... air conditioning and air blower operation. Furthermore, the air cooling for both the blade modules and the data center implies a sophisticated air-flow management ( 3 4 5 6 ). microchannel liquid cooling thermal packaging oscillating flow cooling fluid oscillations heat transfer...

... Conductance Electronic Equipment Thermal Packaging Metallic coatings typically offer the greatest enhancement of thermal contact conductance in comparison to other classes of coatings and interstitial materials, as well as offering several other advantages. Metallic...

... Nov 1996 16 Jan 1998 05 12 2007 Computer Codes Jets Modeling and Scaling Thermal Packaging Turbulence Baughn, J., Mesbah, M., and Yan, X., 1993, “Measurements of local heat transfer for an impinging jet on a cylindrical pedestal,” ASME HTD-Vol. 239, pp. 57–62. Baughn...

...: Conduction; Direct-Contact Heat Transfer; Thermal Packaging. Associate Technical Editor: T. Tong. 3.0 Model Development 3.1 Assumptions of the Present Model. 1 Contacting surfaces are circular and macroscopically spherical (see section 3.2). Surfaces are microscopically rough with a Gaussian height...

...; revision received April 11, 1997; Keywords: Conduction; Measurement Techniques; Thermal Packaging. Associate Technical Editor: A. S. Lavine. T\ sinh ji(L x) + T2 sinh fix sinh fjL (1) fj, is a measure of the importance of surface loss relative to bulk conduction, Journal of Heat Transfer AUGUST 1997, Vol...

... applications, thin films Contributed by the Heat Transfer Division for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received by the Heat Transfer Division August 28, 1995; revision received December 20, 1996; Keywords: Conduction, Thermal Packaging, Thermophysical Properties. Associate Technical...

... of Southern California, Los Angeles, CA 90089-1453 Contributed by the Heat Transfer Division for publication in the Journal of Heat Transfer. Manuscript received by the Heat Transfer Division October 4, 1995; revision received October 17, 1996; Keywords: Conduction, Electronic Equipment, Thermal Packaging...

.... The average Nusselt number is determined and correlated in terms of relevant nondimensional parameters for pure forced and mixed convection, respectively. 24 February 1995 29 March 1996 05 12 2007 Flow Visualization Mixed Convection Thermal Packaging Aung, W., 1987, “Mixed...

... is discussed. 11 August 1995 28 March 1996 05 12 2007 Conduction Thermal Packaging Thermophysical Properties Anisimov S. I. , Kapeliovich B. L. , and Perel’man T. L. , 1974 , “ Electron Emission From Metal Surface Exposed to Ultrashort Laser Pulses ,” Soviet...

... OF ME- CHANICAL ENGINEERS. Manuscript received by the Heat Transfer Division May 1994; revision received November 1994. Keywords: Conduction, Electronic Equipment, Thermal Packaging. Associate Technical Editor: L. S. Fletcher. 202 / Vol. 118, FEBRUARY 1996 Transact ions of the ASME Copyright © 1996...

... 05 12 2007 Conduction Electronic Equipment Thermal Packaging Al-Astrabadi, F. R., O’Callaghan, P. W., and Probert, S. D., 1980, “Thermal Resistance of Contacts: Influence of Oxide Films,” AIAA Paper No. 80-1467. Antonetti V. W. , and Yovanovich M. M. , 1985...

...K. C. Chung; H. K. Benson; J. W. Sheffield 01 September 1993 01 August 1994 05 12 2007 Conduction Thermal Packaging Chung, K. C., 1992, “Thermal Contact Conductance of a Phase-Mixed Coating Layer by Transitional Buffering Interface,” Ph.D. Dissertation, Department...

... received by the Heat Transfer Division July 1992; revision received October 1993. Keywords: Conduction, Electronic Equipment, Thermal Packaging. Associate Technical Editor: R. Viskanta. Pressure Distribution. Most of the theoretical and exper- imental studies of bolted joints have been conducted...

... been Contributed by the Heat Transfer Division for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received by the Heat Transfer Division September 1992; revision received August 1993. Keywords: Materials Processing and Man- ufacturing Processes, Porous Media, Thermal Packaging. Associate...

... November 1992 01 August 1993 23 05 2008 Augmentation and Enhancement Conduction Thermal Packaging S. Hingorani Graduate Student. C. J. Fahrner Graduate Student. D. W. Mackowski Assistant Professor. J. S. Gooding Professor and Head. Mem. ASME Mechanical Engineering Department, Auburn...

... Phenomena Thermal Packaging C O . Gersey Graduate Student. I. Mudawar Professor and Director. Boiling and Two-Phase Flow Laboratory, School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907 Orientation Effects on Critical Heat Flux From Discrete, In-Line Heat Sources in a Flow...

..., and nitrogen, were employed as the interstitial gas. The comparison between the theory and the measured values of gap conductance shows excellent agreement. 01 April 1992 01 February 1993 23 05 2008 Conduction Electronic Equipment Thermal Packaging S. Song International Business...

... TRANSFER. Manuscript received by the Heat Transfer Division November 1991; revision received May 1992. Keywords: Conduction, Thermal Packaging. Associate Technical Editor: L. S. Fletcher. Previous investigations have found different values for the load exponent, n, ranging from 0.66 (Malkov, 1970; Mad...

..., Beijing 100084, Peo- ple's Republic of China. Contributed by the Heat Transfer Division of the THE AMERICAN SOCIETY OF MECHANICAL ENGINEERS. Manuscript received by the Heat Transfer Division November 1990; revision received December 1991. Keywords: Natural Convec- tion, Radiation, Thermal Packaging. AA...

... Convection Thermal Packaging A. M. Anderson1 R. J. Moffat Department of Mechanical Engineering, Stanford University, Stanford, CA 94305 Direct Air Cooling of Electronic Components: Reducing Component Temperatures by Controlled Thermal Mixing This paper discusses forced convection heat transfer...