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Hongseok Noh
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2010, 132(1): 014501.
Published Online: February 25, 2010
Proceedings Papers
Proc. ASME. IMECE2005, Microelectromechanical Systems, 9-17, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-79964