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Keywords: copper oxide nanoparticles
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Journal Articles
Journal:
Journal of ASTM International
Publisher: ASTM International
Article Type: Research-Article
J. ASTM Int.. May 2012, 9(5): 1–15.
Published Online: July 17, 2012
... to water is predicted. This may be tolerable for the thermal protection of expensive electronic chips, in applications where the chip cost is the dominant factor. KEYWORDS: copper oxide nanoparticles, convective heat transfer, electronic cooling, heat-transfer enhancement, laminar ow, nano uids, pumping...
