1-20 of 28
Justin A. Weibel
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

An Embedded Microfluidic Approach for Direct Cooling of Copper Windings in Printed Circuit Boards

Daniel A. Moguel, Steven D. Pekarek, Justin A. Weibel
Proc. ASME. HT2024, ASME 2024 Heat Transfer Summer Conference, V001T11A009, July 15–17, 2024
Publisher: American Society of Mechanical Engineers
Paper No: HT2024-131827
https://doi.org/10.1115/HT2024-131827
View Paper titled, An Embedded Microfluidic Approach for Direct Cooling of Copper Windings in Printed Circuit Boards
Open the PDF for An Embedded Microfluidic Approach for Direct Cooling of Copper Windings in Printed Circuit Boards in another window
Topics: Cooling, Copper, Machinery, Microchannels, Microfluidics, Printed circuit boards
Journal Articles

Thermal Performance of a Pump-Assisted Capillary Loop Cooler

Danny J. Lohan, Bhaskarjyoti Sarma, Shailesh N. Joshi, Ercan M. Dede, Anali Soto, Srivathsan Sudhakar, Justin A. Weibel
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2024, 16(9): 091006.
Paper No: TSEA-23-1499
https://doi.org/10.1115/1.4065619
Published Online: June 13, 2024
View Article titled, Thermal Performance of a Pump-Assisted Capillary Loop Cooler
Open the PDF for Thermal Performance of a Pump-Assisted Capillary Loop Cooler in another window
Topics: Design, Flow (Dynamics), Heat, Heat flux, Heat losses, Heat transfer, Pressure drop, Pumps, Temperature, Valves
Journal Articles

A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers

Soumya Bandyopadhyay, Justin A. Weibel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021009.
Paper No: EP-22-1047
https://doi.org/10.1115/1.4055987
Published Online: November 1, 2022
View Article titled, A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers
Open the PDF for A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers in another window
Topics: Heat, Transients (Dynamics), Temperature, Anisotropy
Proceedings Papers

Experimental and Modelling Analysis of a Large-Scale Two-Phase Loop Thermosyphon

Debraliz Isaac Aragones, Chien-Hua Chen, Justin A. Weibel, David M. Warsinger, Richard W. Bonner
Proc. ASME. HT2022, ASME 2022 Heat Transfer Summer Conference, V001T13A001, July 11–13, 2022
Publisher: American Society of Mechanical Engineers
Paper No: HT2022-78822
https://doi.org/10.1115/HT2022-78822
View Paper titled, Experimental and Modelling Analysis of a Large-Scale Two-Phase Loop Thermosyphon
Open the PDF for Experimental and Modelling Analysis of a Large-Scale Two-Phase Loop Thermosyphon in another window
Topics: Air conditioning, Condensers (steam plant), Cooling, Cooling towers, Flow (Dynamics), Glass, Gravity (Force), Heat, Heating, HVAC equipment
Journal Articles

Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation

Sara K. Lyons, Aditya Chandramohan, Justin A. Weibel, Suresh V. Garimella
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041019.
Paper No: EP-21-1161
https://doi.org/10.1115/1.4054263
Published Online: April 22, 2022
View Article titled, Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation
Open the PDF for Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation in another window
Topics: Resolution (Optics), Temperature, Thermography, Deformation, Temperature measurement, Emissivity
Journal Articles

The Effect of Uneven Heating on the Flow Distribution Between Parallel Microchannels Undergoing Boiling

Ankur Miglani, Anali Soto, Justin A. Weibel, Suresh V. Garimella
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041107.
Paper No: EP-21-1114
https://doi.org/10.1115/1.4052532
Published Online: October 14, 2021
View Article titled, The Effect of Uneven Heating on the Flow Distribution Between Parallel Microchannels Undergoing Boiling
Open the PDF for The Effect of Uneven Heating on the Flow Distribution Between Parallel Microchannels Undergoing Boiling in another window
Topics: Flow (Dynamics), Heating, Microchannels, Boiling
Journal Articles

Demonstration of a Compliant Microspring Array as a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules

Jin Cui, Liang Pan, Justin A. Weibel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031114.
Paper No: EP-19-1110
https://doi.org/10.1115/1.4047356
Published Online: June 8, 2020
View Article titled, Demonstration of a Compliant Microspring Array as a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules
Open the PDF for Demonstration of a Compliant Microspring Array as a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules in another window
Topics: Heat sinks, Polymers, Surface roughness, Pressure, Thermal conductivity, Thermal resistance
Proceedings Papers

Demonstration of a Compliant Micro-Spring Array As a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules

Jin Cui, Liang Pan, Justin A. Weibel
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6389
https://doi.org/10.1115/IPACK2019-6389
View Paper titled, Demonstration of a Compliant Micro-Spring Array As a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules
Open the PDF for Demonstration of a Compliant Micro-Spring Array As a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules in another window
Topics: Compression, Contact resistance, Cycles, Fibers, Heat sinks, Microscale devices, Polymers, Pressure, Springs, Surface roughness
Journal Articles

Error Reduction in Infrared Thermography by Multiframe Super-Resolution

Aditya Chandramohan, Sara K. Lyons, Justin A. Weibel, Suresh V. Garimella
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041008.
Paper No: EP-18-1028
https://doi.org/10.1115/1.4041360
Published Online: October 1, 2018
View Article titled, Error Reduction in Infrared Thermography by Multiframe Super-Resolution
Open the PDF for Error Reduction in Infrared Thermography by Multiframe Super-Resolution in another window
Topics: Emissivity, Errors, Resolution (Optics), Temperature, Thermography, Uncertainty
Journal Articles

Special Section on IMECE 2016

Justin A. Weibel, S. Ravi Annapragada
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2017, 139(2): 020301.
Paper No: EP-17-1032
https://doi.org/10.1115/1.4036627
Published Online: June 12, 2017
View Article titled, Special Section on IMECE 2016
Open the PDF for Special Section on IMECE 2016 in another window
Topics: Failure analysis, Flexible electronics, Packaging, Reliability, Semiconductor wafers, Solders, Thermal analysis, Electronic packaging
Journal Articles

Transient Analysis of Nonuniform Heat Input Propagation Through a Heat Sink Base

Srivathsan Sudhakar, Justin A. Weibel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020901.
Paper No: EP-17-1004
https://doi.org/10.1115/1.4036065
Published Online: April 12, 2017
View Article titled, Transient Analysis of Nonuniform Heat Input Propagation Through a Heat Sink Base
Open the PDF for Transient Analysis of Nonuniform Heat Input Propagation Through a Heat Sink Base in another window
Topics: Heat, Temperature, Transients (Dynamics), Coolants, Heat sinks
Proceedings Papers

Transient Analysis of Non-Uniform Heat Input Propagation Through a Heat Sink Base

Srivathsan Sudhakar, Justin A. Weibel
Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A055, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-67639
https://doi.org/10.1115/IMECE2016-67639
View Paper titled, Transient Analysis of Non-Uniform Heat Input Propagation Through a Heat Sink Base
Open the PDF for Transient Analysis of Non-Uniform Heat Input Propagation Through a Heat Sink Base in another window
Topics: Heat, Heat sinks, Transient analysis, Temperature, Coolants, Transients (Dynamics), Architecture, Boundary-value problems, Flow (Dynamics), Geometry
Journal Articles

Numerical Simulation of Evaporating Two-Phase Flow in a High-Aspect-Ratio Microchannel with Bends

Zhenhai Pan, Justin A. Weibel, Suresh V. Garimella
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Photo Gallery
J. Heat Mass Transfer. February 2017, 139(2): 020901.
Paper No: HT-16-1710
https://doi.org/10.1115/1.4035571
Published Online: January 6, 2017
View Article titled, Numerical Simulation of Evaporating Two-Phase Flow in a High-Aspect-Ratio Microchannel with Bends
Open the PDF for Numerical Simulation of Evaporating Two-Phase Flow in a High-Aspect-Ratio Microchannel with Bends in another window
Topics: Computer simulation, Evaporation, Microchannels, Two-phase flow, Flow (Dynamics), Fluids, Lubrication theory, Simulation, Temperature, Vapors
Proceedings Papers

Visualization of Ice Formation Modes and Flow Blockage During Freezing of Water Flowing in a Microchannel

Aakriti Jain, Yonghua Huang, Justin A. Weibel, Suresh V. Garimella
Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T08A015, July 10–14, 2016
Publisher: American Society of Mechanical Engineers
Paper No: HT2016-7243
https://doi.org/10.1115/HT2016-7243
View Paper titled, Visualization of Ice Formation Modes and Flow Blockage During Freezing of Water Flowing in a Microchannel
Open the PDF for Visualization of Ice Formation Modes and Flow Blockage During Freezing of Water Flowing in a Microchannel in another window
Topics: Flow (Dynamics), Freezing, Ice, Microchannels, Visualization, Water, Subcooling, Vacuum, Flow control, Glass
Journal Articles

Quantitative Evaluation of the Dependence of Pool Boiling Heat Transfer Enhancement on Sintered Particle Coating Characteristics

Suchismita Sarangi, Justin A. Weibel, Suresh V. Garimella
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. February 2017, 139(2): 021502.
Paper No: HT-16-1194
https://doi.org/10.1115/1.4034901
Published Online: November 8, 2016
View Article titled, Quantitative Evaluation of the Dependence of Pool Boiling Heat Transfer Enhancement on Sintered Particle Coating Characteristics
Open the PDF for Quantitative Evaluation of the Dependence of Pool Boiling Heat Transfer Enhancement on Sintered Particle Coating Characteristics in another window
Topics: Boiling, Coating processes, Coatings, Particulate matter, Porosity, Heat transfer, Pool boiling, Copper, Heat transfer coefficients
Journal Articles

A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection

Gaurav Patankar, Simone Mancin, Justin A. Weibel, Suresh V. Garimella, Mark A. MacDonald
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010903.
Paper No: EP-15-1083
https://doi.org/10.1115/1.4032345
Published Online: March 10, 2016
View Article titled, A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection
Open the PDF for A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection in another window
Topics: Calibration, Condensers (steam plant), Copper, Flat heat pipes, Heat, Heat losses, Natural convection, Temperature, Thermal resistance, Vapors
Proceedings Papers

Effect of Particle Morphology on Pool Boiling From Surfaces Coated With Sintered Particles

Suchismita Sarangi, Justin A. Weibel, Suresh V. Garimella
Proc. ASME. IMECE2015, Volume 8A: Heat Transfer and Thermal Engineering, V08AT10A030, November 13–19, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2015-50238
https://doi.org/10.1115/IMECE2015-50238
View Paper titled, Effect of Particle Morphology on Pool Boiling From Surfaces Coated With Sintered Particles
Open the PDF for Effect of Particle Morphology on Pool Boiling From Surfaces Coated With Sintered Particles in another window
Topics: Particulate matter, Pool boiling, Coatings, Critical heat flux, Heat transfer coefficients, Boiling, Copper, Heat transfer, Bubbles, Cooling
Proceedings Papers

A Method for Thermal Performance Characterization of Ultra-Thin Vapor Chambers Cooled by Natural Convection

Gaurav Patankar, Simone Mancin, Justin A. Weibel, Suresh V. Garimella, Mark A. MacDonald
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A018, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48175
https://doi.org/10.1115/IPACK2015-48175
View Paper titled, A Method for Thermal Performance Characterization of Ultra-Thin Vapor Chambers Cooled by Natural Convection
Open the PDF for A Method for Thermal Performance Characterization of Ultra-Thin Vapor Chambers Cooled by Natural Convection in another window
Topics: Natural convection, Performance characterization, Vapors, Heat, Flat heat pipes, Computer simulation, Condensers (steam plant), Energy dissipation, Heat losses, Temperature distribution
Proceedings Papers

A Cost-Effective Modeling Approach for Simulating Phase Change and Flow Boiling in Microchannels

Zhenhai Pan, Justin A. Weibel, Suresh V. Garimella
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A023, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48178
https://doi.org/10.1115/IPACK2015-48178
View Paper titled, A Cost-Effective Modeling Approach for Simulating Phase Change and Flow Boiling in Microchannels
Open the PDF for A Cost-Effective Modeling Approach for Simulating Phase Change and Flow Boiling in Microchannels in another window
Topics: Boiling, Flow (Dynamics), Microchannels, Modeling, Vapors, Bubbles, Simulation, Currents, Errors, Evaporation
Proceedings Papers

Quantitative Visualization of Vapor Bubble Growth in Diabatic Vapor-Liquid Microchannel Slug Flow

Todd A. Kingston, Justin A. Weibel, Suresh V. Garimella
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A014, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48177
https://doi.org/10.1115/IPACK2015-48177
View Paper titled, Quantitative Visualization of Vapor Bubble Growth in Diabatic Vapor-Liquid Microchannel Slug Flow
Open the PDF for Quantitative Visualization of Vapor Bubble Growth in Diabatic Vapor-Liquid Microchannel Slug Flow in another window
Topics: Bubbles, Microchannels, Slug flows, Vapors, Visualization, Flow (Dynamics), Heating, Junctions, Boiling, Borosilicate glasses