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Proceedings Papers

Effect of Viscoelasticity on Thermalmechanical Stress in Polymers

Yaoyu Pang, Jie-Hua Zhao, Darvin Edwards
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 379-384, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89169
https://doi.org/10.1115/InterPACK2009-89169
View Paper titled, Effect of Viscoelasticity on Thermalmechanical Stress in Polymers
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Topics: Polymers, Stress, Viscoelasticity, Polymer films, Temperature, Temperature profiles, Thermomechanics
Proceedings Papers

Characterization of Viscoelasticity of Molding Compounds in Time Domain

Seung-Hyun Chae, Jie-Hua Zhao, Darvin R. Edwards, Paul S. Ho
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 435-441, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89388
https://doi.org/10.1115/InterPACK2009-89388
View Paper titled, Characterization of Viscoelasticity of Molding Compounds in Time Domain
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Topics: Molding, Viscoelasticity, Relaxation (Physics), Polymers, Stress, Microelectronic packaging, Stress analysis (Engineering), Temperature
Proceedings Papers

Effect of Dicing Technique on the Fracture Strength of Si Dies With Emphasis on Multi-Modal Failure Distribution

Seung-Hyun Chae, Jie-Hua Zhao, Darvin R. Edwards, Paul S. Ho
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 401-409, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89311
https://doi.org/10.1115/InterPACK2009-89311
View Paper titled, Effect of Dicing Technique on the Fracture Strength of Si Dies With Emphasis on Multi-Modal Failure Distribution
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Topics: Failure, Fracture toughness, Blades, Lasers, Fracture (Materials), Fracture (Process), Failure mechanisms, Fractography
Journal Articles

Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages

Jie-Hua Zhao, Vikas Gupta, Alok Lohia, Darvin Edwards
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011005.
https://doi.org/10.1115/1.4000754
Published Online: March 4, 2010
View Article titled, Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages
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Topics: Constitutive equations, Creep, Density, Fatigue, Finite element methods, Hardening, Lead-free solders, Modeling, Reliability, Semiconductor wafers
Proceedings Papers

Reliability Modeling of Lead Free Solder Joints in Wafer-Level Chip Scale Packages

Jie-Hua Zhao, Vikas Gupta, Alok Lohia, Darvin Edwards
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 351-358, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33123
https://doi.org/10.1115/IPACK2007-33123
View Paper titled, Reliability Modeling of Lead Free Solder Joints in Wafer-Level Chip Scale Packages
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Topics: Lead-free solders, Modeling, Reliability, Semiconductor wafers, Fatigue, Constitutive equations, Creep, Errors, Density, Finite element methods
Proceedings Papers

Design Optimization of Material Properties in a Particle-Filled Composite Material System

Siva P. Gurrum, Jie-Hua Zhao, Darvin R. Edwards
Proc. ASME. IMECE2008, Volume 12: Mechanics of Solids, Structures and Fluids, 317-322, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-66646
https://doi.org/10.1115/IMECE2008-66646
View Paper titled, Design Optimization of Material Properties in a Particle-Filled Composite Material System
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Topics: Composite materials, Design, Materials properties, Optimization, Particulate matter, Finite element methods, Fillers (Materials), Packing (Shipments), Packings (Cushioning), Poisson ratio
Journal Articles

An Optical Method for Measuring the Two-Dimensional Surface Curvatures of Electronic Packages During Thermal Cycling

Yong Du, Jie-Hua Zhao, Paul Ho
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 196–199.
https://doi.org/10.1115/1.1347987
Published Online: March 21, 2000
View Article titled, An Optical Method for Measuring the Two-Dimensional Surface Curvatures of Electronic Packages During Thermal Cycling
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Topics: Electronic packages, Finite element analysis, Laser beams, Temperature, Flip-chip packages, Warping, Thermal expansion, Deformation, Lasers, Packaging