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Keywords: through-hole technology
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041006.
Paper No: EP-21-1075
Published Online: November 22, 2021
... SAC305 laser soldering finite volume method through-hole technology Soldering is a crucial fusing process in electronic manufacturing. As demand of electronic products increased, the conventional process of soldering becomes incapable to deliver manufacturing rate with consistent quality...
