... was found to describe the observed behavior with much higher fidelity than the common Johnson–Cook model. 14 09 2010 13 05 2011 23 09 2011 deformation eutectic alloys lead alloys solders tensile strength tin alloys Stephens and Frear [( 31 )] studied the creep behavior...

... ball grid arrays copper alloys lead alloys printed circuits reflow soldering reliability silver alloys solders thermal stress cracking tin alloys backward compatible mixed solder lead-free thermal cycling A large number of high reliability microelectronics applications...

... testing silver alloys solders tin alloys lead-free solder low-cycle fatigue strain rate effect creep strain stress relaxation cyclic loading Solder joints are subjected to cyclic inelastic deformation due to electronic parts having different coefficients of thermal expansion. Since...

... strength copper alloys creep elastoplasticity electronics packaging fatigue mechanical testing silver alloys solders tensile strength tin alloys lead-free solder alloy elastic-plastic-creep constitutive model time-independent strain time-dependent strain cyclic plasticity stress...

... activation energy eutectic alloys interface phenomena lead alloys silver alloys solders surface roughness tin alloys wetting zinc alloys 01 02 2010 03 10 2010 19 11 2010 19 11 2010 Arrhenius plot for the spreading of the Sn–37Pb solder 2010 American...

... underfilled with one of five different materials after soldering with SnCu, SAC305, and SnPb. adhesion copper alloys flip-chip devices lead alloys reliability solders stress analysis thermal expansion thermal shock tin alloys So far, flip chip assembly is exempt from the requirement...

... flip-chip devices gold alloys metallisation nickel alloys silver alloys solders substrates tin alloys electromigration reliability flip-chip solder joint substrate pad metallization An earlier version of this paper was published in Proceedings of 56th Electronic Components...

... elastoplasticity silver alloys solders stress-strain relations tensile testing tin alloys viscoplasticity lead-free solder alloy elasto-plastic-creep constitutive model time-independent deformation time-dependent deformation One significant problem in surface mounting technology...

... estimates of the actual fatigue curves. 29 10 2007 05 12 2008 25 02 2009 durability fatigue integrated circuit interconnections lead alloys solders tin alloys vibrations Vibration loading is commonly encountered during the service life of electronic products...

... and SnAg solder is reliable. electroplating metallurgy scanning electron microscopy shear strength silver alloys solders tin alloys voids (solid) X-ray chemical analysis SnAg solder bump reliability Flip-chip technology has been applied in interconnecting a large number...

... arrays copper alloys cracks creep testing fatigue testing finite element analysis integrated circuit interconnections integrated circuit packaging integrated circuit reliability life testing silver alloys solders stress-strain relations tin alloys As technology progresses, both...

... 2007 17 04 2008 11 02 2009 annealing copper alloys grain boundary diffusion hardness hardness testing high-temperature effects silver alloys solders thermal diffusion tin alloys thermomigration lead-free hardness elastic modulus grain coarsening...

... enhance the electromigration reliability. 01 08 2007 07 01 2008 13 11 2008 copper alloys electromigration flip-chip devices gold nickel reliability silver alloys solders tin alloys titanium vanadium electromigration flip-chip solder joint reliability Sn–Ag–Cu Cu...

... impeded by a bigger one. 04 06 2007 03 12 2007 01 08 2008 chemical interdiffusion copper copper alloys current density dissolving electromigration finite element analysis flip-chip devices integrated circuit packaging silver alloys soldering solders tin alloys voids...

... 2008 29 07 2008 creep crystal microstructure silver alloys solders tin alloys constitutive model creep SnAg lead-free solder Lead-free solders such as SnAg and SnAgCu are used extensively as replacements of SnPb solders in microelectronics packaging. It has been found...

... circuit interconnections integrated circuit modelling integrated circuit packaging integrated circuit reliability life testing silver alloys solders tin alloys lead-free solder acceleration factors cohesive zone modeling Solder joint fatigue has been the subject of a great deal...

... circuits silver alloys solders tin alloys reliability flip chip thermal cycling micro-via Thermal excursions for electronic devices imparted during their operation can change the microstructure of their solder joints and cause the stress concentration, resulting in deformation and crack...

...-strain relations tin alloys As technology progresses, more consumer and military products are making use of electronics to augment or enhance performance, and thus the use of electronics is increasing worldwide. Concurrently, there is an increased awareness to limit the use of “toxic” materials...

...., Society of Automotive Engineers , Warrendale, PA. Nelson , D. V. , 2005 , private communication. 13 10 2006 19 07 2007 31 01 2008 copper alloys creep fatigue cracks finite element analysis plasticity silver alloys solders tin alloys fatigue prediction...

... for VQFN with Sn–Ag–Cu solder joint under cyclic bending load at both 25°C and 125°C. 23 01 2007 27 08 2007 bending strength copper alloys electronics packaging fatigue testing finite element analysis silver alloys soldering solders stress-strain relations surface finishing tin...