Manufacturing processes used to deposit hard coatings often produce cracks which reside within the coating, at the interface, or in the substrate. These cracks originate from material defects and thermal expansion mismatch. When subjected to stress (from solid body contact) the cracks can act as flaws which initiate and/or propagate subsequent fracture contained entirely in the coating, substrate, interface, or combinations thereof. The finite element method has been used in conjunction with a numerical interface fracture mechanics model to investigate the structural response of coated brittle materials subjected to normal and shear loads (tribo-contact). Residual stresses from depositing TiC onto a WC-TiC-TaC-Co substrate were superimposed with loads that simulate a single point scratch test. Experimental observations of metallographic cross sections, taken through scratched TiC films, were used for verification and guidance in modeling. This study has examined how flaw orientation affects crack propagation through the coating, interface, and substrate. The importance of interface fracture toughness and anisotropy in coating mechanical properties are discussed in light of wear particle formation.
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October 1994
Research Papers
Numerical Simulation of Fracture in Coated Brittle Materials Subjected to Tribo-Contact
David A. ONeil,
David A. ONeil
OSRAM-Sylvania Incorporated, 60 Boston St., Salem, MA 01970
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Steven F. Wayne
Steven F. Wayne
Valenite, 31750 Sherman Rd., Madison Heights, MI 48071
Search for other works by this author on:
David A. ONeil
OSRAM-Sylvania Incorporated, 60 Boston St., Salem, MA 01970
Steven F. Wayne
Valenite, 31750 Sherman Rd., Madison Heights, MI 48071
J. Eng. Mater. Technol. Oct 1994, 116(4): 471-478 (8 pages)
Published Online: October 1, 1994
Article history
Revised:
September 3, 1993
Received:
January 1, 1997
Online:
April 29, 2008
Citation
ONeil, D. A., and Wayne, S. F. (October 1, 1994). "Numerical Simulation of Fracture in Coated Brittle Materials Subjected to Tribo-Contact." ASME. J. Eng. Mater. Technol. October 1994; 116(4): 471–478. https://doi.org/10.1115/1.2904315
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