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1-6 of 6
Andrew A. O. Tay
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011006.
Published Online: March 19, 2010
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 117-122, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33991
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1207-1213, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73238
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1529-1534, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73418
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 268–275.
Published Online: July 28, 2004
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 87–93.
Published Online: April 30, 2004