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Proceedings Papers

Analysis of Singular Stress Fields at 3D Piezoelectric Bonded Joints Using a Conservative Integral

Chonlada Luangarpa, Hideo Koguchi
Proc. ASME. IMECE2016, Volume 9: Mechanics of Solids, Structures and Fluids; NDE, Diagnosis, and Prognosis, V009T12A006, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-65482
https://doi.org/10.1115/IMECE2016-65482
View Paper titled, Analysis of Singular Stress Fields at 3D Piezoelectric Bonded Joints Using a Conservative Integral
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Topics: Stress, Finite element methods, Electric potential, Stress singularity
Proceedings Papers

A Conservative Integral for Calculating Intensities of Singularities at 3D Piezoelectric Bonded Joints

Chonlada Luangarpa, Hideo Koguchi
Proc. ASME. IMECE2015, Volume 9: Mechanics of Solids, Structures and Fluids, V009T12A011, November 13–19, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2015-51404
https://doi.org/10.1115/IMECE2015-51404
View Paper titled, A Conservative Integral for Calculating Intensities of Singularities at 3D Piezoelectric Bonded Joints
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Topics: Electric potential, Finite element methods, Stress, Stress singularity
Proceedings Papers

Investigation on Singular Fields at the Vertex of Interface in Piezoelectric Material Joints and its Application

Hideo Koguchi, Tomiya Maekawa, Chonlada Luangarpa
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T03A005, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48381
https://doi.org/10.1115/IPACK2015-48381
View Paper titled, Investigation on Singular Fields at the Vertex of Interface in Piezoelectric Material Joints and its Application
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Topics: Piezoelectric materials, Density, Displacement, Stress, Stress singularity, Compression, Corners (Structural elements)
Proceedings Papers

Evaluation of Intensity of Singularity at 3D Piezoelectric Bonded Joints Using a Conservative Integral

Chonlada Luangarpa, Hideo Koguchi
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A023, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48275
https://doi.org/10.1115/IPACK2015-48275
View Paper titled, Evaluation of Intensity of Singularity at 3D Piezoelectric Bonded Joints Using a Conservative Integral
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Topics: Electric potential, Finite element methods, Stress, Stress singularity
Proceedings Papers

Evaluation of the Strength of Interface for Multi-Layered Materials in Photonic Devices

Hideo Koguchi, Naoki Kimura
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A017, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48105
https://doi.org/10.1115/IPACK2015-48105
View Paper titled, Evaluation of the Strength of Interface for Multi-Layered Materials in Photonic Devices
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Topics: Bonding, Boundary element methods, Cooling, Corners (Structural elements), Delamination, Joining, Numerical analysis, Packaging, Photonic equipment, Polymers
Journal Articles

Stress and Displacement Fields Around Misfit Dislocation in Anisotropic Dissimilar Materials With Interface Stress and Interface Elasticity

Hideo Koguchi, Yuki Hirasawa
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research-Article
J. Appl. Mech. August 2015, 82(8): 081005.
Paper No: JAM-15-1140
https://doi.org/10.1115/1.4030522
Published Online: August 1, 2015
View Article titled, Stress and Displacement Fields Around Misfit Dislocation in Anisotropic Dissimilar Materials With Interface Stress and Interface Elasticity
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Topics: Anisotropy, Dislocations, Displacement, Elasticity, Stress, Boundary-value problems
Proceedings Papers

Boundary Element Analysis of Adhesion Considering van der Waals Force

Hideo Koguchi, Kyohei Seki
Proc. ASME. IMECE2013, Volume 9: Mechanics of Solids, Structures and Fluids, V009T10A105, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-64166
https://doi.org/10.1115/IMECE2013-64166
View Paper titled, Boundary Element Analysis of Adhesion Considering van der Waals Force
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Topics: Adhesion, Boundary element methods, Van der Waals forces, Cylinders, Adhesives, Microelectromechanical systems, Atoms, Boundary-value problems, Equilibrium (Physics), Friction
Journal Articles

Singular Stress Fields in Anisotropic Bonded Joints Considering Interface Stress and Interface Elasticity

Hideo Koguchi, Nubuyasu Suzuki
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research-Article
J. Appl. Mech. July 2014, 81(7): 071003.
Paper No: JAM-14-1029
https://doi.org/10.1115/1.4026840
Published Online: March 6, 2014
View Article titled, Singular Stress Fields in Anisotropic Bonded Joints Considering Interface Stress and Interface Elasticity
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Topics: Stress, Wedges, Boundary-value problems, Elasticity, Stress singularity, Anisotropy
Proceedings Papers

Analysis of 3D-Strain Singular Field Near the Corner of Si Chip Using Digital Image Correlation Method

Hideo Koguchi, Yasuyuki Tsukada, Takahiko Kurahashi
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A006, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73112
https://doi.org/10.1115/IPACK2013-73112
View Paper titled, Analysis of 3D-Strain Singular Field Near the Corner of Si Chip Using Digital Image Correlation Method
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Topics: Corners (Structural elements), Silicon chips, Displacement, Galerkin method, Stress, Bonding, Density, Electronics, Failure, Lasers
Proceedings Papers

Evaluation of Strength in Joints of Silicon and Sapphire Coating Silicon

Hideo Koguchi, Naoki Kimura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A004, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73113
https://doi.org/10.1115/IPACK2013-73113
View Paper titled, Evaluation of Strength in Joints of Silicon and Sapphire Coating Silicon
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Topics: Coating processes, Coatings, Sapphire, Silicon, Delamination, Bonding, Resins, Stress, Cooling, Temperature
Proceedings Papers

Analysis for Stress Singular Fields Near a Wedge Corner in 2D Joints Considering Interface Stress and Interface Elasticity

Hideo Koguchi, Osamu Kato
Proc. ASME. IMECE2012, Volume 8: Mechanics of Solids, Structures and Fluids, 541-550, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-86097
https://doi.org/10.1115/IMECE2012-86097
View Paper titled, Analysis for Stress Singular Fields Near a Wedge Corner in 2D Joints Considering Interface Stress and Interface Elasticity
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Topics: Corners (Structural elements), Elasticity, Stress, Wedges, Anisotropy, Boundary-value problems, Stress singularity, Atomic structure, Molecular dynamics, Solids
Proceedings Papers

Contact Analysis Considering Surface Stress and Surface Elasticity: Increase of Indentation Hardness and Yield Stress

Takao Hayashi, Hideo Koguchi
Proc. ASME. IMECE2012, Volume 8: Mechanics of Solids, Structures and Fluids, 207-214, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-86220
https://doi.org/10.1115/IMECE2012-86220
View Paper titled, Contact Analysis Considering Surface Stress and Surface Elasticity: Increase of Indentation Hardness and Yield Stress
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Topics: Elasticity, Stress, Yield stress, Anisotropy, Elastic half space, Fast Fourier transforms, Gradient methods, Hardening, Molecular dynamics, Nanoindentation
Journal Articles

Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in a Three-Dimensional Joint Structure

Hideo Koguchi, Kazuhisa Hoshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020902.
https://doi.org/10.1115/1.4006139
Published Online: June 11, 2012
View Article titled, Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in a Three-Dimensional Joint Structure
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Topics: Bonding, Boundary element methods, Delamination, Resins, Stress, Stress singularity, Silicon, Joining, Stress concentration
Proceedings Papers

Contact Analysis Using Surface Green’s Functions for Isotropic Materials With Surface Stress and Surface Elasticity

Hideo Koguchi, Naoki Nishi
Proc. ASME. IMECE2010, Volume 10: Micro and Nano Systems, 19-28, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-37814
https://doi.org/10.1115/IMECE2010-37814
View Paper titled, Contact Analysis Using Surface Green’s Functions for Isotropic Materials With Surface Stress and Surface Elasticity
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Topics: Elasticity, Stress, Displacement, Silicon, Anisotropy, Atoms, Eigenvalues, Equilibrium (Physics), Young's modulus
Proceedings Papers

Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in 3D Joint Structure

Hideo Koguchi, Kazuhisa Hoshi
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 149-156, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52065
https://doi.org/10.1115/IPACK2011-52065
View Paper titled, Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in 3D Joint Structure
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Topics: Joining, Resins, Silicon, Bonding, Boundary element methods, Eigenvalues, Stress concentration, Stress singularity, Delamination, Density
Proceedings Papers

Evaluation of the Bonding Strength at the Three-Dimensional Vertex in Silicon-Resin Joints

Hideo Koguchi, Masato Nakajima
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 717-727, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89091
https://doi.org/10.1115/InterPACK2009-89091
View Paper titled, Evaluation of the Bonding Strength at the Three-Dimensional Vertex in Silicon-Resin Joints
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Topics: Bonding, Resins, Silicon, Stress, Thermal stresses, Boundary element methods, Delamination, Materials properties, Stress concentration, Cooling
Proceedings Papers

Thermo-Viscoelastic Analysis for Warpage in CSP With Different Viscoelastic Properties for Several Layers

Hideo Koguchi, Atsushi Ueno
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 13-19, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33591
https://doi.org/10.1115/IPACK2007-33591
View Paper titled, Thermo-Viscoelastic Analysis for Warpage in CSP With Different Viscoelastic Properties for Several Layers
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Topics: Viscoelasticity, Warping, Resins, Manufacturing, Packaging, Temperature, Theoretical analysis, Thermal expansion
Proceedings Papers

Evaluation of Interface Strength at the 3D-Corner in Si-Resin Joint Considering Residual Thermal Stresses

Hideo Koguchi, Takashi Taniguchi
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 863-872, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33592
https://doi.org/10.1115/IPACK2007-33592
View Paper titled, Evaluation of Interface Strength at the 3D-Corner in Si-Resin Joint Considering Residual Thermal Stresses
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Topics: Corners (Structural elements), Resins, Thermal stresses, Stress singularity, Bonding, Boundary element methods, Materials properties, Residual stresses, Cooling, Delamination
Proceedings Papers

A Thermo-Viscoelastic Analysis and Reliability Evaluation for a Single-Sided CSP

Hideo Koguchi, Mirai Ishida, Kazuto Nishida, Tomoaki Kuroishi
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1405-1412, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73096
https://doi.org/10.1115/IPACK2005-73096
View Paper titled, A Thermo-Viscoelastic Analysis and Reliability Evaluation for a Single-Sided CSP
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Topics: Deflection, Reliability, Stress, Viscoelasticity, Relaxation (Physics), Resins, Thermodynamic cycles, Adhesives, Thermal expansion, Thermal stresses
Proceedings Papers

Three-Dimensional Stress Singularity Analysis Around the Solder Joints in Electronic Packaging Using Eigen Analysis

Monchai Prukvilailert, Hideo Koguchi
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 709-716, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35054
https://doi.org/10.1115/IPACK2003-35054
View Paper titled, Three-Dimensional Stress Singularity Analysis Around the Solder Joints in Electronic Packaging Using Eigen Analysis
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Topics: Electronic packaging, Solder joints, Stress singularity, Solders, Mechanical properties, Adhesives, Ceramics, Displacement, Electronic packages, Metals