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Duckjong Kim
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Proceedings Papers

Experimental Study on the Heat Transfer Characteristics of Cryogenic Micro Channel Heat Exchanger

Seok Ho Yoon, Duckjong Kim, Jun Seok Choi
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 21-24, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22223
https://doi.org/10.1115/IHTC14-22223
View Paper titled, Experimental Study on the Heat Transfer Characteristics of Cryogenic Micro Channel Heat Exchanger
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Topics: Heat exchangers, Heat transfer, Microchannels, Methane, Chemical etching, Design, Diffusion bonding (Metals), Fluids, Heat transfer coefficients, Liquefaction
Proceedings Papers

Thermal Optimization of Microchannel Heat Sink With Pin Fin Structures

Duckjong Kim, Sung Jin Kim
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 593-602, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42180
https://doi.org/10.1115/IMECE2003-42180
View Paper titled, Thermal Optimization of Microchannel Heat Sink With Pin Fin Structures
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Topics: Heat sinks, Microchannels, Modeling, Optimization, Porous materials
Journal Articles

Compact Modeling of Fluid Flow and Heat Transfer in Pin Fin Heat Sinks

Duckjong Kim, Sung Jin Kim, Alfonso Ortega
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 342–350.
https://doi.org/10.1115/1.1772415
Published Online: October 6, 2004
View Article titled, Compact Modeling of Fluid Flow and Heat Transfer in Pin Fin Heat Sinks
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Topics: Heat sinks, Modeling, Heat transfer, Pressure drop, Fluid dynamics
Journal Articles

Compact Modeling of Fluid Flow and Heat Transfer in Straight Fin Heat Sinks

Duckjong Kim, Sung Jin Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 247–255.
https://doi.org/10.1115/1.1756149
Published Online: July 8, 2004
View Article titled, Compact Modeling of Fluid Flow and Heat Transfer in Straight Fin Heat Sinks
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Topics: Flow (Dynamics), Fluid dynamics, Heat sinks, Heat transfer, Modeling, Porous materials, Temperature distribution, Permeability, Pressure drop
Journal Articles

Thermal Interaction at the Interface Between a Porous Medium and an Impermeable Wall

Sung Jin Kim, Duckjong Kim
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. June 2001, 123(3): 527–533.
https://doi.org/10.1115/1.1370504
Published Online: January 1, 2001
View Article titled, Thermal Interaction at the Interface Between a Porous Medium and an Impermeable Wall
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Topics: Boundary-value problems, Heat sinks, Heat transfer, Microchannels, Porous materials, Thermal resistance, Heat flux, Flow (Dynamics), Thermal analysis