Experiments have been conducted to quantify the interfacial thermal conductance between molten copper and a cold metallic substrate, and in particular to investigate the heat transfer variation as the initial liquid/solid contact becomes a solid/solid contact after nucleation. A high heat transfer coefficient during the earlier liquid cooling phase and a lower heat transfer coefficient during the subsequent solid splat cooling phase were estimated through matching of model calculations and measured temperature history of the sample. The dynamic variations in the interfacial heat transfer resulting from the solidification process were quantified for splat cooling and were found to be affected by the melt superheat, the substrate material, and the substrate surface finish.
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Experimental Investigation of Interfacial Thermal Conductance for Molten Metal Solidification on a Substrate
G.-X. Wang,
G.-X. Wang
Department of Mechanical and Environmental Engineering, University of California, Santa Barbara, CA 93106
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E. F. Matthys
E. F. Matthys
Department of Mechanical and Environmental Engineering, University of California, Santa Barbara, CA 93106
Search for other works by this author on:
G.-X. Wang
Department of Mechanical and Environmental Engineering, University of California, Santa Barbara, CA 93106
E. F. Matthys
Department of Mechanical and Environmental Engineering, University of California, Santa Barbara, CA 93106
J. Heat Transfer. Feb 1996, 118(1): 157-163 (7 pages)
Published Online: February 1, 1996
Article history
Received:
April 1, 1995
Revised:
October 1, 1995
Online:
December 5, 2007
Citation
Wang, G., and Matthys, E. F. (February 1, 1996). "Experimental Investigation of Interfacial Thermal Conductance for Molten Metal Solidification on a Substrate." ASME. J. Heat Transfer. February 1996; 118(1): 157–163. https://doi.org/10.1115/1.2824029
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