Journal of Electronic Packaging

Newest Issue: (December 2019, Volume 141, Issue 4)
Review Article | September 2016
John H. Lau
   doi: 10.1115/1.4034037
research-article | June 2016
Review Article | December 2018
Review Article | March 2018
Review Article | June 2016
Review Article | June 2016
Yu Wang, Zhengwei Li and Jianliang Xiao
   doi: 10.1115/1.4032984
Review Article | June 2017
Review Article | September 2017
Kaysar Rahim and Ahsan Mian
   doi: 10.1115/1.4036239
AMR Podcast
January 23, 2019
Applied Mechanics Reviews Audio Interview: Prof. Kenneth Liechti
44 minutes, 53 seconds

Prof. Ken Liechti of University of Texas at Austin is an award-winning authority on the mechanics of interfaces, describing bonding, unbonding, and crack propagation using innovative experimental techniques with applications to thin film mechanics and graphene transfer. Pipe Major Emeritus of the Silver Thistle Pipes and Drums band out of Austin, Liechti speaks in this interview of his commitment to carrying on the traditions of his Scottish heritage, of building unique devices for uncovering the hidden science of interfacial fracture, and of his experiences articulating the value of mechanics in interdisciplinary collaborations.

About This Journal
Most Accessed Article in 2018
Recent Advances and New Trends in Flip Chip Technology

ASME announces the 2018 Reviewers of the Year

JEP Best Paper Award:

Benchmarking Study on the Thermal Management Landscape for Three-Dimensional ICs: from Back-Side to Volumetric Heat Removal, by Thomas Brunschwiler, Research Staff Member, Arvind Sridhar, Postdoctoral Researcher, Gerd Schlottig, Researcher (IBM Research, Zürich Area, Switzerland), Chin Lee Ong, (Senior Collaborater at EPFL, École Polytechnique Fédérale de Lausanne, Lausanne, Switzerland).


The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.

Editor:  Y. C. Lee,
University of Colorado, Boulder
View Full Editorial Board
Journal Impact Factor:2.21

2017 Journal Citation Reports ® (Clarivate Analytics, 2018)

Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems
ISSN: 1043-7398
eISSN: 1528-9044

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