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J. M. Ochterbeck
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Proceedings Papers

Stability Analysis of an Evaporating and/or Condensing Thin Liquid Film

L. H. Chai, X. F. Peng, J. M. Ochterbeck
Proc. ASME. IMECE98, Heat Transfer: Volume 1 — Heat Transfer in Flowing Systems, 325-329, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0610
https://doi.org/10.1115/IMECE1998-0610
View Paper titled, Stability Analysis of an Evaporating and/or Condensing Thin Liquid Film
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Topics: Evaporation, Lubrication theory, Stability, Phase transitions, Surface tension, Accounting, Condensation, Navier-Stokes equations, Transport processes, Waves
Proceedings Papers

A Frozen Startup Limit for Room Temperature Heat Pipes

R. S. Allred, J. M. Ochterbeck
Proc. ASME. IMECE98, Heat Transfer: Volume 3 — Application of Heat Transfer in Equipment, Systems, and Education, 111-120, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0643
https://doi.org/10.1115/IMECE1998-0643
View Paper titled, A Frozen Startup Limit for Room Temperature Heat Pipes
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Topics: Heat pipes, Temperature, Condensers (steam plant), Stainless steel, Copper, Failure, Fluids, Geometry, Liquid metals, Melting
Proceedings Papers

Foundations of Thermal-Fluid Sciences: An Introductory Sophomore Course for Mechanical Engineering Majors

J. L. Gaddis, J. M. Ochterbeck
Proc. ASME. IMECE98, Heat Transfer: Volume 3 — Application of Heat Transfer in Equipment, Systems, and Education, 3-7, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0630
https://doi.org/10.1115/IMECE1998-0630
View Paper titled, Foundations of Thermal-Fluid Sciences: An Introductory Sophomore Course for Mechanical Engineering Majors
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Topics: Mechanical engineering, Thermofluids, Energy conservation, Engineering education, Fluid mechanics, Heat, Momentum, Thermodynamics
Proceedings Papers

Results of Implementing an Introductory Course: Foundations of Thermal-Fluid Sciences

J. M. Ochterbeck, J. L. Gaddis
Proc. ASME. IMECE99, Heat Transfer: Volume 4, 349-354, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-1137
https://doi.org/10.1115/IMECE1999-1137
View Paper titled, Results of Implementing an Introductory Course: Foundations of Thermal-Fluid Sciences
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Topics: Engineering education, Thermofluids, Mechanical engineering, Design, Fluid mechanics, Momentum, Thermodynamics
Proceedings Papers

Response of Loop Heat Pipes to Transient Heat Loads

J. B. Long, J. M. Ochterbeck
Proc. ASME. IMECE99, Heat Transfer: Volume 4, 363-367, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-1139
https://doi.org/10.1115/IMECE1999-1139
View Paper titled, Response of Loop Heat Pipes to Transient Heat Loads
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Topics: Heat, Heat pipes, Stress, Transients (Dynamics), Control systems, Satellites
Proceedings Papers

Numerical Investigation of the Steady State Operation of a Cylindrical Capillary Pumped Loop Evaporator

Y. H. Yan, J. M. Ochterbeck
Proc. ASME. IMECE2000, Heat Transfer: Volume 4, 445-456, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1550
https://doi.org/10.1115/IMECE2000-1550
View Paper titled, Numerical Investigation of the Steady State Operation of a Cylindrical Capillary Pumped Loop Evaporator
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Topics: Steady state, Subcooling, Heat flux, Vapors, Temperature, Thermal conductivity, Computer simulation, Heat, Stress
Proceedings Papers

Investigation of Loop Heat Pipe Startup Using Liquid Core Visualization

B. P. d’Entremont, J. M. Ochterbeck
Proc. ASME. HT2008, Heat Transfer: Volume 2, 387-393, August 10–14, 2008
Publisher: American Society of Mechanical Engineers
Paper No: HT2008-56387
https://doi.org/10.1115/HT2008-56387
View Paper titled, Investigation of Loop Heat Pipe Startup Using Liquid Core Visualization
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Topics: Heat pipes, Visualization, Heat, Buoyancy, Ceramics, Electrical conductivity, Flow (Dynamics), Fluids, Stress, Thermal conductivity
Proceedings Papers

Modeling of Capillary Dryout and Rewetting for Room-Temperature Heat Pipes

P. Brocheny, J. M. Ochterbeck
Proc. ASME. IMECE2005, Heat Transfer, Part A, 13-19, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-80084
https://doi.org/10.1115/IMECE2005-80084
View Paper titled, Modeling of Capillary Dryout and Rewetting for Room-Temperature Heat Pipes
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Topics: Heat pipes, Modeling, Temperature
Journal Articles

Thermal and Mechanical Model for Rigid Cylinder Indenting an Elastic Layer Resting on Rigid Base: Application to Turned Surfaces

Zhe Zhang, Graduate Research Assistant,, E. E. Marotta, Senior Engineer/Scientist/Adjunct Professor—Thermal Development,, J. M. Ochterbeck, Associate Professor,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 186–191.
https://doi.org/10.1115/1.1568126
Published Online: June 10, 2003
View Article titled, Thermal and Mechanical Model for Rigid Cylinder Indenting an Elastic Layer Resting on Rigid Base: Application to Turned Surfaces
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Topics: Boundary-value problems, Contact resistance, Cylinders, Stress, Temperature, Thermal conductivity, Model development, Mechanical properties, Dimensions, Contact mechanics
Journal Articles

Numerical Investigation of the Steady-State Operation of a Cylindrical Capillary Pumped Loop Evaporator

Y. H. Yan, J. M. Ochterbeck
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 251–260.
https://doi.org/10.1115/1.1569509
Published Online: June 10, 2003
View Article titled, Numerical Investigation of the Steady-State Operation of a Cylindrical Capillary Pumped Loop Evaporator
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Topics: Boundary-value problems, Flow (Dynamics), Fluids, Heat, Heat flux, Porous materials, Pressure, Steady state, Subcooling, Temperature
Journal Articles

Effects of Metallic Vapor Deposition Process and the Overall Coating Thickness on Thermal Contact Conductance

A. H. Howard, J. M. Ochterbeck, G. P. Peterson
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. November 1995, 117(4): 828–834.
https://doi.org/10.1115/1.2836298
Published Online: November 1, 1995
View Article titled, Effects of Metallic Vapor Deposition Process and the Overall Coating Thickness on Thermal Contact Conductance
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Topics: Coatings, Contact resistance, Vapor deposition, Aluminum, Electrical conductance, Adhesion, Heat conduction, Oxidation
Journal Articles

Thermal Contact Conductance of Metallic Coated BiCaSrCuO Superconductor/Copper Interfaces at Cryogenic Temperatures

J. M. Ochterbeck, G. P. Peterson, L. S. Fletcher
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 1992, 114(1): 21–29.
https://doi.org/10.1115/1.2911249
Published Online: February 1, 1992
View Article titled, Thermal Contact Conductance of Metallic Coated BiCaSrCuO Superconductor/Copper Interfaces at Cryogenic Temperatures
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Topics: Contact resistance, Copper, Temperature, Coatings, Vapor deposition, Cryogenics, Electrical conductance, Heat conduction, Heat transfer, Microhardness