... Conductance Electronic Equipment Thermal Packaging Metallic coatings typically offer the greatest enhancement of thermal contact conductance in comparison to other classes of coatings and interstitial materials, as well as offering several other advantages. Metallic...

... results from liquid-cooling are compared with other results from air-cooling, and Prandtl number scaling between air and water is investigated. 07 Oct 1996 21 Dec 1998 05 12 2007 Direct-Contact Heat Transfer Electronic Equipment Forced Convection Garimella S. V...

...J.-J. Hwang 14 April 1997 22 October 1997 05 12 2007 Conjugate Heat Transfer Electronic Equipment Forced Convection Anderson A. M. , 1994 , “ Decoupling Convective and Conductive Heat Transfer Using the Adiabatic Heat Transfer Coefficient ,” ASME Journal...

.... , and Fukai J. , 1996 b, “ Heat Transfer and Fluid Dynamics During the Collision of a Liquid Droplet on a Substrate—II. Experiments ,” Int. J. Heat Mass Transfer , Vol. 39 , pp. 2791 – 2802 . Electronic Equipment Liquid Metals Sprays/Droplets 20 December 1996 06 November 1997...

... to 100 dB, and the Reynolds number varies from 5500 to 22,000. 06 September 1996 19 May 1997 05 12 2007 Augmentation and Enhancement Electronic Equipment Jets Baughn J. W. , and Shimizu S. , 1989 , “ Heat Transfer Measurements from a Surface With Uniform Heat...

... 1997 05 12 2007 Augmentation and Enhancement Electronic Equipment Finned Surfaces Anand N. K. , Kim S. H. , and Fletcher L. S. , 1992 , “ The Effect of Plate Spacing on Free Convection Between Heated Parallel Plates ,” ASME JOURNAL OF HEAT TRANSFER , Vol. 114 , pp...

...; Keywords: Electronic Equipment; Forced Convection; Jets. Associate Technical Editor: B. W. Webb. T ' < V \ \ \ v measurement mesh u measurement mesh Fig. 1 Schematic diagram of the experimental set up and measurement locations for the axial (v) and radial (u) velocity and turbulence measure- ments face...

... of Southern California, Los Angeles, CA 90089-1453 Contributed by the Heat Transfer Division for publication in the Journal of Heat Transfer. Manuscript received by the Heat Transfer Division October 4, 1995; revision received October 17, 1996; Keywords: Conduction, Electronic Equipment, Thermal Packaging...

...J. C. Watson; N. K. Anand; L. S. Fletcher 11 August 1995 31 May 1996 05 12 2007 Conjugate Heat Transfer Electronic Equipment Mixed Convection Aung W. , and Worku G. , 1987 , “ Mixed Convection in Ducts With Asymmetric Wall Heat Fluxes ,” ASME JOURNAL...

... and subcooling, resulting in a new correlation for spray cooling of small surfaces. 10 January 1995 02 April 1995 05 12 2007 Boiling Electronic Equipment Sprays/Droplets Bolle, L., and Moureau, J. C., 1976, “Spray Cooling of Hot Surfaces: A Description of the Dispersed Phase...

... April 1996 05 12 2007 Electronic Equipment Jets Turbulence Agarwal R. K. , and Bower W. W. , 1982 , “ Navier-Stokes Computations of Turbulent Compressible Two-Dimensional Impinging Jet Field ,” AIAA Journal , Vol. 20 , No. 5 , pp. 577 – 584 . Amano R. S...

... and Enhancement Electronic Equipment Finned Surfaces Anand N. K. , Kim S. H. , and Fletcher L. S. , 1992 , “ The Effect of Plate Spacing on Free Convection Between Heated Parallel Plates ,” ASME JOURNAL OF HEAT TRANSFER , Vol. 114 , pp. 515 – 518 . Bar-Cohen A. , and Rohsenow...

... by the Heat Transfer Division and presented at the Fourth ASME/ JSME Thermal Engineering Joint Conference, Maui, Hawaii, March 19-24, 1995. Manuscript received by the Heat Transfer Division February 1995; revision re- ceived December 1995. Keywords: Conduction, Electronic Equipment. Associate Technical Editor...

... . Touloukian, Y. S., and Ho, C. Y., eds., 1972, Thermophysical Properties of Matter: Vol. 1, Thermal Conductivity of Metallic Solids; Vol. 2, Thermal Conductivity of Nonmetallic Solids , Plenum Press, New York. Conduction Electronic Equipment Thermophysical Properties 01 January 1995 01...

... Transfer Division for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received by the Heat Transfer Division March 1995; revision received November 1995. Keywords: Conjugate Heat Transfer, Electronic Equipment, Forced Convection. Associate Technical Editor: R. Viskanta. The design analysis...

... and will likely remain a promising option in the cooling of electronic equipment. This is due to its simplicity in design and low installation and maintenance ost (Incropera, 1987). In systems employing low heat generating electronic devices uch as microchips, natural convection cool- ing is the most favorable...

... of THE AMERICAN SOCIETY OF ME- CHANICAL ENGINEERS. Manuscript received by the Heat Transfer Division January 1995; revision received April 1995. Keywords: Augmentation and Enhancement, Electronic Equipment, Heat Pipes and Thermosyphons. Associate Technical Edi- tor: R. Viskanta. Journal of Heat Transfer FEBRUARY...

... OF ME- CHANICAL ENGINEERS. Manuscript received by the Heat Transfer Division May 1994; revision received November 1994. Keywords: Conduction, Electronic Equipment, Thermal Packaging. Associate Technical Editor: L. S. Fletcher. 202 / Vol. 118, FEBRUARY 1996 Transact ions of the ASME Copyright © 1996...

... by the Heat Transfer Division January 1995; revision received July 1995. Keywords: Augmentation and Enhancement, Electronic Equipment, Forced Convection. Associate Technical Editor: T. W. Simon. Journal of Heat Transfer FEBRUARY 1996, Vol. 118 / 211 Copyright © 1996 by ASME / /P la te \ ~ H ~ Flow - - ' - - t...

... by the Heat Transfer Division May 1994; revision received January 1995. Keywords: Conduction, Electronic Equipment, Thermal Packing. Associate Technical Editor: L. S. Fletcher. faces using the recently proposed elastoplastic model for sphere- flat contacts and then reduce experimental data (Antonetti, 1983...