Page 1 | Search Results | ASME Digital Collection

1-20 of 22

Sort by

Sort Order Select

Proceedings Papers

Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates

M. Asheghi, M. N. Touzelbaev, K. E. Goodson, Y. K. Leung, S. S. Wong

Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 83-91, November 17–22, 1996

Publisher: American Society of Mechanical Engineers

Paper No: IMECE1996-1340

https://doi.org/10.1115/IMECE1996-1340

View Paper titled, Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates

Topics: Crystals, Silicon, Silicon-on-insulator, Temperature, Thermal conductivity, Semiconductor wafers, Phonons, Transistors, Cantilevers, Electromagnetic scattering

Proceedings Papers

Short-Timescale Thermometry and Reliability Studies of Metal Interconnects in VLSI Circuits

Y. S. Ju, K. E. Goodson

Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 31-36, November 17–22, 1996

Publisher: American Society of Mechanical Engineers

Paper No: IMECE1996-1333

https://doi.org/10.1115/IMECE1996-1333

View Paper titled, Short-Timescale Thermometry and Reliability Studies of Metal Interconnects in VLSI Circuits

Topics: Circuits, Metals, Reliability, Temperature measurement, Resolution (Optics), Reflectance, Temperature, Atomic force microscopy, Calibration, Current density

Proceedings Papers

Thermal Characterization of Anisotropic Polymer Films for Electronic Systems

K. Kurabayashi, M. Asheghi, M. N. Touzelbaev, K. E. Goodson

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 71-81, November 15–20, 1998

Publisher: American Society of Mechanical Engineers

Paper No: IMECE1998-0431

https://doi.org/10.1115/IMECE1998-0431

View Paper titled, Thermal Characterization of Anisotropic Polymer Films for Electronic Systems

Topics: Anisotropy, Electronic systems, Polymer films, Thermal characterization, Micromachining, Temperature, Thermal conductivity, Actuators, Heating, Integrated circuits

Proceedings Papers

Fabrication of High-Index Refractive Microlenses for Near-Field Optics

D. A. Fletcher, K. B. Crozier, G. S. Kino, C. F. Quate, K. E. Goodson

Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 289-294, November 14–19, 1999

Publisher: American Society of Mechanical Engineers

Paper No: IMECE1999-0282

https://doi.org/10.1115/IMECE1999-0282

View Paper titled, Fabrication of High-Index Refractive Microlenses for Near-Field Optics

Topics: Manufacturing, Optics, Resolution (Optics), Lenses (Optics), Silicon, Diffraction, Refractive index, Spectroscopy, Temperature measurement, Wavelength

Proceedings Papers

Thermoelectric Heat Recovery From a Tankless Water Heating System

S. A. LeBlanc, Y. Gao, K. E. Goodson

Proc. ASME. IMECE2008, Volume 8: Energy Systems: Analysis, Thermodynamics and Sustainability; Sustainable Products and Processes, 131-137, October 31–November 6, 2008

Publisher: American Society of Mechanical Engineers

Paper No: IMECE2008-68860

https://doi.org/10.1115/IMECE2008-68860

View Paper titled, Thermoelectric Heat Recovery From a Tankless Water Heating System

Topics: Cogeneration systems, Combined heat and power, Combustion systems, Convection, Cross-flow, Electricity (Physics), Energy generation, Finite volume methods, Flow (Dynamics), Fluids

Proceedings Papers

Atomistic Simulations of G-Type Phonons in Silicon Devices

Sanjiv Sinha, P. K. Schelling, S. R. Phillpot, K. E. Goodson

Proc. ASME. HT-FED2004, Volume 4, 433-439, July 11–15, 2004

Publisher: American Society of Mechanical Engineers

Paper No: HT-FED2004-56429

https://doi.org/10.1115/HT-FED2004-56429

View Paper titled, Atomistic Simulations of G-Type Phonons in Silicon Devices

Topics: Engineering simulation, Phonons, Silicon, Simulation, Density, Electromagnetic scattering, Heat, Radiation scattering, Scattering (Physics), Transistors

Proceedings Papers

Numerical Simulation of Transient Boiling Convection in Microchannels

D. W. Fogg, J. M. Koo, L. Jiang, K. E. Goodson

Proc. ASME. HT2003, Heat Transfer: Volume 2, 459-465, July 21–23, 2003

Publisher: American Society of Mechanical Engineers

Paper No: HT2003-47300

https://doi.org/10.1115/HT2003-47300

View Paper titled, Numerical Simulation of Transient Boiling Convection in Microchannels

Topics: Boiling, Bubbles, Computer simulation, Convection, Heat exchangers, Microchannels, Transients (Dynamics), Two-phase flow

Proceedings Papers

Thermal Conductivity Model for Nearly Pure and Doped Thin Silicon Layers at High Temperatures

M. Asheghi, K. E. Goodson

Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 847-853, November 15–21, 2003

Publisher: American Society of Mechanical Engineers

Paper No: IMECE2003-41623

https://doi.org/10.1115/IMECE2003-41623

View Paper titled, Thermal Conductivity Model for Nearly Pure and Doped Thin Silicon Layers at High Temperatures

Topics: High temperature, Silicon, Thermal conductivity, Silicon-on-insulator, Temperature, Algebra, Heat conduction, Semiconductors (Materials), Simulation, Size effect

Journal Articles

Thermal Properties of Metal-Coated Vertically Aligned Single-Wall Nanotube Arrays

M. A. Panzer, G. Zhang, D. Mann, X. Hu, E. Pop, H. Dai, K. E. Goodson

Publisher: ASME

J. Heat Mass Transfer. May 2008, 130(5): 052401.

https://doi.org/10.1115/1.2885159

Published Online: April 8, 2008

View Article titled, Thermal Properties of Metal-Coated Vertically Aligned Single-Wall Nanotube Arrays

Topics: Carbon nanotubes, Metals, Single-walled nanotubes, Thermal properties, Thermoreflectance

Proceedings Papers

Effect of Phonon Dispersion on Transport Properties of Single-Crystalline Dielectrics

Mehdi Asheghi, Wenjun Liu, K. E. Goodson

Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 113-123, November 13–19, 2004

Publisher: American Society of Mechanical Engineers

Paper No: IMECE2004-62244

https://doi.org/10.1115/IMECE2004-62244

View Paper titled, Effect of Phonon Dispersion on Transport Properties of Single-Crystalline Dielectrics

Topics: Dielectric materials, Phonons, Thermal conductivity, Diamonds, Modeling, Silicon, Approximation, Density, Electromagnetic scattering, Germanium

Proceedings Papers

A Split-Flux Model for Phonon Transport Near Hotspots

S. Sinha, E. Pop, K. E. Goodson

Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 75-85, November 13–19, 2004

Publisher: American Society of Mechanical Engineers

Paper No: IMECE2004-61949

https://doi.org/10.1115/IMECE2004-61949

View Paper titled, A Split-Flux Model for Phonon Transport Near Hotspots

Topics: Phonons, Equilibrium (Physics), Electric fields, Silicon, Approximation, Computation, Cycles, Electromagnetic scattering, Electrons, Geometry

Proceedings Papers

Thermal Conductivity of Ultra Thin Single Crystal Silicon Layers: Part II — Experimental Data and Modeling at High Temperatures

Wenjun Liu, Mehdi Asheghi, K. E. Goodson

Proc. ASME. IMECE2004, Heat Transfer, Volume 2, 181-189, November 13–19, 2004

Publisher: American Society of Mechanical Engineers

Paper No: IMECE2004-62107

https://doi.org/10.1115/IMECE2004-62107

View Paper titled, Thermal Conductivity of Ultra Thin Single Crystal Silicon Layers: Part II — Experimental Data and Modeling at High Temperatures

Topics: Crystals, High temperature, Modeling, Silicon, Thermal conductivity, Silicon-on-insulator, Simulation, Temperature, Transistors, Algebra

Journal Articles

Non-Equilibrium Phonon Distributions in Sub- 100 nm Silicon Transistors

S. Sinha, E. Pop, R. W. Dutton, K. E. Goodson

Publisher: ASME

J. Heat Mass Transfer. July 2006, 128(7): 638–647.

https://doi.org/10.1115/1.2194041

Published Online: December 21, 2005

View Article titled, Non-Equilibrium Phonon Distributions in Sub- 100 nm Silicon Transistors

Topics: Phonons, Silicon, Temperature, Equilibrium (Physics), Electromagnetic scattering, Transistors

Journal Articles

Short-Time-Scale Thermal Mapping of Microdevices Using a Scanning Thermoreflectance Technique

Y. S. Ju, K. E. Goodson

Publisher: ASME

J. Heat Mass Transfer. May 1998, 120(2): 306–313.

https://doi.org/10.1115/1.2824246

Published Online: May 1, 1998

View Article titled, Short-Time-Scale Thermal Mapping of Microdevices Using a Scanning Thermoreflectance Technique

Topics: Thermoreflectance, Transients (Dynamics), Lasers, Resolution (Optics), Silicon-on-insulator, Temperature, Temperature distribution, Temperature measurement, Calibration, Heat conduction

Journal Articles

Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates

M. Asheghi, M. N. Touzelbaev, K. E. Goodson, Y. K. Leung, S. S. Wong

Publisher: ASME

J. Heat Mass Transfer. February 1998, 120(1): 30–36.

https://doi.org/10.1115/1.2830059

Published Online: February 1, 1998

View Article titled, Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates

Topics: Crystals, Heat conduction, Silicon, Silicon-on-insulator, Temperature, Thermal conductivity, Phonons, Semiconductor wafers, Transistors, Cantilevers

Journal Articles

Thermal Conduction in Nonhomogeneous CVD Diamond Layers in Electronic Microstructures

K. E. Goodson

Publisher: ASME

J. Heat Mass Transfer. May 1996, 118(2): 279–286.

https://doi.org/10.1115/1.2825842

Published Online: May 1, 1996

View Article titled, Thermal Conduction in Nonhomogeneous CVD Diamond Layers in Electronic Microstructures

Topics: Heat conduction, Synthetic diamonds

Journal Articles

Prediction and Measurement of Temperature Fields in Silicon-on-Insulator Electronic Circuits

K. E. Goodson, M. I. Flik, L. T. Su, D. A. Antoniadis

Publisher: ASME

J. Heat Mass Transfer. August 1995, 117(3): 574–581.

https://doi.org/10.1115/1.2822616

Published Online: August 1, 1995

View Article titled, Prediction and Measurement of Temperature Fields in Silicon-on-Insulator Electronic Circuits

Topics: Electronic circuits, Heat conduction, Silicon-on-insulator, Temperature measurement, Circuits, Silicon, Temperature, Transistors, Cooling, Design

Journal Articles

Prediction and Measurement of the Thermal Conductivity of Amorphous Dielectric Layers

K. E. Goodson, M. I. Flik, L. T. Su, D. A. Antoniadis

Publisher: ASME

J. Heat Mass Transfer. May 1994, 116(2): 317–324.

https://doi.org/10.1115/1.2911402

Published Online: May 1, 1994

View Article titled, Prediction and Measurement of the Thermal Conductivity of Amorphous Dielectric Layers

Topics: Heat conduction, Thermal conductivity, Silicon, Temperature, Electromagnetic scattering, Radiation scattering, Scattering (Physics), Electronic circuits, Electronic equipment, Oxygen

Journal Articles

Solid Layer Thermal-Conductivity Measurement Techniques

K. E. Goodson, M. I. Flik

Publisher: ASME

Appl. Mech. Rev. March 1994, 47(3): 101–112.

https://doi.org/10.1115/1.3111073

Published Online: March 1, 1994

View Article titled, Solid Layer Thermal-Conductivity Measurement Techniques

Topics: Thermal conductivity, Lasers, Sensors, Electronic circuits, Heating, Optical coatings, Reliability, Temperature measurement, Transparency, Uncertainty analysis

Journal Articles

Electron and Phonon Thermal Conduction in Epitaxial High- T c Superconducting Films

K. E. Goodson, M. I. Flik

Publisher: ASME

J. Heat Mass Transfer. February 1993, 115(1): 17–25.

https://doi.org/10.1115/1.2910646

Published Online: February 1, 1993

View Article titled, Electron and Phonon Thermal Conduction in Epitaxial High- T c Superconducting Films

Topics: Electrons, Heat conduction, Phonons, Thermal conductivity, Electromagnetic scattering, Radiation scattering, Scattering (Physics), Mean free path, Size effect, Temperature

Journal citation

NARROW

Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates

Short-Timescale Thermometry and Reliability Studies of Metal Interconnects in VLSI Circuits

Thermal Characterization of Anisotropic Polymer Films for Electronic Systems

Fabrication of High-Index Refractive Microlenses for Near-Field Optics

Thermoelectric Heat Recovery From a Tankless Water Heating System

Atomistic Simulations of G-Type Phonons in Silicon Devices

Numerical Simulation of Transient Boiling Convection in Microchannels

Thermal Conductivity Model for Nearly Pure and Doped Thin Silicon Layers at High Temperatures

Thermal Properties of Metal-Coated Vertically Aligned Single-Wall Nanotube Arrays

Effect of Phonon Dispersion on Transport Properties of Single-Crystalline Dielectrics

A Split-Flux Model for Phonon Transport Near Hotspots

Thermal Conductivity of Ultra Thin Single Crystal Silicon Layers: Part II — Experimental Data and Modeling at High Temperatures

Non-Equilibrium Phonon Distributions in Sub- 100 nm Silicon Transistors

Short-Time-Scale Thermal Mapping of Microdevices Using a Scanning Thermoreflectance Technique

Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates

Thermal Conduction in Nonhomogeneous CVD Diamond Layers in Electronic Microstructures

Prediction and Measurement of Temperature Fields in Silicon-on-Insulator Electronic Circuits

Prediction and Measurement of the Thermal Conductivity of Amorphous Dielectric Layers

Solid Layer Thermal-Conductivity Measurement Techniques

Electron and Phonon Thermal Conduction in Epitaxial High- T c Superconducting Films

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only