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Journal Articles

Application of the Semi-Analytic Complex Variable Method to Computing Sensitivities in Heat Conduction

James Grisham, Ashkan Akbariyeh, Weiya Jin, Brian H. Dennis, Bo P. Wang

Publisher: ASME

J. Heat Mass Transfer. August 2018, 140(8): 082006.

Paper No: HT-17-1109

https://doi.org/10.1115/1.4039541

Published Online: June 29, 2018

View Article titled, Application of the Semi-Analytic Complex Variable Method to Computing Sensitivities in Heat Conduction

Topics: Finite element analysis, Heat conduction, Steady state, Event history analysis, Errors, Finite difference methods, Finite element methods, Stiffness, Computation, Algorithms

Journal Articles

Bipolar Plate Thermal Response to PEM Fuel Cell Stack Compressive Load

N. Fekrazad, T. L. Bergman

Publisher: ASME

J. Heat Mass Transfer. June 2008, 130(6): 064503.

https://doi.org/10.1115/1.2897928

Published Online: May 7, 2008

View Article titled, Bipolar Plate Thermal Response to PEM Fuel Cell Stack Compressive Load

Topics: Fuel cells, Membranes, Plates (structures), Pressure, Proton exchange membrane fuel cells, Reliability, Stress, Temperature, Contact resistance, Durability

Journal Articles

Short-Time-Scale Thermal Mapping of Microdevices Using a Scanning Thermoreflectance Technique

Y. S. Ju, K. E. Goodson

Publisher: ASME

J. Heat Mass Transfer. May 1998, 120(2): 306–313.

https://doi.org/10.1115/1.2824246

Published Online: May 1, 1998

View Article titled, Short-Time-Scale Thermal Mapping of Microdevices Using a Scanning Thermoreflectance Technique

Topics: Thermoreflectance, Transients (Dynamics), Lasers, Resolution (Optics), Silicon-on-insulator, Temperature, Temperature distribution, Temperature measurement, Calibration, Heat conduction

Journal Articles

Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates

M. Asheghi, M. N. Touzelbaev, K. E. Goodson, Y. K. Leung, S. S. Wong

Publisher: ASME

J. Heat Mass Transfer. February 1998, 120(1): 30–36.

https://doi.org/10.1115/1.2830059

Published Online: February 1, 1998

View Article titled, Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates

Topics: Crystals, Heat conduction, Silicon, Silicon-on-insulator, Temperature, Thermal conductivity, Phonons, Semiconductor wafers, Transistors, Cantilevers

Journal Articles

A Maintenance Strategy for Heat Transfer Equipment Subject to Fouling: A Probabilistic Approach

S. M. Zubair, A. K. Sheikh, M. O. Budair, M. A. Badar

Publisher: ASME

J. Heat Mass Transfer. August 1997, 119(3): 575–580.

https://doi.org/10.1115/1.2824144

Published Online: August 1, 1997

View Article titled, A Maintenance Strategy for Heat Transfer Equipment Subject to Fouling: A Probabilistic Approach

Topics: Heat exchangers, Heat transfer, Maintenance, Cycles, Design, Electromagnetic scattering, Modeling, Probability, Reliability, Risk

Journal Articles

Experimental Investigation of the Maximum Heat Transport in Triangular Grooves

H. B. Ma, G. P. Peterson

Publisher: ASME

J. Heat Mass Transfer. August 1996, 118(3): 740–746.

https://doi.org/10.1115/1.2822694

Published Online: August 1, 1996

View Article titled, Experimental Investigation of the Maximum Heat Transport in Triangular Grooves

Topics: Heat, Heat pipes, Fluids, Pressure, Boiling, Flow (Dynamics), Geometry, Heat flux, Methanol, Plates (structures)

Journal Articles

Prediction and Measurement of Temperature Fields in Silicon-on-Insulator Electronic Circuits

K. E. Goodson, M. I. Flik, L. T. Su, D. A. Antoniadis

Publisher: ASME

J. Heat Mass Transfer. August 1995, 117(3): 574–581.

https://doi.org/10.1115/1.2822616

Published Online: August 1, 1995

View Article titled, Prediction and Measurement of Temperature Fields in Silicon-on-Insulator Electronic Circuits

Topics: Electronic circuits, Heat conduction, Silicon-on-insulator, Temperature measurement, Circuits, Silicon, Temperature, Transistors, Cooling, Design

Journal Articles

Prediction and Measurement of the Thermal Conductivity of Amorphous Dielectric Layers

K. E. Goodson, M. I. Flik, L. T. Su, D. A. Antoniadis

Publisher: ASME

J. Heat Mass Transfer. May 1994, 116(2): 317–324.

https://doi.org/10.1115/1.2911402

Published Online: May 1, 1994

View Article titled, Prediction and Measurement of the Thermal Conductivity of Amorphous Dielectric Layers

Topics: Heat conduction, Thermal conductivity, Silicon, Temperature, Electromagnetic scattering, Radiation scattering, Scattering (Physics), Electronic circuits, Electronic equipment, Oxygen

Journal Articles

Transpiration Cooling of the Constrictor Walls of an Electric High-Intensity Arc

J. Heberlein, E. Pfender

Publisher: ASME

J. Heat Mass Transfer. May 1971, 93(2): 146–154.

https://doi.org/10.1115/1.3449776

Published Online: May 1, 1971

View Article titled, Transpiration Cooling of the Constrictor Walls of an Electric High-Intensity Arc

Topics: Transpiration, Porous materials, Plasmas (Ionized gases), Energy budget (Physics), Errors, Flow (Dynamics), Flux (Metallurgy), Heat, High temperature, Pressure drop

Journal Articles

A Calorimeter Apparatus to Measure the Enthalpy Difference of Heavy Water

E. S. Nowak, J. Chan

Publisher: ASME

J. Heat Mass Transfer. May 1969, 91(2): 235–240.

https://doi.org/10.1115/1.3580133

Published Online: May 1, 1969

View Article titled, A Calorimeter Apparatus to Measure the Enthalpy Difference of Heavy Water

Topics: Enthalpy, Water, Instrumentation, Reliability, Temperature

Journal citation

NARROW

Application of the Semi-Analytic Complex Variable Method to Computing Sensitivities in Heat Conduction

Bipolar Plate Thermal Response to PEM Fuel Cell Stack Compressive Load

Short-Time-Scale Thermal Mapping of Microdevices Using a Scanning Thermoreflectance Technique

Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates

A Maintenance Strategy for Heat Transfer Equipment Subject to Fouling: A Probabilistic Approach

Experimental Investigation of the Maximum Heat Transport in Triangular Grooves

Prediction and Measurement of Temperature Fields in Silicon-on-Insulator Electronic Circuits

Prediction and Measurement of the Thermal Conductivity of Amorphous Dielectric Layers

Transpiration Cooling of the Constrictor Walls of an Electric High-Intensity Arc

A Calorimeter Apparatus to Measure the Enthalpy Difference of Heavy Water

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