The flow structure and average heat transfer characteristics of single, isolated three-dimensional protrusions in a flow channel have been investigated experimentally. This configuration has relevance in the electronics industry. The study was designed to identify the influence of the three-dimensional flow around a heated protrusion on its average heat transfer. Heated protrusions varying in width between 0.12 and 1.0 channel widths for a fixed protrusion height and streamwise length were studied in the channel Reynolds number range 500≤Re≤10,000. The channel wall spacing was also varied parametrically between 1.25 and 2.5 streamwise protrusion lengths. The study included both average heat transfer measurements, and detailed local velocity and turbulent flow structure measurements made using laser-Doppler velocimetry. The experimental results show that the Nusselt number increases with both decreasing channel wall spacing and decreasing protrusion width. The increase in heat transfer with decreasing wall spacing is explained by the accelerated flow due to the protrusion-obstructed channel. Increasing Nusselt number with decreasing protrusion width is a result of increased three-dimensional flow and associated turbulent mixing. Both of these flow-related phenomena are illustrated with local mean velocity and turbulence intensity measurements. The presence of recirculation zones both upstream and downstream of the module is revealed. The flow acceleration around the heated protrusions, and three dimensionality of the flow and heat transfer are competing mechanisms; the higher heat transfer due to flow acceleration around the protrusions for larger protrusions goes counter to the trend for higher heat transfer due to increased three-dimensional flow and transport for smaller protrusions. A Nusselt number correlation is developed as a function of channel Reynolds number and protrusion and channel geometric parameters, which describes the tradeoffs discussed.
Skip Nav Destination
Article navigation
Research Papers
Heat Transfer and Turbulent Flow Characteristics of Isolated Three-Dimensional Protrusions in Channels
P. T. Roeller,
P. T. Roeller
Heat Transfer Laboratory, Department of Mechanical Engineering, Brigham Young University, Provo, UT 84602
Search for other works by this author on:
J. Stevens,
J. Stevens
Heat Transfer Laboratory, Department of Mechanical Engineering, Brigham Young University, Provo, UT 84602
Search for other works by this author on:
B. W. Webb
B. W. Webb
Heat Transfer Laboratory, Department of Mechanical Engineering, Brigham Young University, Provo, UT 84602
Search for other works by this author on:
P. T. Roeller
Heat Transfer Laboratory, Department of Mechanical Engineering, Brigham Young University, Provo, UT 84602
J. Stevens
Heat Transfer Laboratory, Department of Mechanical Engineering, Brigham Young University, Provo, UT 84602
B. W. Webb
Heat Transfer Laboratory, Department of Mechanical Engineering, Brigham Young University, Provo, UT 84602
J. Heat Transfer. Aug 1991, 113(3): 597-603 (7 pages)
Published Online: August 1, 1991
Article history
Received:
July 16, 1990
Revised:
November 28, 1990
Online:
May 23, 2008
Citation
Roeller, P. T., Stevens, J., and Webb, B. W. (August 1, 1991). "Heat Transfer and Turbulent Flow Characteristics of Isolated Three-Dimensional Protrusions in Channels." ASME. J. Heat Transfer. August 1991; 113(3): 597–603. https://doi.org/10.1115/1.2910607
Download citation file:
Get Email Alerts
Cited By
Related Articles
A Correlation for Heat Transfer and Wake Effect in the Entrance Region of an In-Line Array of Rectangular Blocks Simulating Electronic Components
J. Heat Transfer (February,1995)
Heat Transfer Enhancement in Narrow Channels Using Two and Three-Dimensional Mixing Devices
J. Heat Transfer (August,1995)
Visualization and Analysis of Flow in an Offset Channel
J. Heat Transfer (November,1992)
Confined and Submerged Liquid Jet Impingement Heat Transfer
J. Heat Transfer (November,1995)
Related Proceedings Papers
Related Chapters
Introduction
Thermal Management of Microelectronic Equipment
Liquid Cooled Microelectronic Equipment
Thermal Design of Liquid Cooled Microelectronic Equipment
Fans and Air Handling Systems
Thermal Management of Telecommunications Equipment