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John H. L. Pang
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Proceedings Papers

Fatigue Modelling of Semi-Elliptical Surface Cracks in Welded Pipe Geometries

Hsin Jen Hoh, John H. L. Pang, Kin Shun Tsang
Proc. ASME. OMAE2016, Volume 3: Structures, Safety and Reliability, V003T02A029, June 19–24, 2016
Publisher: American Society of Mechanical Engineers
Paper No: OMAE2016-54683
https://doi.org/10.1115/OMAE2016-54683
View Paper titled, Fatigue Modelling of Semi-Elliptical Surface Cracks in Welded Pipe Geometries
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Topics: Fatigue, Modeling, Pipes, Surface cracks, Fracture (Materials), Stress, Geometry, Magnification, Fatigue life, Stress concentration
Proceedings Papers

Fatigue Algorithm for Modeling Many Weld Toe Cracks Propagating at Welded Joints

Kin Shun Tsang, John H. L. Pang, Hsin Jen Hoh
Proc. ASME. OMAE2016, Volume 3: Structures, Safety and Reliability, V003T02A031, June 19–24, 2016
Publisher: American Society of Mechanical Engineers
Paper No: OMAE2016-54735
https://doi.org/10.1115/OMAE2016-54735
View Paper titled, Fatigue Algorithm for Modeling Many Weld Toe Cracks Propagating at Welded Joints
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Topics: Algorithms, Fatigue, Fracture (Materials), Modeling, Welded joints, Fatigue life, Fatigue cracks, Density, Plates (structures), Stress
Proceedings Papers

Strain-Rate Effects on Constitutive Behavior of Sn3.8-Ag0.7-Cu Lead-Free Solder

Kok Ee Tan, John H. L. Pang
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 841-847, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89278
https://doi.org/10.1115/InterPACK2009-89278
View Paper titled, Strain-Rate Effects on Constitutive Behavior of Sn3.8-Ag0.7-Cu Lead-Free Solder
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Topics: Lead-free solders, Solders, Yield stress, Stress-strain curves, Bone, Constitutive equations, Deformation, Elastic moduli, Finite element analysis, Mechanical properties
Journal Articles

Mechanical Design of Electronic Systems

John H. L. Pang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 2010, 132(1): 016501.
https://doi.org/10.1115/1.4000755
Published Online: March 19, 2010
View Article titled, Mechanical Design of Electronic Systems
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Topics: Circuits, Design, Design engineering, Electronic systems, Reliability, Testing, Integrated circuits, Circuit design, Integrated circuit packaging, Life testing
Proceedings Papers

Board-Level Drop Reliability Performance Before and After Thermal Cycling Aging

John H. L. Pang, Luhua Xu
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 173-178, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33738
https://doi.org/10.1115/IPACK2007-33738
View Paper titled, Board-Level Drop Reliability Performance Before and After Thermal Cycling Aging
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Topics: Reliability, Etching, Failure, Failure mechanisms, Fracture (Materials), Solder joints, Sputtering (Irradiation)
Journal Articles

Isothermal Cyclic Bend Fatigue Test Method for Lead-Free Solder Joints

John H. L. Pang, F. X. Che
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 496–503.
https://doi.org/10.1115/1.2809442
Published Online: August 27, 2007
View Article titled, Isothermal Cyclic Bend Fatigue Test Method for Lead-Free Solder Joints
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Topics: Cycles, Density, Displacement, Fatigue, Fatigue testing, Finishes, Finite element analysis, High temperature, Lead-free solders, Manufacturing
Journal Articles

CBGA Solder Joint Reliability Evaluation Based on Elastic-Plastic-Creep Analysis

John H. L. Pang, C. W. Seetoh, Z. P. Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 255–261.
https://doi.org/10.1115/1.1286120
Published Online: September 1, 2000
View Article titled, CBGA Solder Joint Reliability Evaluation Based on Elastic-Plastic-Creep Analysis
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Topics: Creep, Finite element analysis, Solder joints, Temperature, Stress, Solders