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Proceedings Papers

Refrigeration Cooled Computers: Application and Review

R. R. Schmidt, M. J. Ellsworth, Jr., R. C. Chu, D. Agonafer
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 277-283, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2274
https://doi.org/10.1115/IMECE2000-2274
View Paper titled, Refrigeration Cooled Computers: Application and Review
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Topics: Computers, Refrigeration, Heat, Stress, Compression, Condensation, Cooling, Low temperature, Maintenance, Reliability
Journal Articles

Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices

Hyoungsoon Lee, Damena D. Agonafer, Yoonjin Won, Farzad Houshmand, Catherine Gorle, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010907.
Paper No: EP-15-1104
https://doi.org/10.1115/1.4032655
Published Online: March 10, 2016
View Article titled, Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices
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Topics: Boiling, Computational fluid dynamics, Flow (Dynamics), Flux (Metallurgy), Gallium nitride, Heat conduction, Heat transfer coefficients, Microchannels, Microcoolers, Simulation
Journal Articles

Analytical Thermal Solution to a Nonuniformly Powered Stack Package With Contact Resistance

S. Ghalambor, D. Agonafer, A. Haji-Sheikh
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. November 2013, 135(11): 111015.
Paper No: HT-12-1332
https://doi.org/10.1115/1.4024623
Published Online: September 23, 2013
View Article titled, Analytical Thermal Solution to a Nonuniformly Powered Stack Package With Contact Resistance
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Topics: Boundary-value problems, Contact resistance, Heat, Steady state, Temperature
Proceedings Papers

Surface Characterization Studies of Thiols as a Blocking Mechanism for Specific Adsorption for Application of Charge Selective Membrane Transport

Damena D. Agonafer, Edward Chainani, Muhammed E. Oruc, Ki Sung Lee, Mark A. Shannon
Proc. ASME. HT2012, Volume 2: Heat Transfer Enhancement for Practical Applications; Fire and Combustion; Multi-Phase Systems; Heat Transfer in Electronic Equipment; Low Temperature Heat Transfer; Computational Heat Transfer, 795-799, July 8–12, 2012
Publisher: American Society of Mechanical Engineers
Paper No: HT2012-58573
https://doi.org/10.1115/HT2012-58573
View Paper titled, Surface Characterization Studies of Thiols as a Blocking Mechanism for Specific Adsorption for Application of Charge Selective Membrane Transport
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Topics: Membranes, Surface characterization, Electrochemical impedance spectroscopy, Electrodes, Electrolytes, Flow (Dynamics), Ions, Leakage, Manufacturing, Platinum
Journal Articles

Study of Insulating Properties of Alkanethiol Self-Assembled Monolayers Formed Under Prolonged Incubation Using Electrochemical Impedance Spectroscopy

Damena D. Agonafer, Edward Chainani, Muhammed E. Oruc, Ki Sung Lee, Mark A. Shannon
Journal: Journal of Nanotechnology in Engineering and Medicine
Publisher: ASME
Article Type: Research-Article
J. Nanotechnol. Eng. Med. August 2012, 3(3): 031006.
Paper No: NANO-12-1058
https://doi.org/10.1115/1.4007698
Published Online: January 18, 2013
View Article titled, Study of Insulating Properties of Alkanethiol Self-Assembled Monolayers Formed Under Prolonged Incubation Using Electrochemical Impedance Spectroscopy
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Topics: Capacitance, Electrochemical impedance spectroscopy, Electrodes, Electrolytes, Self-assembly, Chain, Circuits, Ions, Atomic force microscopy
Proceedings Papers

Study of Alkane Thiols as a Blocking Mechanism for Specific Adsorption for Application of Charge Selective Membrane Transport

Damena D. Agonafer, Edward Chainani, Muhammed E. Oruc, Ki Sung Lee, Mark A. Shannon
Proc. ASME. IMECE2011, Volume 1: Advances in Aerospace Technology; Energy Water Nexus; Globalization of Engineering; Posters, 559-567, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-64678
https://doi.org/10.1115/IMECE2011-64678
View Paper titled, Study of Alkane Thiols as a Blocking Mechanism for Specific Adsorption for Application of Charge Selective Membrane Transport
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Topics: Membranes, Electrodes, Ions, Electrochemical impedance spectroscopy, Electrolytes, Platinum, Water, Capacitors, Flow (Dynamics), Manufacturing
Journal Articles

Three-Dimensional CFD Model of Pressure Drop in µTAS Devices in a Microchannel

Damena D. Agonafer, J. Yeom, M. A. Shannon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031011.
https://doi.org/10.1115/1.4004217
Published Online: September 26, 2011
View Article titled, Three-Dimensional CFD Model of Pressure Drop in µTAS Devices in a Microchannel
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Topics: Computational fluid dynamics, Flow (Dynamics), Microchannels, Pressure drop, Drag (Fluid dynamics), Heat transfer, Reynolds number
Journal Articles

Effect of Variable Heat Transfer Coefficient, Fin Geometry, and Curvature on the Thermal Performance of Extended Surfaces

A. G. Agwu Nnanna, A. Haji-Sheikh ,, ASME Fellow, D. Agonafer,, ASME Fellow
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 456–460.
https://doi.org/10.1115/1.1602711
Published Online: September 17, 2003
View Article titled, Effect of Variable Heat Transfer Coefficient, Fin Geometry, and Curvature on the Thermal Performance of Extended Surfaces
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Topics: Geometry, Heat losses, Heat transfer, Heat transfer coefficients, Temperature distribution, Temperature, Fins
Journal Articles

Solid Model Based Preprocessor to CFD Code for Applications to Electronic Cooling Systems

D. Agonafer, A. Vimba
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 138–143.
https://doi.org/10.1115/1.2792220
Published Online: June 1, 1997
View Article titled, Solid Model Based Preprocessor to CFD Code for Applications to Electronic Cooling Systems
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Topics: Computational fluid dynamics, Computer cooling, Solid models, Computer-aided design, Boundary-value problems, Fluids, Geometry, Materials properties, Mesh generation, Turbulence
Journal Articles

Thermal Model of a PC

Ronald L. Linton, D. Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 134–137.
https://doi.org/10.1115/1.2905501
Published Online: June 1, 1994
View Article titled, Thermal Model of a PC
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Topics: Air flow, Computers, Convection, Cooling, Electronic packages, Flow (Dynamics), Geometry, Modeling, Simulation, Temperature
Journal Articles

Numerical Modeling of Forced Convection Heat Transfer for Modules Mounted on Circuit Boards

D. Agonafer, D. F. Moffatt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1990, 112(4): 333–337.
https://doi.org/10.1115/1.2904386
Published Online: December 1, 1990
View Article titled, Numerical Modeling of Forced Convection Heat Transfer for Modules Mounted on Circuit Boards
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Topics: Computer simulation, Forced convection, Printed circuit boards, Flow (Dynamics), Fluids, Heat transfer, Heat transfer coefficients, Reynolds number, Turbulence