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Journal Articles

Forced Convection Heat Transfer From a Low-Profile Block Simulating a Package of Electronic Equipment

Hajime Nakamura, Tamotsu Igarashi
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. June 2004, 126(3): 463–470.
https://doi.org/10.1115/1.1737776
Published Online: June 16, 2004
View Article titled, Forced Convection Heat Transfer From a Low-Profile Block Simulating a Package of Electronic Equipment
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Topics: Ducts, Forced convection, Heat transfer, Laminar flow, Electronic equipment, Reynolds number, Flow (Dynamics), Heat flux
Journal Articles

Forced Convection in Microstructures for Electronic Equipment Cooling

S. J. Kim, D. Kim
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 1999, 121(3): 639–645.
https://doi.org/10.1115/1.2826027
Published Online: August 1, 1999
View Article titled, Forced Convection in Microstructures for Electronic Equipment Cooling
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Topics: Cooling, Electronic equipment, Forced convection, Heat transfer, Porous materials, Heat sinks, Fluids, Microchannels, Fluid dynamics, Temperature
Journal Articles

Conjugate Heat Transfer for Developing Flow Over Multiple Discrete Thermal Sources Flush-Mounted on the Wall

J.-J. Hwang
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. May 1998, 120(2): 510–514.
https://doi.org/10.1115/1.2824278
Published Online: May 1, 1998
View Article titled, Conjugate Heat Transfer for Developing Flow Over Multiple Discrete Thermal Sources Flush-Mounted on the Wall
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Topics: Flow (Dynamics), Heat transfer, Electronic equipment, Forced convection
Journal Articles

An Investigation of Key Factors Affecting Solder Microdroplet Deposition

B. Xiong, C. M. Megaridis, D. Poulikakos, H. Hoang
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 1998, 120(1): 259–270.
https://doi.org/10.1115/1.2830051
Published Online: February 1, 1998
View Article titled, An Investigation of Key Factors Affecting Solder Microdroplet Deposition
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Topics: Solders, Contact resistance, Modeling, Shapes, Solidification, Drops, Electronic equipment, Electronics, Fluids, Liquid metals
Journal Articles

Impingement Cooling Flow and Heat Transfer Under Acoustic Excitations

C. Gau, W. Y. Sheu, C. H. Shen
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. November 1997, 119(4): 810–817.
https://doi.org/10.1115/1.2824187
Published Online: November 1, 1997
View Article titled, Impingement Cooling Flow and Heat Transfer Under Acoustic Excitations
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Topics: Acoustics, Excitation, Flow (Dynamics), Heat transfer, Impingement cooling, Turbulence, Waves, Pressure, Reynolds number, Shear (Mechanics)
Journal Articles

Optimal Geometric Arrangement of Staggered Vertical Plates in Natural Convection

G. A. Ledezma, A. Bejan
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. November 1997, 119(4): 700–708.
https://doi.org/10.1115/1.2824174
Published Online: November 1, 1997
View Article titled, Optimal Geometric Arrangement of Staggered Vertical Plates in Natural Convection
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Topics: Natural convection, Vertical plates, Manufacturing, Plates (structures), Dimensions, Optimization, Electronic equipment, Fluids, Heat transfer, Rayleigh number
Journal Articles

Flow Field Effects on Heat Transfer in Confined Jet Impingement

J. A. Fitzgerald, S. V. Garimella
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. August 1997, 119(3): 630–632.
https://doi.org/10.1115/1.2824152
Published Online: August 1, 1997
View Article titled, Flow Field Effects on Heat Transfer in Confined Jet Impingement
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Topics: Electronic equipment, Flow (Dynamics), Forced convection, Heat transfer, Jets
Journal Articles

A Note on the Evaluation of Thermal Constriction Resistance for Finite Thickness Gaps

Ashok Kumar Das, Satwindar Singh Sadhal
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. February 1997, 119(1): 177–180.
https://doi.org/10.1115/1.2824084
Published Online: February 1, 1997
View Article titled, A Note on the Evaluation of Thermal Constriction Resistance for Finite Thickness Gaps
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Topics: Electronic equipment, Heat conduction, Packaging
Journal Articles

Mixed Convective Heat Transfer Between a Series of Vertical Parallel Plates With Planar Heat Sources

J. C. Watson, N. K. Anand, L. S. Fletcher
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. November 1996, 118(4): 984–990.
https://doi.org/10.1115/1.2822601
Published Online: November 1, 1996
View Article titled, Mixed Convective Heat Transfer Between a Series of Vertical Parallel Plates With Planar Heat Sources
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Topics: Convection, Electronic equipment, Heat, Heat transfer, Mixed convection, Plates (structures)
Journal Articles

Optimal Spacing Between Pin Fins With Impinging Flow

G. Ledezma, A. M. Morega, A. Bejan
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 1996, 118(3): 570–577.
https://doi.org/10.1115/1.2822670
Published Online: August 1, 1996
View Article titled, Optimal Spacing Between Pin Fins With Impinging Flow
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Topics: Fins, Flow (Dynamics), Heat transfer, Thermal conductivity, Computer simulation, Electronic equipment, Fluids
Journal Articles

Thermal Conductivity of Graphite/Aluminum and Graphite/Copper Composites

M. A. Lambert, L. S. Fletcher
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. May 1996, 118(2): 478–480.
https://doi.org/10.1115/1.2825869
Published Online: May 1, 1996
View Article titled, Thermal Conductivity of Graphite/Aluminum and Graphite/Copper Composites
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Topics: Aluminum, Composite materials, Copper, Electronic equipment, Graphite, Heat conduction, Thermal conductivity
Journal Articles

Enhanced Flat Miniature Axially Grooved Heat Pipe

D. Khrustalev, A. Faghri
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. February 1996, 118(1): 261–264.
https://doi.org/10.1115/1.2824057
Published Online: February 1, 1996
View Article titled, Enhanced Flat Miniature Axially Grooved Heat Pipe
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Topics: Heat pipes, Electronic equipment
Journal Articles

Elastoplastic Constriction Resistance Model for Sphere-Flat Contacts

M. R. Sridhar, M. M. Yovanovich
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. February 1996, 118(1): 202–205.
https://doi.org/10.1115/1.2824037
Published Online: February 1, 1996
View Article titled, Elastoplastic Constriction Resistance Model for Sphere-Flat Contacts
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Topics: Electronic equipment, Heat conduction, Packaging
Journal Articles

Heat (Mass) Transfer in a Serpentine Channel With Right-Angled Turns

J. M. Choi, N. K. Anand, S. C. Lau, R. T. Kukreja
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. February 1996, 118(1): 211–213.
https://doi.org/10.1115/1.2824040
Published Online: February 1, 1996
View Article titled, Heat (Mass) Transfer in a Serpentine Channel With Right-Angled Turns
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Topics: Electronic equipment, Forced convection, Heat
Journal Articles

Elastoplastic Contact Conductance Model for Isotropic Conforming Rough Surfaces and Comparison With Experiments

M. R. Sridhar, M. M. Yovanovich
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 1996, 118(1): 3–9.
https://doi.org/10.1115/1.2824065
Published Online: February 1, 1996
View Article titled, Elastoplastic Contact Conductance Model for Isotropic Conforming Rough Surfaces and Comparison With Experiments
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Topics: Electrical conductance, Surface roughness, Deformation, Contact resistance, Electronic equipment, Heat conduction, Materials properties, Packing (Shipments), Packings (Cushioning)
Journal Articles

Confined and Submerged Liquid Jet Impingement Heat Transfer

S. V. Garimella, R. A. Rice
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. November 1995, 117(4): 871–877.
https://doi.org/10.1115/1.2836304
Published Online: November 1, 1995
View Article titled, Confined and Submerged Liquid Jet Impingement Heat Transfer
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Topics: Heat transfer, Heat, Nozzles, Reynolds number, Electronic equipment, Fluids, Forced convection, Heat flux, Heat transfer coefficients, Jets
Journal Articles

The Optimal Spacing for Cylinders in Crossflow Forced Convection

A. Bejan
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. August 1995, 117(3): 767–770.
https://doi.org/10.1115/1.2822645
Published Online: August 1, 1995
View Article titled, The Optimal Spacing for Cylinders in Crossflow Forced Convection
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Topics: Cylinders, Electronic equipment, Forced convection
Journal Articles

Heat Transfer Enhancement in Narrow Channels Using Two and Three-Dimensional Mixing Devices

S. V. Garimella, D. J. Schlitz
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 1995, 117(3): 590–596.
https://doi.org/10.1115/1.2822618
Published Online: August 1, 1995
View Article titled, Heat Transfer Enhancement in Narrow Channels Using Two and Three-Dimensional Mixing Devices
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Topics: Forced convection, Heat transfer, Heat, Prandtl number, Reynolds number, Ducts, Surface roughness, Coolants, Electronic equipment, Flow (Dynamics)
Journal Articles

Effects of Dissolved Gas Content on Pool Boiling of a Highly Wetting Fluid

S. M. You, T. W. Simon, A. Bar-Cohen, Y. S. Hong
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 1995, 117(3): 687–692.
https://doi.org/10.1115/1.2822631
Published Online: August 1, 1995
View Article titled, Effects of Dissolved Gas Content on Pool Boiling of a Highly Wetting Fluid
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Topics: Boiling, Fluids, Pool boiling, Wetting, Computer cooling, Heat transfer, Cylinders, Electronic equipment, Heat flux, Heating
Journal Articles

Prediction and Measurement of Temperature Fields in Silicon-on-Insulator Electronic Circuits

K. E. Goodson, M. I. Flik, L. T. Su, D. A. Antoniadis
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 1995, 117(3): 574–581.
https://doi.org/10.1115/1.2822616
Published Online: August 1, 1995
View Article titled, Prediction and Measurement of Temperature Fields in Silicon-on-Insulator Electronic Circuits
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Topics: Electronic circuits, Heat conduction, Silicon-on-insulator, Temperature measurement, Circuits, Silicon, Temperature, Transistors, Cooling, Design