Abstract
In this paper, the effect of increasing the number of layers on improving the thermal performance of microchannel heat sinks is studied. In this way, both numerical and analytical methods are utilized. The analytical method is based on the porous medium assumption. Here, the modified Darcy equation and the energy balance equations are used. The method has led to an analytical expression presenting the average dimensionless temperature field in the multilayer microchannel heat sink. The effects of different parameters such as aspect ratio, porosity, channel width, and the solid properties on the thermal resistance are described. The results for single layer and multilayer heat sinks are compared to show the effectiveness of using multilayer microchannels.
1.
Tuckerman
, D. B.
, and Pease
, R. F. W.
, 1981, “High-Performance Heat Sinking for VLSI
,” IEEE Electron Device Lett.
0741-3106, 2
, pp. 126
–129
.2.
Jang
, S. P.
, Kim
, S.
, and Paik
, K. W.
, 2003, “Experimental Investigation of Thermal Characteristics for a Microchannel Heat Sink Subject to an Impinging Jet, Using a Micro Thermal Sensor Array
,” Sens. Actuators, A
0924-4247, 105
, pp. 211
–224
.3.
Chen
, Y.
, Kang
, S.
, Tuh
, W.
, and Hsiao
, T.
, 2004, “Experimental Investigation of Fluid Flow and Heat Transfer in Microchannels
,” Tamkang Journal of Science and Engineering
, 7
(1
), pp. 11
–16
.4.
Qu
, W.
, and Mudawar
, I.
, 2002, “Analysis of Three-Dimensional Heat Transfer in Micro-Channel Heat Sinks
,” Int. J. Heat Mass Transfer
0017-9310, 45
, pp. 3973
–3985
.5.
Saidi
, M. H.
, Salehi
, M.
, and Khiabani
, R. H.
, 2005, “An Approach to the Optimum Design of Two Layered Microchannel Heat Sinks
,” Proceeding of 9th UK heat Transfer Conference
, Manchester, UK
, September 5–6.6.
Zhang
, H. Y.
, Pinjala
, D.
, Womg
, T. N.
, Toh
, K. C.
, and Joshi
, Y. K.
, 2005, “Single Phase Liquid Cooled Microchannel Heat Sink foe Electronic Packages
,” Appl. Therm. Eng.
1359-4311, 25
, pp. 1472
–1487
.7.
Vafai
, K.
, and Zhu
, L.
, 1999, “Analysis of Two Layered Microchannel Heat Sink Concept in Electronic Cooling
,” Int. J. Heat Mass Transfer
0017-9310, 31
, pp. 1176
–1186
.8.
Kulkarni
, P.
, and Das
, D.
, 2005, “Analytical and Numerical Studies on Microscale Heat Sinks for Electronic Applications
,” Appl. Therm. Eng.
1359-4311, 25
, pp. 2432
–2449
.9.
Gamrat
, G.
, Marinet
, M.
, and Asendrych
, D.
, 2005, “Conduction and Entrance Effects on Laminar Liquid Flow and Heat Transfer in Rectangular Microchannels
,” Int. J. Heat Mass Transfer
0017-9310, 48
, pp. 2943
–2954
.10.
Kim
, S. J.
, and Kim
, D.
, 1999, “Forced Convection in Microstructures for Electronic Equipment Cooling
,” ASME J. Heat Transfer
0022-1481, 121
, pp. 639
–645
.11.
Zhao
, C. Y.
, and Lu
, T. J.
, 2002, “Analysis of Microchannel Heat Sinks for Electronics Cooling
,” Int. J. Heat Mass Transfer
0017-9310, 45
, pp. 4857
–4869
.12.
Knight
, R. W.
, Goodling
, J. S.
, and Hall
, D. J.
, 1991, “Optimal Thermal Design of Forced Convection Heat Sinks
,” ASME J. Electron. Packag.
1043-7398, 113
, pp. 313
–321
.13.
Koh
, J. C. Y.
, and Colony
, R.
, 1986, “Heat Transfer of Micro Structures for Integrated Circuits
,” Int. Commun. Heat Mass Transfer
0735-1933, 13
, pp. 89
–98
.14.
Tien
, C. L.
, and Kuo
, S. M.
, 1987, “Analysis of Forced Convection in Microstructures for Electronic Systems Cooling
,” Proc. Int. Symp. Cooling Technology for Electronic Equipment
, Honolulu, HI
, August 31–September 2, pp. 217
–226
.15.
Kaviany
, M.
, 1995, Principles of Heat Transfer in Porous Media
, Springer
, New York.16.
Vafai
, K.
, and Tien
, C. L.
, 1981, “Boundary and Inertia Effects on Flow and Heat Transfer in Porous Media
,” Int. J. Heat Mass Transfer
0017-9310, 24
, pp. 195
–203
.17.
Lee
, D. Y.
, and Vafai
, K.
, 1999, “Analytical Characterization and Conceptual Assessment of Solid and Fluid Temperature Differentials in Porous Media
,” Int. J. Heat Mass Transfer
0017-9310, 42
, pp. 423
–435
.18.
Bejan
, A.
, 1995, Convection Heat Transfer
, 2nd ed., Wiley
, New York.19.
Saidi
, M. H.
, Salehi
, M.
, and Khiabani
, R. H.
, 2005, “Performance of Micro Channel Heat Sink Used in Integrated Micro Cooling Devices
,” Proceeding of IIR International Conferences: Thermophysical Properties and Transfer Processes of Refrigerants
, Vicenza, Italy
, March 18–21.20.
Wei
, X.
, and Joshi
, Y.
, 2004, “Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronic Components
,” J. Electron. Packag.
1043-7398, 126
, pp. 60
–66
.Copyright © 2007
by American
Society of Mechanical Engineers
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