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Keywords: silicon wafer
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Journal Articles
Publisher: ASME
Article Type: Research Papers
ASME J Nondestructive Evaluation. February 2021, 4(1): 011005.
Paper No: NDE-20-1019
Published Online: July 28, 2020
...Peipei Liu; Kiyoon Yi; Hoon Sohn As one of the fastest-growing technologies over the past half century, integrated circuit (IC) packaging is getting smaller and more complex. For example, typical silicon wafers in modern IC packaging have thicknesses ranging from several to tens of micrometers...
