Issue Section:
Technical Briefs
1.
Anderson
A. M.
1994
, “Decoupling Convective and Conductive Heat Transfer Using the Adiabatic Heat Transfer Coefficient
,” ASME Journal of Electronic Packaging
, Vol. 116
, pp. 310
–316
.2.
Choi
C. Y.
Kim
S. J.
Ortega
A.
1994
, “Effects of Substrate Conductivity on Convection of Electronic Components
,” ASME Journal of Electronic Packaging
, Vol. 116
, pp. 198
–205
.3.
Cole
K. D.
1997
, “Conjugate Heat Transfer From a Small Heated Strip
,” Int. J. Heat Mass Transfer
, Vol. 40
, pp. 2709
–2719
.4.
Culham, J. R., Lee, S., and Yovanovich, M. M., 1991, “The Effect of Common Design Parameters on the Thermal Performance of Microelectronic Equipment: Part II—Forced Convection,” ASME Heat Transfer in Electronic Equipment, ASME HTD-Vol. 171, pp. 55–62.
5.
Hwang
J. J.
Liou
T. M.
1995
, “Heat Transfer in a Rectangular Channel With Perforated Turbulence Promoters Using Holographic Interferometry Measurement
,” Int. J. Heat Mass Transfer
, Vol. 38
, pp. 3197
–3207
.6.
Hwang
J. J.
1997
, “Turbulent Heat Transfer and Fluid Flow in a Porous-Baffled Channel
,” AIAA J. Thermophysics and Heat Transfer
, Vol. 11
, pp. 429
–436
.7.
Incropera
P. F.
Herby
J. S.
Moffatt
D. F.
Ramadhyani
S.
1986
, “Convective Heat Transfer From Discrete Heat Sources in a Rectangular Channel
,” Int. J. Heat Mass Transfer
, Vol. 29
, pp. 1051
–1058
.8.
Jaluria
Y.
1982
, “Buoyancy-Induced Flow Due to Isolated Thermal Sources on a Vertical Surface
,” ASME JOURNAL OF HEAT TRANSFER
, Vol. 104
, pp. 223
–227
.9.
Jaluria
Y.
1985
a, “Interaction of Nature Convection Wakes Arising From Thermal Sources on a Vertical Surface
,” ASME JOURNAL OF HEAT TRANSFER
, Vol. 107
, pp. 883
–892
.10.
Jaluria, Y., 1985b, “Natural Convection Cooling of Electronic Equipment,” Natural Convection, Fundamentals and Applications, Kakac, S., Aung, W., and Viskanta, R., eds., pp. 961–987.
11.
Kline, S. J., and McClintock, F. A., 1953, “Describing Uncertainties in Single-Sample Experiments,” Mechanical Engineering, Jan., pp. 3–8.
12.
Kraus, A. D., and Bar-Cohan, A., 1983, Thermal Analysis and Control of Electronic Equipment, Hemisphere, New York.
13.
McEntire
A. B.
Webb
B. W.
1990
, “Local Forced Convective Heat Transfer From Protruding and Flush-Mounted Two-Dimensional Discrete Heat Source
,” Int. J. Heat Mass Transfer
, Vol. 33
, pp. 1521
–1533
.14.
Park
K. A.
Bergles
A. E.
1987
, “Natural Convection Heat Transfer Characteristics of Simulated Microelectronic Chips
,” ASME JOURNAL OF HEAT TRANSFER
, Vol. 109
, pp. 90
–96
.15.
Ramadhyani
S.
Moffatt
D. F.
Incropera
P. F.
1985
, “Conjugated Heat Transfer From Small Isothermal Heat Sources Embedded in a Large Substrate
,” Int. J. Heat Mass Transfer
, Vol. 28
, pp. 1945
–1952
.16.
Sugavanam
R.
Ortega
A.
Choi
C. Y.
1995
, “A Numerical Investigation of Conjugate Heat Transfer From a Flush Heat Source on a Conductive Board in Laminar Channel Flow
,” Int. J. Heat Mass Transfer
, Vol. 38
, pp. 2969
–2984
.17.
Tewari
S. S.
Jaluria
Y.
1990
, “Mixed Convection Heat Transfer From Thermal Sources Mounted on Horizontal and Vertical Surfaces
,” ASME JOURNAL OF HEAT TRANSFER
, Vol. 112
, pp. 975
–987
.
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