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Journal Articles

Immersion Cooling of Suspended and Coated Nano-Phosphor Particles for Extending the Limits of Optical Extraction of Light Emitting Diodes

Enes Tamdogan
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. December 2022, 144(12): 122501.
Paper No: HT-22-1080
https://doi.org/10.1115/1.4055568
Published Online: October 6, 2022
View Article titled, Immersion Cooling of Suspended and Coated Nano-Phosphor Particles for Extending the Limits of Optical Extraction of Light Emitting Diodes
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Topics: Cooling, Junctions, Light-emitting diodes, Particulate matter, Phosphors, Temperature, Coating processes, Coatings
Journal Articles

Transient Response Characteristics and Performance Assessment of a Calorimetric Surface Junction Probe Under Impulsive Thermal Loading

Anil Kumar Rout, Niranjan Sahoo, Pankaj Kalita
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. June 2021, 143(6): 062901.
Paper No: HT-20-1113
https://doi.org/10.1115/1.4050822
Published Online: April 23, 2021
View Article titled, Transient Response Characteristics and Performance Assessment of a Calorimetric Surface Junction Probe Under Impulsive Thermal Loading
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Topics: Heat flux, Junctions, Probes, Shock tubes, Temperature, Transients (Dynamics), Lasers, Flow (Dynamics), Heat
Includes: Supplementary data
Journal Articles

Electrowetting Induced Droplet Generation in T-Junctions

A. Merdasi, A. Moosavi
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. May 2021, 143(5): 052103.
Paper No: HT-20-1741
https://doi.org/10.1115/1.4049962
Published Online: March 19, 2021
View Article titled, Electrowetting Induced Droplet Generation in T-Junctions
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Topics: Drops, Junctions, Pressure
Journal Articles

Heat Transfer Characteristics of Nonuniform Flow Around a Circular Cylinder in a T-Junction Duct

Xiaoyu Wang, Di Qi, Tong Li, Mei Lin, Hanbing Ke, Min Zeng, Qiuwang Wang
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. October 2020, 142(10): 104502.
Paper No: HT-19-1688
https://doi.org/10.1115/1.4047508
Published Online: July 17, 2020
View Article titled, Heat Transfer Characteristics of Nonuniform Flow Around a Circular Cylinder in a T-Junction Duct
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Topics: Ducts, Heat transfer, Junctions, Circular cylinders, Cylinders, Separation (Technology), Flow (Dynamics)
Journal Articles

Optimizing the Interfacial Thermal Conductance at Gold–Alkane Junctions From “First Principles”

Jingjie Zhang, Carlos A. Polanco, Avik W. Ghosh
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. September 2018, 140(9): 092405.
Paper No: HT-17-1399
https://doi.org/10.1115/1.4040144
Published Online: May 25, 2018
View Article titled, Optimizing the Interfacial Thermal Conductance at Gold–Alkane Junctions From “First Principles”
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Topics: Bonding, Electrical conductance, Junctions, Thermal conductivity, Chain, Simulation, Phonons, Density, Stiffness, Atoms
Journal Articles

Droplet Formation and Fission in Shear-Thinning/Newtonian Multiphase System Using Bilayer Bifurcating Microchannel

Yong Ren, Kai Seng Koh, Jit Kai Chin, Jing Wang, Conghua Wen, Yuying Yan
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. January 2018, 140(1): 012405.
Paper No: HT-16-1310
https://doi.org/10.1115/1.4037338
Published Online: October 4, 2017
View Article titled, Droplet Formation and Fission in Shear-Thinning/Newtonian Multiphase System Using Bilayer Bifurcating Microchannel
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Topics: Drops, Junctions, Microchannels, Nuclear fission, Shear (Mechanics), Flow (Dynamics), Ceramic matrix composites, Fluids
Journal Articles

Convective Heat Transfer and Contact Resistances Effects on Performance of Conventional and Composite Thermoelectric Devices

B. V. K. Reddy, Matthew Barry, John Li, Minking K. Chyu
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. October 2014, 136(10): 101401.
Paper No: HT-13-1227
https://doi.org/10.1115/1.4028021
Published Online: August 5, 2014
View Article titled, Convective Heat Transfer and Contact Resistances Effects on Performance of Conventional and Composite Thermoelectric Devices
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Topics: Composite materials, Convection, Temperature, Boundary-value problems, Junctions, Heat recovery
Journal Articles

A Method for Computing the Analytical Solution of the Steady-State Heat Equation in Multilayered Media

Ivor Dülk, Tamás Kovácsházy
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. September 2014, 136(9): 091303.
Paper No: HT-13-1416
https://doi.org/10.1115/1.4027838
Published Online: June 27, 2014
View Article titled, A Method for Computing the Analytical Solution of the Steady-State Heat Equation in Multilayered Media
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Topics: Boundary-value problems, Junctions, Steady state, Temperature, Eigenvalues, Computation, Heat
Journal Articles

Heat Dissipation Mechanism at Carbon Nanotube Junctions on Silicon Oxide Substrate

Liang Chen, Satish Kumar
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. May 2014, 136(5): 052401.
Paper No: HT-12-1637
https://doi.org/10.1115/1.4025436
Published Online: March 6, 2014
View Article titled, Heat Dissipation Mechanism at Carbon Nanotube Junctions on Silicon Oxide Substrate
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Topics: Carbon nanotubes, Junctions, Heat, Energy dissipation, Phonons, Temperature
Journal Articles

Dynamic Calibration of a Coaxial Thermocouples for Short Duration Transient Measurements

Rakesh Kumar, Niranjan Sahoo
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. December 2013, 135(12): 124502.
Paper No: HT-12-1258
https://doi.org/10.1115/1.4024593
Published Online: September 27, 2013
View Article titled, Dynamic Calibration of a Coaxial Thermocouples for Short Duration Transient Measurements
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Topics: Calibration, Temperature, Thermocouples, Transients (Dynamics), Lasers, Heat conduction, Heat flux, Heat, Sensors, Junctions
Journal Articles

Equilibrium Molecular Dynamics Study of Lattice Thermal Conductivity/Conductance of Au-SAM-Au Junctions

Tengfei Luo, John R. Lloyd
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. March 2010, 132(3): 032401.
https://doi.org/10.1115/1.4000047
Published Online: December 22, 2009
View Article titled, Equilibrium Molecular Dynamics Study of Lattice Thermal Conductivity/Conductance of Au-SAM-Au Junctions
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Topics: Electrical conductance, Junctions, Simulation, Thermal conductivity, Equilibrium (Physics), Atoms, Chain, Temperature, Thermal energy transport, Vibration
Journal Articles

Development of a Transparent Heater to Measure Surface Temperature Fluctuations Under Spray Cooling Conditions

A. R. Griffin, A. Vijayakumar, R.-H. Chen, K. B. Sundaram, L. C. Chow
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. November 2008, 130(11): 114501.
https://doi.org/10.1115/1.2952761
Published Online: August 28, 2008
View Article titled, Development of a Transparent Heater to Measure Surface Temperature Fluctuations Under Spray Cooling Conditions
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Topics: Bubbles, Cooling, Fluctuations (Physics), Junctions, Pool boiling, Sprays, Temperature, Thermocouples, Thin films, Transparency
Journal Articles

Measurements of Three-Dimensional Flow in Microchannel With Complex Shape by Micro-Digital-Holographic Particle-Tracking Velocimetry

Shin-ichi Satake, Takafumi Anraku, Hiroyuki Kanamori, Tomoaki Kunugi, Kazuho Sato, Tomoyoshi Ito
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. April 2008, 130(4): 042413.
https://doi.org/10.1115/1.2818783
Published Online: March 21, 2008
View Article titled, Measurements of Three-Dimensional Flow in Microchannel With Complex Shape by Micro-Digital-Holographic Particle-Tracking Velocimetry
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Topics: Flow (Dynamics), Microchannels, Particulate matter, Junctions, Holography, Shapes
Journal Articles

Impact of Interface Resistance on Pulsed Thermoelectric Cooling

Y. Sungtaek Ju
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. January 2008, 130(1): 014502.
https://doi.org/10.1115/1.2780186
Published Online: January 28, 2008
View Article titled, Impact of Interface Resistance on Pulsed Thermoelectric Cooling
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Topics: Cooling, Junctions, Temperature, Thermoelectric cooling, Computer simulation, Energy harvesting, Heating, Joules, Steady state, Heat
Journal Articles

Novel Design of a Miniature Loop Heat Pipe Evaporator for Electronic Cooling

Randeep Singh, Aliakbar Akbarzadeh, Chris Dixon, Masataka Mochizuki
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. October 2007, 129(10): 1445–1452.
https://doi.org/10.1115/1.2754945
Published Online: February 9, 2007
View Article titled, Novel Design of a Miniature Loop Heat Pipe Evaporator for Electronic Cooling
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Topics: Computer cooling, Condensers (steam plant), Cooling, Design, Fluids, Heat, Heat pipes, Stress, Temperature, Thermal resistance
Journal Articles

The Compatibility of Thin Films and Nanostructures in Thermoelectric Cooling Systems

Andrew Miner
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. July 2007, 129(7): 805–812.
https://doi.org/10.1115/1.2717941
Published Online: September 11, 2006
View Article titled, The Compatibility of Thin Films and Nanostructures in Thermoelectric Cooling Systems
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Topics: Cooling, Heat, Temperature, Thermal conductivity, Thermoelectric coolers, Thermoelectric cooling, Thin films, Nanowires, Junctions, Systems theory
Journal Articles

Nanoscale Heat Conduction Across Metal-Dielectric Interfaces

Y. “Sungtaek” Ju, Ming-Tsung Hung, Takane Usui
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. September 2006, 128(9): 919–925.
https://doi.org/10.1115/1.2241839
Published Online: March 1, 2006
View Article titled, Nanoscale Heat Conduction Across Metal-Dielectric Interfaces
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Topics: Electrons, Heat conduction, Junctions, Metals, Phonons, Temperature, Thermal resistance, Nanoscale phenomena, Thermal conductivity, Electrodes
Journal Articles

A Multi-Grid Based Multi-Scale Thermal Analysis Approach for Combined Mixed Convection, Conduction, and Radiation Due to Discrete Heating

Lan Tang, Yogendra K. Joshi
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Article
J. Heat Mass Transfer. January 2005, 127(1): 18–26.
https://doi.org/10.1115/1.1852495
Published Online: February 15, 2005
View Article titled, A Multi-Grid Based Multi-Scale Thermal Analysis Approach for Combined Mixed Convection, Conduction, and Radiation Due to Discrete Heating
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Topics: Flow (Dynamics), Forced convection, Heat, Heat conduction, Junctions, Mixed convection, Modeling, Printed circuit boards, Temperature, Thermal analysis
Journal Articles

Integrated Microchannel Cooling for Three-Dimensional Electronic Circuit Architectures

Jae-Mo Koo, Sungjun Im, Linan Jiang, Kenneth E. Goodson
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Article
J. Heat Mass Transfer. January 2005, 127(1): 49–58.
https://doi.org/10.1115/1.1839582
Published Online: February 15, 2005
View Article titled, Integrated Microchannel Cooling for Three-Dimensional Electronic Circuit Architectures
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Topics: Circuits, Convection, Cooling, Heat sinks, Microchannels, Temperature, Thermal resistance, Heat, Boiling, Flow (Dynamics)
Journal Articles

A Dual-Scale Computational Method for Correcting Surface Temperature Measurement Errors

T. C. Tszeng, G. F. Zhou
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 2004, 126(4): 535–539.
https://doi.org/10.1115/1.1773585
Published Online: April 20, 2004
View Article titled, A Dual-Scale Computational Method for Correcting Surface Temperature Measurement Errors
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Topics: Computational methods, Errors, Junctions, Temperature, Thermocouples, Wire, Temperature measurement, Finite element methods, Finite element model