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1-19 of 19
Kazuhiko Sasagawa
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Proceedings Papers
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 145-152, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0510
Proceedings Papers
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 87-92, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0433
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041012.
Paper No: EP-21-1136
Published Online: January 28, 2022
Proceedings Papers
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-68902
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031107.
Paper No: EP-19-1129
Published Online: April 24, 2020
Proceedings Papers
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6408
Proceedings Papers
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74059
Proceedings Papers
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74092
Journal Articles
Journal:
Journal of Medical Devices
Publisher: ASME
Article Type: Technical Briefs
J. Med. Devices. September 2016, 10(3): 030964.
Paper No: MED-16-1098
Published Online: August 1, 2016
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A015, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48744
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041011.
Paper No: EP-13-1125
Published Online: September 19, 2014
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A003, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73130
Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 487-491, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52169
Proceedings Papers
Numerical Simulation of Threshold Current Density of Electromigration Damage in Cu Interconnect Tree
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 119-124, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89229
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 849-854, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33237
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1147-1152, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73133
Proceedings Papers
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 717-722, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35064
Proceedings Papers
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 723-728, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35065
Proceedings Papers
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 337-343, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39677