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Journal Articles

On Dynamic Analysis and Prevention of Transmission Squawk in Wet Clutches

Junaid Ali, Bharat Natarajan, Jezrah Horen, John Evans, Gregory Shaver, Anil K. Bajaj
Journal: Journal of Vibration and Acoustics
Publisher: ASME
Article Type: Research Papers
J. Vib. Acoust. June 2024, 146(3): 031004.
Paper No: VIB-24-1066
https://doi.org/10.1115/1.4066312
Published Online: September 11, 2024
View Article titled, On Dynamic Analysis and Prevention of Transmission Squawk in Wet Clutches
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Topics: Computer simulation, Disks, Friction, Inertia (Mechanics), Oscillations, Torque, Wireless power transfer, Damping, Engines, Linings (Textiles)
Proceedings Papers

Dwell Sensitive Fatigue Response of Titanium Alloys for Power Plant Applications

Martin R. Bache, W. John Evans
Proc. ASME. GT2001, Volume 4: Manufacturing Materials and Metallurgy; Ceramics; Structures and Dynamics; Controls, Diagnostics and Instrumentation; Education; IGTI Scholar Award, V004T01A010, June 4–7, 2001
Publisher: American Society of Mechanical Engineers
Paper No: 2001-GT-0424
https://doi.org/10.1115/2001-GT-0424
View Paper titled, Dwell Sensitive Fatigue Response of Titanium Alloys for Power Plant Applications
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Topics: Fatigue, Power stations, Titanium alloys, Stress, Creep, Failure, Fatigue testing, Temperature
Proceedings Papers

High Temperature Fatigue/Creep/Environment Interactions in Compressor Alloys

W. John Evans, J. Paul Jones, Martin R. Bache
Proc. ASME. GT2001, Volume 4: Manufacturing Materials and Metallurgy; Ceramics; Structures and Dynamics; Controls, Diagnostics and Instrumentation; Education; IGTI Scholar Award, V004T01A013, June 4–7, 2001
Publisher: American Society of Mechanical Engineers
Paper No: 2001-GT-0477
https://doi.org/10.1115/2001-GT-0477
View Paper titled, High Temperature Fatigue/Creep/Environment Interactions in Compressor Alloys
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Topics: Alloys, Compressors, Creep, Fatigue, High temperature, Gas turbines, Damage, Fracture (Materials), Nickel alloys, Pressure
Proceedings Papers

Thermal Cycling Reliability Predictions for PBGA Assemblies That Include Aging Effects

Mohammad Motalab, Muhannad Mustafa, Jeffrey C. Suhling, Jiawei Zhang, John Evans, Michael J. Bozack, Pradeep Lall
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A008, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73230
https://doi.org/10.1115/IPACK2013-73230
View Paper titled, Thermal Cycling Reliability Predictions for PBGA Assemblies That Include Aging Effects
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Topics: Energy dissipation, Lead-free solders, Reliability, Solders
Proceedings Papers

Thermal Performance of Laminate-to-Aluminum Attachment Materials

John F. Maddox, Roy W. Knight, Sushil H. Bhavnani, John Evans
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 327-333, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89097
https://doi.org/10.1115/InterPACK2009-89097
View Paper titled, Thermal Performance of Laminate-to-Aluminum Attachment Materials
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Topics: Aluminum, Laminates, Adhesives, Cycles, Delamination, Lumber, Hardening (Curing), Temperature, Testing, Thermal conductivity
Journal Articles

Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments

Pradeep Lall, Nokibul Islam, John Evans, Jeff Suhling
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 382–390.
https://doi.org/10.1115/1.2804086
Published Online: March 7, 2007
View Article titled, Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments
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Topics: Ball-Grid-Array packaging, Crack propagation, Cycles, Fracture (Materials), Lumber, Metals, Reliability, Resistors, Solder joints, Printed circuit boards