The present study addresses the effects of thermocouples on the measured temperature when such thermocouples are mounted directly on the surface of the object. A surface-mounted thermocouple is a very convenient way of measuring the surface temperature. However, the heat conduction into/from the thermocouple wire changes the local temperature at the thermocouple junctions along with the immediate vicinity of the thermocouple. As a consequence, the emf appearing at the thermocouple terminals does not correspond to the actual surface temperature. In this paper, we first discuss the general characteristics of the enhanced heating/cooling due to the so-called “fin effects” associated with the surface-mounted thermocouples. An embedded computational model is then developed so that the model can be used in conjunction with a regular FEM model for the multidimensional calculation of the heating or cooling of a part. The embedded computational model is shown to offer very accurate calculation of the temperature at the junction of thermocouple wire. The developed computational model is further used in the inverse heat transfer calculation for a Jominy end quench experiment.
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A Study of Fin Effects in the Measurement of Temperature Using Surface-Mounted Thermocouples
T. C. Tszeng,
T. C. Tszeng
Thermal Processing Technology Center, Department of Mechanical, Materials and Aerospace Engineering, Illinois Institute of Technology, Chicago, IL 60616
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V. Saraf
V. Saraf
Thermal Processing Technology Center, Department of Mechanical, Materials and Aerospace Engineering, Illinois Institute of Technology, Chicago, IL 60616
Search for other works by this author on:
T. C. Tszeng
Thermal Processing Technology Center, Department of Mechanical, Materials and Aerospace Engineering, Illinois Institute of Technology, Chicago, IL 60616
V. Saraf
Thermal Processing Technology Center, Department of Mechanical, Materials and Aerospace Engineering, Illinois Institute of Technology, Chicago, IL 60616
Contributed by the Heat Transfer Division for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received by the Heat Transfer Division January 15, 2002; revision received April 22, 2003. Associate Editor: A. F. Emery.
J. Heat Transfer. Oct 2003, 125(5): 926-935 (10 pages)
Published Online: September 23, 2003
Article history
Received:
January 15, 2002
Revised:
April 22, 2003
Online:
September 23, 2003
Citation
Tszeng , T. C., and Saraf, V. (September 23, 2003). "A Study of Fin Effects in the Measurement of Temperature Using Surface-Mounted Thermocouples ." ASME. J. Heat Transfer. October 2003; 125(5): 926–935. https://doi.org/10.1115/1.1597622
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