’s 3rd Fastest Supercomputer: Above Floor Thermal Measurements Compared to CFD Analysis
Open the PDF for Data Center Housing the World’s 3rd Fastest Supercomputer: Above Floor Thermal Measurements Compared to CFD Analysis in another window
Topics: Computational fluid dynamics, Data centers