... e-mail:  dilan.ratanayake@louisville.edu e-mail:  cassidy.caid@louisville.edu e-mail:  dan.popa@louisville.edu 31 05 2024 10 10 2024 21 11 2024 assembly hybrid processes modeling process chains process control sensors sintering tooling Additive...

... into the benefits of the ever-reducing size of transistors, it is required to increase the input/output pin count on electronic chips, and thus, minimize the size of chip to board interconnects. Laser sintering of Cu nanoparticle (NP) inks can serve as a promising process for developing these micron sized, 3D...

...P. A. Molian A new three-dimensional (3D) printing process designated as shockwave-induced freeform technique (SWIFT) is explored for fabricating microparts from nanopowders. SWIFT consists of generating shockwaves using a laser beam, applying these shocks to pressure sinter nanoparticles at room...

... is sintered to almost full density. Though able to create high-density parts of excellent dimensional control and surface finish, the MIM process is restricted in the size of part that can be produced, due to gravitational deformation during high-temperature sintering and maximum thickness requirements...